Electronic component package and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016338202-A1
Application number	US-201615144162-A
Country	US
Kind code	A1
Filing date	May 2, 2016
Priority date	May 11, 2015
Publication date	Nov 17, 2016
Grant date	—

Abstract

An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.

First claim

1 . An electronic component package comprising:
a frame having a through-hole and one or more first wiring layers; an electronic component disposed in the through-hole of the frame; and a redistribution part disposed on one side of the frame and the electronic component, wherein the one or more first wiring layers are electrically connected to the electronic component through the redistribution part.

2 . The electronic component package of claim 1 , wherein at least one of the one or more first wiring layers is positioned at a level between upper and lower surfaces of the electronic component.

3 . The electronic component package of claim 1 , wherein the frame includes:
a plurality of insulating layers; the one or more first wiring layers disposed between the plurality of insulating layers; and a second wiring layer disposed at one side of the plurality of insulating layers.

4 . The electronic component package of claim 3 , wherein the frame further includes a third wiring layer disposed at the other side of the plurality of insulating layers.

5 . The electronic component package of claim 4 , wherein the electronic component has an electrode pad for a signal, the electrode pad for a signal is electrically connected to a signal pattern of a wiring layer of the redistribution part through a first via for a signal of the redistribution part, the signal pattern of the wiring layer of the redistribution part is electrically connected to a signal pattern of the second wiring layer of the frame through a second via for a signal of the redistribution part, the signal pattern of the second wiring layer of the frame is electrically connected to a signal pattern of the first wiring layer of the frame through a via for a signal of the frame, the signal pattern of the first wiring layer of the frame is electrically connected to a signal pattern of the third wiring layer of the frame through an internal via for a signal of the frame, and the signal pattern of the third wiring layer of the frame is electrically connected to an external connection terminal for a signal disposed in a fan-out region of the other side of the frame, and
the second and third wiring layers of the frame have ground patterns.

6 . The electronic component package of claim 4 , wherein
the electronic component has an electrode pad for a signal, the electrode pad for a signal is electrically connected to a first signal pattern of a wiring layer of the redistribution part through a first via for a signal of the redistribution part, the first signal pattern of the wiring layer of the redistribution part is electrically connected to a first signal pattern of the second wiring layer of the frame through a second via for a signal of the redistribution part, the first signal pattern of the second wiring layer of the frame is electrically connected to a signal pattern of the first wiring layer of the frame through a first via for a signal of the frame, the signal pattern of the first wiring layer of the frame is electrically connected to a second signal pattern of the second wiring layer of the frame through a second via for a signal of the frame, the second signal pattern of the second wiring layer of the frame is electrically connected to a second signal pattern of the wiring layer of the redistribution part through a via for a third signal of the redistribution part, and the second signal pattern of the wiring layer of the redistribution part is electrically connected to an external connection terminal for a signal disposed in a fan-out region of one side of the redistribution part, and
the second and third wiring layers of the frame have ground patterns.

7 . The electronic component package of claim 4 , wherein
the one or more first wiring layers include one side first wiring layer and the other side first wiring layer each disposed between the plurality of insulating layers, the electronic component has an electrode pad for a signal, the electrode pad for a signal is electrically connected to a signal pattern of a wiring layer of the redistribution part through a first via for a signal of the redistribution part, the signal pattern of the wiring layer of the redistribution part is electrically connected to a signal pattern of the second wiring layer of the frame through a second via for a signal of the redistribution part, the signal pattern of the second wiring layer of the frame is electrically connected to a signal pattern of the one side first wiring layer of the frame through one side via for a signal of the frame, the signal pattern of the one side first wiring layer of the frame is electrically connected to a signal pattern of the other side first wiring layer of the frame through an internal via for a signal of the frame, the signal pattern of the other side first wiring layer of the frame is electrically connected to a signal pattern of the third wiring layer of the frame through the other via for a signal of the frame, and the signal pattern of the third wiring layer of the frame is electrically connected to an external connection terminal for a signal disposed in a fan-out region of the other side of the redistribution part, and
the second wiring layer and the other side first wiring layer of the frame have ground patterns.

8 . The electronic component package of claim 3 , wherein the first wiring layers are a plurality of layers each disposed between the plurality of insulating layers.

9 . The electronic component package of claim 8 , wherein one of the plurality of first wiring layers has wiring bonding pads, and
the wiring bonding pads are externally exposed.

10 . The electronic component package of claim 3 , wherein the frame further includes:
an internal via penetrating through one of the plurality of insulating layers; and a via penetrating through the other of the plurality of insulating layers, and the internal via has a diameter larger than that of the via.

11 . The electronic component package of claim 10 , wherein the insulating layer through which the internal via penetrates among the plurality of insulating layers has a thickness greater and an elastic modulus larger than those of the other insulating layers.

12 . The electronic component package of claim 3 , wherein the frame further includes a metal layer disposed on an inner surface of the through-hole.

13 . The electronic component package of claim 12 , wherein the metal layer is electrically connected to at least one of the one or more first wiring layers and the second wiring layer.

14 . The electronic component package of claim 1 , wherein the electronic component includes an integrated circuit having electrode pads, and
the electrode pads of the integrated circuit are directed toward the redistribution part.

15 . The electronic component package of claim 1 , further comprising another electronic component disposed in the through-hole of the frame,
wherein another electronic component is electrically connected to the redistribution part, and another electronic component is at least one of an integrated circuit and a passive component.

16 . The electronic component package of claim 1 , further comprising an encapsulant encapsulating at least portions of the frame and the electronic component.

17 . The electronic component package of claim 16 , wherein the encapsulant covers at least all the surfaces of the electronic component except one surface based on which electrode pads of the electronic component are formed.

18 . The electronic component package of claim 16 , wherein the encaps

Assignees

• Samsung Electro Mech

Inventors

• Park Dae Hyun
• Kim Han
• Hur Kang Heon
• Ko Young Gwan
• Shim Jung Ho

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title