Computationally efficient X-ray based overlay measurement

Patent metadata

Field	Value
Publication number	US-10545104-B2
Application number	US-201615141453-A
Country	US
Kind code	B2
Filing date	Apr 28, 2016
Priority date	Apr 28, 2015
Publication date	Jan 28, 2020
Grant date	Jan 28, 2020

Abstract

Methods and systems for performing overlay and edge placement errors of device structures based on x-ray diffraction measurement data are presented. Overlay error between different layers of a metrology target is estimated based on the intensity variation within each x-ray diffraction order measured at multiple, different angles of incidence and azimuth angles. The estimation of overlay involves a parameterization of the intensity modulations of common orders such that a low frequency shape modulation is described by a set of basis functions and a high frequency overlay modulation is described by an affine-circular function including a parameter indicative of overlay. In addition to overlay, a shape parameter of the metrology target is estimated based on a fitting analysis of a measurement model to the intensities of the measured diffraction orders. In some examples, the estimation of overlay and the estimation of one or more shape parameter values are performed simultaneously.

First claim

What is claimed is:

1. A metrology system comprising:
an x-ray illumination source configured to illuminate a measurement target disposed on a planar substrate with a beam of x-ray radiation at multiple, different angles of incidence and at multiple, different azimuth angles, wherein the measurement target includes a first structure disposed in a first layer fabricated at a first height above the planar substrate and a second structure disposed in a second layer fabricated at a second height above the planar substrate;
an x-ray detector configured to detect a plurality of intensities each associated with one or more diffraction orders of an amount of radiation scattered from the measurement target in response to the incident beam of x-ray radiation and each associated with a different angle of incidence and azimuth angle; and
a computing system configured to:
estimate a value of overlay between the first and second structures based on modulations in the plurality of intensities within each of the one or more x-ray diffraction orders at the multiple, different angles of incidence and the multiple, different azimuth angles.

2. The metrology system of claim 1 , wherein the estimating of the value of overlay involves a parameterization of the intensity modulations of common orders such that a low frequency shape modulation is described by a set of basis functions and a high frequency overlay modulation is described by an affine-circular function that includes a parameter indicative of the overlay.

3. The metrology system of claim 1 , wherein the computing system is further configured to:
estimate a value of a shape parameter of any of the first and second structures based on a fitting analysis of the detected intensities of the diffraction orders with a measurement model.

4. The metrology system of claim 1 , wherein the first structure is spatially periodic in at least one direction parallel to a planar surface of the planar substrate.

5. The metrology system of claim 1 , wherein the x-ray illumination source illuminates the measurement target with the beam of x-ray radiation at the multiple, different angles of incidence and the multiple, different azimuth angles, simultaneously.

6. The metrology system of claim 1 , wherein the x-ray illumination source and the x-ray detector are arranged as elements of any of a transmission small angle x-ray scattering (TSAXS) system, a grazing incidence small angle x-ray scattering (GISAXS) system, a wide angle x-ray scattering (WAXS) system, an x-ray diffraction (XRD) system, a grazing incidence x-ray diffraction (GIXRD) system, a high resolution x-ray diffraction (HRXRD) system.

7. The metrology system of claim 1 , wherein the measurement target is a design rule target.

8. The metrology system of claim 1 , wherein the measurement target is disposed in-die.

9. The metrology system of claim 1 , wherein any of the first structure and the second structure is asymmetrical.

10. The metrology system of claim 1 , wherein any of the first structure and the second structure is not periodic.

11. The metrology system of claim 1 , wherein the computing system is further configured to:
determine the multiple, different angles of incidence and the multiple, different azimuth angles such that a correlation of the overlay and a shape parameter is minimized.

12. The metrology system of claim 2 , wherein the estimating of the value of overlay involves a fitting of the parameterization of the intensity modulations to the measured plurality of intensities.

13. The metrology system of claim 3 , wherein the measurement model is any of a physically based measurement model and a signal response metrology model.

14. The metrology system of claim 3 , wherein the estimating of the overlay value and the estimating of the value of the shape parameter are performed simultaneously.

15. The metrology system of claim 6 , further comprising:
a selectable analyzer element disposed in a path of the radiation scattered from the measurement target before the detector, wherein the selectable analyzer element is configured limit the transmission of the scattered radiation within a selectable energy range.

16. A method comprising:
illuminating a measurement target disposed on a planar substrate with a beam of x-ray radiation at multiple, different angles of incidence and at multiple, different azimuth angles, wherein the measurement target includes a first structure disposed in a first layer fabricated at a first height above the planar substrate and a second structure disposed in a second layer fabricated at a second height above the planar substrate;
detecting a plurality of intensities each associated with one or more diffraction orders of an amount of radiation scattered from the measurement target in response to the incident beam of x-ray radiation and each associated with a different angle of incidence and azimuth angle; and
estimating a value of overlay between the first and second structures based on modulations in the plurality of intensities within each of the one or more x-ray diffraction orders at the multiple, different angles of incidence and the multiple, different azimuth angles.

17. The method of claim 16 , wherein the estimating of the value of overlay involves a parameterization of the intensity modulations of common orders such that a low frequency shape modulation is described by a set of basis functions and a high frequency overlay modulation is described by an affine-circular function that includes a parameter indicative of the overlay.

18. The method of claim 16 , further comprising:
estimating a value of a shape parameter of any of the first and second structures based on a fitting analysis of the detected intensities of the diffraction orders with a measurement model.

19. The method of claim 17 , wherein the estimating of the value of overlay involves a fitting of the parameterization of the intensity modulations to the measured plurality of intensities.

20. The method of claim 18 , further comprising:
estimating a value of an edge placement error associated with the first and second structures based on the overlay value and the shape parameter value.

Assignees

• Kla Tencor Corp

Inventors

• Hench John
• Shchegrov Andrei V
• Bakeman Michael S

Classifications

• G01N2223/611

  patterned objects; electronic devices · CPC title

• G01N23/207 Primary

  Diffractometry using detectors, e.g. using a probe in a central position and one or more displaceable detectors in circumferential positions · CPC title

• G01N23/20008

  Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor (monochromators for X- rays using crystals G21K1/06) · CPC title

• G21K1/062

  Devices having a multilayer structure · CPC title

• G03F7/70633

  Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title