Epoxy resin composition, fiber-reinforced composite material, and method for producing the same

US10538637B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10538637-B2
Application numberUS-201615017575-A
CountryUS
Kind codeB2
Filing dateFeb 5, 2016
Priority dateMar 25, 2008
Publication dateJan 21, 2020
Grant dateJan 21, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for producing fiber-reinforced composite material, comprising: placing a fiber substrate composed of reinforcing fibers on a substrate; attaching a binder to the fiber substrate; mixing at least (i) an epoxy resin base composition and (ii) at least one liquid diamine curing agent to form an epoxy resin composition; impregnating the fiber substrate and binder with the epoxy resin composition; and thermally curing the epoxy resin composition; wherein the epoxy resin composition comprises at least the following components (A), (B), and (C); wherein: (A) is an epoxy resin base composition comprising at least one bifunctional epoxy resin represented by any one of the following formulas (I), (II), and (III): wherein R 1 to R 17 are each independently a substituent selected from among hydrogen, halogens, and C 1 to C 4 alkyl groups; (B) is at least one liquid aromatic diamine curing agent represented by any one or more of the following formulas (IV) to (VI): wherein R 18 to R 29 are each independently a substituent selected from among hydrogen, halogens, and C 1 to C 4 alkyl groups; (C) comprises core-shell polymer particles, wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm; and wherein the at least one liquid diamine curing agent further comprises a diaminosulfone comprising a mixture of 3,3′-diaminodiphenylsulfone and 4,4′-diaminodiphenylsulfone. 2. The method for producing a fiber-reinforced composite material according to claim 1 , wherein the reinforcing fibers comprise carbon fibers. 3. The method for producing a fiber-reinforced composite material according to claim 1 , which contains the component (A) in an amount of 15 to 60 parts by mass with respect to 100 parts by mass of a total epoxy resin. 4. The method for producing a fiber-reinforced composite material according to claim 1 , further comprising a tri- or higher-functional aromatic epoxy resin as a component (D) in an amount of 30 to 70 parts by mass with respect to 100 parts by mass of the total epoxy resin. 5. The method for producing a fiber-reinforced composite material according to claim 1 , which contains a mixture of two or more liquid aromatic diamine curing agents represented by the formulas (IV) to (VI) and 10 to 40 parts by mass of the mixture of 3,3′-diaminodiphenylsulfone and 4,4′-diaminodiphenylsulfone with respect to 100 parts by mass of a total amine curing agent. 6. The method for producing fiber-reinforced composite material according to claim 1 , wherein a core of the component (C) is composed of a polymer obtained by polymerization of a monomer containing butadiene. 7. The method for producing fiber-reinforced composite material according to claim 1 , which contains the component (C) in an amount of 1 to 12 parts by mass with respect to 100 parts by mass of the total epoxy resin. 8. The method for producing fiber-reinforced composite material according to claim 1 , wherein a cured product obtained by curing the epoxy resin composition at 180° C. for 2 hours has a glass transition temperature different from that of the core of the component (C) by 210° C. or more and a fracture toughness (GIC) at −54° C. of 120 J/m2 or higher. 9. The method for producing fiber-reinforced composite material according to claim 1 , wherein the component (B) is at least diethyltoluene-diamine. 10. The method for producing fiber-reinforced composite material according to claim 1 , wherein an initial viscosity of the epoxy resin composition at 70° Celsius is 500 mPa·s or less. 11. The method for producing fiber-reinforced composite material according to claim 1 , wherein the fiber substrate is unidirectional fabric. 12. The method for producing fiber-reinforced composite material according to claim 1 , wherein the impregnating of the fiber substrate with the epoxy resin composition is performed by evacuating an inside of a mold using a vacuum pump. 13. A method for producing fiber-reinforced composite material, comprising: placing a fiber substrate composed of reinforcing fibers on a substrate; attaching a binder to the fiber substrate; mixing at least (i) an epoxy resin base composition and (ii) at least one liquid diamine curing agent to form an epoxy resin composition impregnating the fiber substrate and binder with the epoxy resin composition; and thermally curing the epoxy resin composition; wherein the epoxy resin composition comprises at least the following components (A), (B), and (C); wherein: (A) is an epoxy resin base composition comprising at least one bifunctional epoxy resin represented by any one of the following formulas (I), (II), and (III): wherein R 1 to R 17 are each independently a substituent selected from among hydrogen, halogens, and C 1 to C 4 alkyl groups; (B) is at least one liquid aromatic diamine curing agent comprising a mixture of 2,4-diethyl-6-methyl-1,3-phenylenediamine and 4,6-diethyl-2-methyl-1,3-phenylenediamine; and (C) comprises core-shell polymer particles, wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm. 14. The method for producing fiber-reinforced composite material according to claim 13 , wherein the liquid diamine curing agent further comprises 10 to 40 parts by mass of diaminodiphenylsulfone with respect to 100 parts by mass of a total amine curing agent. 15. The method for producing fiber-reinforced composite material according to claim 14 , wherein the diaminodiphenylsulfone is a mixture of 3,3′-diaminodiphenylsulfone and 4,4′-diaminodiphenylsulfone.

Assignees

Inventors

Classifications

  • and impregnating by vacuum or injection · CPC title

  • C08J5/047Primary

    with mixed fibrous material · CPC title

  • Polyglycidyl ethers of bis-phenols · CPC title

  • Embodying intertwined or helical component[s] · CPC title

  • Carbon · CPC title

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What does patent US10538637B2 cover?
Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and whi…
Who is the assignee on this patent?
Kamae Toshiya, Kochi Shinji, Miyoshi Masayuki, and 2 more
What technology area does this patent fall under?
Primary CPC classification C08J5/047. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 21 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).