Microwave antenna coupling apparatus, microwave antenna apparatus and microwave antenna package

Patent metadata

Field	Value
Publication number	US-10541464-B2
Application number	US-201815866904-A
Country	US
Kind code	B2
Filing date	Jan 10, 2018
Priority date	Jan 17, 2017
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed. The elements can be integrated by a standard pick and place process.

First claim

The invention claimed is:

1. Microwave antenna coupling apparatus comprising:
a mold layer of mold material;
a semiconductor element comprising a semiconductor unit and a semi-conductor feed line arranged on a first surface of the semiconductor unit, wherein the semiconductor element is arranged within the mold layer such that an outer surface of the semiconductor feed line is not covered by mold material;
an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material;
a redistribution layer comprising at least one redistribution substrate layer and a conductive layer, wherein the redistribution layer is arranged on a first surface of the mold layer and configured such that the conductive layer connects the outer surface of the semiconductor feed line with the outer surface of the coupling feed line; and
another redistribution layer comprising a ground layer, at least one redistribution substrate layer, and a conductive layer, wherein the another redistribution layer is arranged on a second surface of the mold layer opposite the first surface and configured for signal coupling between the conductive layer and the internal coupling component, the ground layer comprising a first aperture slot for signal coupling with the antenna coupling element and a second aperture slot connected with the first aperture slot for signal coupling with the conductive layer.

2. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the antenna coupling element is arranged within the mold layer such that the second surface of the coupling unit is not covered by mold material.

3. Microwave antenna coupling apparatus as claimed in claim 1 , comprising two or more antenna coupling elements for coupling with two or more antenna elements of a microwave antenna apparatus.

4. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the another redistribution layer further comprises vias for connecting the conductive layer with another conductive layer.

5. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the conductive layer is arranged on a first surface of the another redistribution layer facing the mold layer and the ground layer is arranged within the another redistribution layer.

6. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the ground layer is arranged on a first surface of the another redistribution layer facing the mold layer and the conductive layer is arranged within the another redistribution layer or on a second surface opposite the first surface.

7. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the internal coupling component comprises a through package via connecting the coupling feed line with the second surface of the coupling unit.

8. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the internal coupling component comprises a coaxial coupling element connecting the coupling feed line with the second surface of the coupling unit.

9. Microwave antenna coupling apparatus as claimed in claim 8 , wherein said coaxial coupling element comprises as central feeding via and a surrounding shielding via.

10. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the internal coupling component comprises a waveguide.

11. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the antenna coupling element is arranged within the mold layer such that the second surface of the coupling unit is covered by mold material and another coupling feed line is arranged on or close to the second surface of the coupling unit.

12. Microwave antenna coupling apparatus as claimed in claim 1 , wherein the first aperture slot is a rectangular aperture slot and the second aperture slot is a circular aperture slot.

13. Microwave antenna coupling apparatus as claimed in claim 1 , wherein stubs are arranged within the second aperture slot.

14. Microwave antenna apparatus comprising:
a microwave antenna coupling apparatus as claimed in claim 1 ; and
an antenna module coupled to the microwave antenna coupling apparatus on a surface opposite the redistribution layer, said antenna module comprising one or more antenna elements.

15. Microwave antenna apparatus as claimed in claim 14 , wherein said antenna module comprises an antenna feed line arranged in or on a surface of the antenna module facing the microwave antenna coupling apparatus and coupling the one or more antenna elements to the antenna coupling element of the microwave antenna coupling apparatus.

16. Microwave antenna package comprising:
a PCB arrangement comprising a PCB layer; and
a microwave antenna apparatus as claimed in claim 14 coupled to the PCB arrangement.

17. Microwave antenna package as claimed in claim 16 , further comprising:
a frequency selective surface structure arranged at a distance from the microwave antenna apparatus on a side of the microwave antenna apparatus facing away from the PCB arrangement; and
a support structure for supporting the frequency selective surface structure.

Assignees

• Sony Corp

Inventors

• Khan Wasif Tanveer
• Nauman Mudassar
• Ott Arndt Thomas
• Hotopan Ramona

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W44/248

  for antennas · CPC title

• H01Q21/065

  Patch antenna array · CPC title