Sheet-shaped heat pipe

Patent metadata

Field	Value
Publication number	US-10544994-B2
Application number	US-201715712175-A
Country	US
Kind code	B2
Filing date	Sep 22, 2017
Priority date	Mar 26, 2015
Publication date	Jan 28, 2020
Grant date	Jan 28, 2020

Abstract

A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

First claim

What is claimed is:

1. A sheet-shaped heat pipe comprising:
a sheet-shaped container;
a wick sealed in the container; and
a working fluid sealed in the container; wherein
the sheet-shaped container includes a first metal sheet and a second metal sheet; the first metal sheet and the second metal sheet are superposed and at least partially bonded to provide a closed internal space therebetween;
a thickness of the sheet-shaped container is about 0.5 mm or less; a material of the first metal sheet and a material of the second metal sheet are different from each other; and
the first metal sheet includes a first thick portion and a first thin portion, and the second metal sheet includes a second thick portion and a second thin portion, the first thick portion is positioned opposing the second thin portion and the first thin portion is positioned opposing the second thick portion.

2. The sheet-shaped heat pipe according to claim 1 , wherein a resin portion is provided on at least one of the first metal sheet and the second metal sheet.

3. The sheet-shaped heat pipe according to claim 2 , wherein the resin portion includes at least one of an electromagnetic-wave absorbing material and a heat storage material.

4. The sheet-shaped heat pipe according to claim 2 , wherein a thermal conductivity of the resin portion is lower than a thermal conductivity of at least one of the first metal sheet and the second metal sheet.

5. The sheet-shaped heat pipe according to claim 2 , wherein an elastic modulus of the resin portion is lower than an elastic modulus of at least one of the first metal sheet and the second metal sheet.

6. The sheet-shaped heat pipe according to claim 1 , wherein a porous body having an average pore diameter of about 100 nm or less is disposed on a surface of the wick.

7. The sheet-shaped heat pipe according to claim 6 , wherein the porous body includes zeolite or a porous metallic complex.

8. The sheet-shaped heat pipe according to claim 1 , wherein a porous body having a specific surface area of about 100 m 2 /g or more is disposed on a surface of the wick.

9. The sheet-shaped heat pipe according to claim 1 , wherein a porous body having a retaining ratio of the working fluid of about 5% or more by volume is disposed on a surface of the wick.

10. A heat dissipating plate comprising:
a metal plate; and
the sheet-shaped heat pipe according to claim 1 ; wherein
the sheet-shaped heat pipe is disposed on the metal plate such that the metal plate and a principal surface of the second metal sheet are in direct contact with each other.

11. The heat dissipating plate according to claim 10 , wherein the metal plate includes a recess and the sheet-shaped heat pipe is disposed in the recess.

12. The heat dissipating plate according to claim 10 , wherein a thermal conductivity of the first metal sheet is higher than a thermal conductivity of the second metal sheet.

13. The heat dissipating plate according to claim 10 , wherein a hardness of the first metal sheet is higher than a hardness of the second metal sheet.

14. The heat dissipating plate according to claim 10 , wherein a hardness of the second metal sheet is higher than a hardness of the first metal sheet.

15. The heat dissipating plate according to claim 10 , wherein a resin portion is provided on one of the first metal sheet and the second metal sheet.

16. The heat dissipating plate according to claim 15 , wherein the resin portion includes at least one of an electromagnetic-wave absorbing material and a heat storage material.

17. The heat dissipating plate according to claim 15 , wherein a thermal conductivity of the resin portion is lower than a thermal conductivity of at least one of the first metal sheet and the second metal sheet.

18. The heat dissipating plate according to claim 15 , wherein an elastic modulus of the resin portion is lower than an elastic modulus of at least one of the first metal sheet and the second metal sheet.

19. The heat dissipating plate according to claim 15 , wherein the resin portion is disposed only on the first metal sheet.

20. The heat dissipating plate according to claim 10 , wherein the heat dissipating plate has a thickness of about 1.0 mm or less.

21. A heat dissipating plate comprising:
a metal plate; and
a sheet-shaped heat pipe disposed on the metal plate; wherein
the sheet-shaped heat pipe includes:
a sheet-shaped container;
a wick sealed in the container; and
a working fluid sealed in the container;

the sheet-shaped container includes a first metal sheet and a second metal sheet;
the first metal sheet and the second metal sheet are superposed and at least partially bonded to provide a closed internal space therebetween;
the second metal sheet is combined with the metal plate;
a material of the first metal sheet and a material of the second metal sheet are different from each other; and
the first metal sheet includes a first thick portion and a first thin portion, and the second metal sheet includes a second thick portion and a second thin portion, the first thick portion is positioned opposing the second thin portion and the first thin portion is positioned opposing the second thick portion.

22. An electronic device comprising the sheet-shaped heat pipe according to claim 1 .

23. The electronic device according to claim 22 , wherein the sheet-shaped heat pipe is electrically coupled to a ground of a circuit to function as a shield.

24. An electronic device comprising the heat dissipating plate according to claim 10 .

25. The electronic device according to claim 24 , wherein the heat dissipating plate is electrically coupled to a ground of a circuit to function as a shield.

26. A heat dissipating plate comprising:
a metal plate; and
a sheet-shaped heat pipe disposed on the metal plate; wherein
the sheet-shaped heat pipe includes:
a sheet-shaped container;
a wick sealed in the container; and
a working fluid sealed in the container;

the sheet-shaped container includes a first metal sheet and a second metal sheet;
the first metal sheet and the second metal sheet are superposed and at least partially bonded to provide a closed internal space therebetween;
the metal plate also defines the second metal sheet;
a material of the first metal sheet and a material of the second metal sheet are different from each other; and
the first metal sheet includes a first thick portion and a first thin portion, and the second metal sheet includes a second thick portion and a second thin portion, the first thick portion is positioned opposing the second thin portion and the first thin portion is positioned opposing the second thick portion.

Assignees

• Murata Manufacturing Co

Inventors

• Wakaoka Takuo
• Kishimoto Atsushi
• Miura Tadamasa

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D2020/0013

  the heat storage material being enclosed in elements attached to or integral with heat exchange conduits · CPC title

• F28F21/081

  Heat exchange elements made from metals or metal alloys · CPC title

• F28D15/04

  with tubes having a capillary structure · CPC title

• F28D15/0233 Primary

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title