Laminated film and process for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10535838-B2
Application number	US-201715471734-A
Country	US
Kind code	B2
Filing date	Mar 28, 2017
Priority date	Mar 31, 2016
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

A laminated film containing at least a gas barrier layer and an inorganic polymer layer being laminated on a resin substrate, wherein concerning a distance from a surface of the inorganic polymer layer in a film thickness direction of the layer and the ratio of an oxygen atom to a total amount of a silicon atom, an oxygen atom, a carbon atom and a nitrogen atom, the ratio of a value of the oxygen atomic ratio in a region from a surface on a side opposite to the gas barrier layer up to 30% of a film thickness of the inorganic polymer layer in a depth direction to a value of the oxygen atomic ratio in a region from 30% of a film thickness of the inorganic polymer layer in a depth direction up to a surface on a side of the gas barrier layer is 1.05 or more.

First claim

What is claimed is:

1. A laminated film comprising at least a gas barrier layer and an inorganic polymer layer being laminated on a resin substrate,
wherein concerning a distance from a surface of the inorganic polymer layer in a film thickness direction of the layer and the ratio of an oxygen atom to a total amount of a silicon atom, an oxygen atom, a carbon atom and a nitrogen atom,
wherein the ratio of a value of the oxygen atomic ratio in a region from a surface on a side opposite to the gas barrier layer of the inorganic polymer layer up to 30% of a film thickness of the inorganic polymer layer in a depth direction to a value of the oxygen atomic ratio in a region from 30% of a film thickness of the inorganic polymer layer in a depth direction up to a surface on a side of the gas barrier layer is 1.20 or more.

2. The laminated film according to claim 1 , wherein the ratio of a value of the oxygen atomic ratio in a region from a surface on a side opposite to the gas barrier layer of the inorganic polymer ratio up to 30% of a film thickness of the inorganic polymer layer in a depth direction to a value of the oxygen atomic ratio in a region from 30% of a film thickness of the inorganic polymer layer in a depth direction up to a surface on a side of the gas barrier layer is 1.20 or more and 2 or less.

3. The laminated film according to claim 1 , wherein the gas barrier layer is a silicon oxide-based layer which contains a silicon atom, an oxygen atom and a carbon atom, and
satisfies all of the conditions (i) to (iii), in a silicon distribution curve, an oxygen distribution curve and a carbon distribution curve, each showing a relationship between a distance from a surface of the gas barrier layer in a film thickness direction of the gas barrier layer, and the atomic ratio of silicon, the atomic ratio of oxygen or the atomic ratio of carbon, to a total amount of a silicon atom, an oxygen atom and a carbon atom:
(i) the atomic ratio of silicon, the atomic ratio of oxygen and the atomic ratio of carbon satisfy the condition represented by the expression (1) in a region of 90% or more of a film thickness of the gas barrier layer;
(atomic ratio of oxygen)>(atomic ratio of silicon)>(atomic ratio of carbon)  (1)

(ii) the carbon distribution curve has at least one extreme value; and
(iii) an absolute value of a difference between a maximum value and a minimum value of the atomic ratio of carbon in the carbon distribution curve is 5 at % or more.

4. The laminated film according to claim 1 , wherein the gas barrier layer contains a silicon atom, an oxygen atom and a nitrogen atom, and
the gas barrier layer is a silicon oxide-based layer satisfying all of the conditions (iv) and (v):
(iv) the gas barrier layer has a second thin film layer, a first thin film layer, and a third thin film layer which have different oxygen content ratios from the other thin film layers, and the ordering of the thin film layers from a region substrate side is (second, first, third), and an average composition of a silicon atom, an oxygen atom and a nitrogen atom of the first thin film layer is in the range of 10 at %≤Si≤40 at %, 5 at %≤O≤30 at %, 50 at %≤N≤80 at %; and
(v) the elemental ratio of a nitrogen atom and a silicon atom of the second and third thin film layers is in the range of the expression (2):
N/Si≤0.2  (2).

5. The laminated film according to claim 1 , wherein the inorganic polymer layer is a layer consisting of a curing product of a composition comprising polysilazane.

Assignees

• Sumitomo Chemical Co

Inventors

• Ito Yutaka

Classifications

• C23C16/509

  using internal electrodes · CPC title

• C23C16/545

  for coating elongated substrates · CPC title

• C23C16/36

  Carbonitrides · CPC title

• C23C16/56

  After-treatment · CPC title

• C23C16/308

  Oxynitrides · CPC title