Antenna Module

Patent metadata

Field	Value
Publication number	US-10547119-B2
Application number	US-201815972905-A
Country	US
Kind code	B2
Filing date	May 7, 2018
Priority date	Dec 6, 2017
Publication date	Jan 28, 2020
Grant date	Jan 28, 2020

Abstract

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.

First claim

What is claimed is:

1. An antenna module comprising:
a connection member including at least one wiring layer and at least one insulating layer;
an integrated circuit (IC) package disposed on a first surface of the connection member; and
an antenna package including a plurality of antenna members configured to transmit and receive a radio frequency (RF) signal, a plurality of feed vias in which one end of each thereof is electrically connected to each of the plurality of antenna members and the other end of each of thereof is electrically connected to a corresponding wire of the at least one wiring layer of the connection member, and a dielectric layer disposed to surround side surfaces of each of the plurality of feed vias and having a height greater than that of the at least one insulating layer of the connection member, and disposed on a second surface of the connection member,
wherein the IC package includes:
a first IC having a first active surface electrically connected to the at least one wiring layer and a first inactive surface opposing the first active surface, and configured to generate the RF signal;
a first heat sink member disposed on the first inactive surface of the first IC;
an encapsulant encapsulating at least portions of the first IC and the first heat sink member; and
a plurality of openings exposing at least a portion of the first heat sink member by penetrating through the encapsulant and receiving an electrical connection structure connected to the first heat sink member.

2. The antenna module of claim 1 , wherein the IC package further includes:
a support member having a through-hole in which the first IC and the first heat sink member are disposed and having at least a portion encapsulated by the encapsulant; and
a core plating member disposed on a side surface of the support member toward the first IC and the first heat sink member, and
the first heat sink member is electrically connected to the core plating member.

3. The antenna module of claim 2 , wherein the support member includes a core insulating layer, a core via penetrating through the core insulating layer and electrically connected to a corresponding wire of the at least one wiring layer, and a core wiring layer disposed on a first surface or a second surface of the core insulating layer and electrically connected to the core via.

4. The antenna module of claim 2 , wherein the IC package further includes a passive component electrically connected to a corresponding wire of the at least one wiring layer, and
the supporting member provides an accommodation space accommodating the passive component.

5. The antenna module of claim 4 , wherein the support member further includes a core interior plating member disposed to surround the passive component in the accommodation space.

6. The antenna module of claim 2 , wherein the support member has a height greater than that of the first IC, and
the first heat sink member protrudes from a level of a lower surface of the support member.

7. The antenna module of claim 1 , wherein the IC package further includes:
a core via having one end electrically connected to a corresponding wire of the at least one wiring layer, and other end electrically connected to an electrical connection structure.

8. The antenna module of claim 7 , wherein the core via receives a base signal or power through the electrical connection structure and transmits the base signal or power to the active surface of the first IC, and
the first IC generates the RF signal of a millimeter wave (mmWave) band based on the base signal or power and transmits the RF signal to the plurality of antenna members through the active surface of the first IC.

9. The antenna module of claim 1 , wherein the IC package further includes:
a second IC having a second active surface electrically connected to the at least one wiring layer and a second inactive surface opposing the second active surface, and configured to generate a base signal or power and transmit the base signal or power to the first IC; and
a second heat sink member disposed on the second inactive surface of the second IC.

10. The antenna module of claim 9 , wherein the IC package further includes:
a support member having first and second through-holes in which the first IC and the second IC are respectively disposed; and
core plating members disposed on side surfaces of the support member toward the first IC and the second IC, and
at least one of the first heat sink member and the second heat sink member is electrically connected to the core plating member.

11. An antenna module comprising:
a connection member including at least one wiring layer and at least one insulating layer;
an integrated circuit (IC) package disposed on a first surface of the connection member; and
an antenna package including a plurality of antenna members configured to transmit and receive a radio frequency (RF) signal, a plurality of feed vias in which one end of each thereof is electrically connected to each of the plurality of antenna members and the other end of each of thereof is electrically connected to a corresponding wire of the at least one wiring layer of the connection member, and a dielectric layer disposed to surround side surfaces of each of the plurality of feed vias and having a height greater than that of the at least one insulating layer of the connection member, and disposed on a second surface of the connection member,
wherein the IC package includes:
a first IC having a first active surface electrically connected to the at least one wiring layer and a first inactive surface opposing the first active surface and configured to generate the RF signal;
a second IC having a second inactive surface facing the first inactive surface of the first IC and a second active surface
opposing the second inactive surface and electrically connected to the at least one wiring layer, and configured to generate a base signal or power;
a core via disposed on side surfaces of the first and second ICs and having one end electrically connected to the at least one wiring layer and the other end electrically connected to the second active surface; and
an encapsulant encapsulating at least portions of the first and second ICs and the core via.

12. The antenna module of claim 11 , wherein the IC package further includes an adhesive member bonding between the first inactive surface of the first IC and the second inactive surface of the second IC.

13. The antenna module of claim 11 , wherein the first IC has a size different from that of the second IC, and
the IC package further includes a heat sink member occupying at least a portion of a space generated according to a difference in the size of the first IC and the size of the second IC.

14. The antenna module of claim 11 , wherein the IC package further includes a heat sink member disposed between the first inactive surface of the first IC and the second inactive surface of the second IC.

15. The antenna module of claim 14 , wherein the IC package further includes:
a support member including the core via having a through-hole in which the first and second ICs are disposed; and
a core plating member disposed on a side surface toward the first and second ICs from the support member, and
the heat sink member is electrically connected to the core plating member.

16. The antenna module of claim 15 , wherein the support member includes:
a core via electrically connected to a corresponding wire of the at least one wiring layer,
a core insulating layer surrounding side surfaces of the core via, and

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Doo Il
• Cho Jung Hyun
• So Won Wook
• Hur Young Sik
• Baek Yong Ho

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W20/40

  Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title