Semiconductor device and mounting structure of semiconductor device

Patent metadata

Field	Value
Publication number	US-10535813-B2
Application number	US-201816170647-A
Country	US
Kind code	B2
Filing date	Oct 25, 2018
Priority date	Aug 22, 2016
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor element;
a first conductive member electrically connected to and spaced apart from the semiconductor element;
a second conductive member electrically connected to the semiconductor element and spaced apart from the semiconductor element and the first conductive member; and
a resin member covering the semiconductor element, at least a part of the first conductive member and at least a part of the second conductive member,
wherein the resin member comprises a first surface, a second surface, a third surface and a fourth surface, the first surface and the second surface being disposed to face away from each other in a first direction, the third surface and the fourth surface being disposed to face away from each other in a second direction perpendicular to the first direction,
the first conductive member comprises a first end portion, a second end portion, a third end portion and a fourth end portion, the first end portion being exposed from the first surface of the resin member, the second end portion being exposed from the second surface of the resin member, the third end portion being exposed from the third surface of the resin member, the fourth end portion being smaller in size measured in the first direction than the third end portion,
the second conductive member comprises a first end portion, a second end portion, a third end portion and a fourth end portion, the first end portion of the second conductive member being exposed from the first surface of the resin member, the second end portion of the second conductive member being exposed from the second surface of the resin member, the third end portion of the second conductive member being exposed from the fourth surface of the resin member, the fourth end portion of the second conductive member being smaller in size measured in the first direction than the third end portion of the second conductive member.

2. The semiconductor device according to claim 1 , wherein the first end portion and the second end portion of the first conductive member overlap with each other as viewed in the first direction, and the first end portion and the second end portion of the second conductive member overlap with each other as viewed in the first direction.

3. The semiconductor device according to claim 1 , further comprising a first wire and a second wire, wherein the first wire comprises a first end bonded to the first conductive member and a second end bonded to the semiconductor element, the first end of the first wire being closer to the first surface of the resin member than is the second end of the first wire,
the second wire comprises a first end bonded to the second conductive member and a second end bonded to the semiconductor element, the first end of the second wire being closer to the first surface of the resin member than is the second end of the second wire.

4. The semiconductor device according to claim 3 , wherein the first end and the second end of the first wire are offset from each other in a third direction perpendicular to the first direction and the second direction.

5. The semiconductor device according to claim 3 , wherein the first wire and the second wire each extend in non-parallel to the second direction as viewed in the first direction.

6. The semiconductor device according to claim 3 , wherein the fourth end portion of the first conductive member is closer to the semiconductor element in the second direction than is the first end of the first wire.

7. The semiconductor device according to claim 3 , wherein the second end of the first wire is generally perpendicularly bonded to a surface of the semiconductor element.

8. The semiconductor device according to claim 1 , wherein the fourth end portion of the first conductive member and the fourth end portion of the second conductive member overlap with each other as viewed in the second direction.

9. The semiconductor device according to claim 1 , wherein the semiconductor element is closer to the second surface of the resin member than to the first surface of the resin member.

10. The semiconductor device according to claim 1 , wherein the third end portion of the first conductive member is exposed to an outside of the semiconductor device.

11. A semiconductor device comprising:
a semiconductor element;
a first conductive member electrically connected to and spaced apart from the semiconductor element;
a second conductive member electrically connected to the semiconductor element and spaced apart from the semiconductor element and the first conductive member; and
a resin member covering the semiconductor element, at least a part of the first conductive member and at least a part of the second conductive member,
wherein each of the first conductive member and the second conductive member comprises a first end portion, a second end portion and a curved surface, the first end portion and the second end portion being disposed to face away from each other in a first direction, the curved surface connecting the first end portion and the second end portion to each other and being covered by the resin member.

12. The semiconductor device according to claim 11 , wherein the resin member comprises a first surface and a second surface that are disposed to face away from each other in the first direction, the first surface being flush with the first end portion of the first conductive member, the second surface being flush with the second end portion of the first conductive member.

13. The semiconductor device according to claim 12 , wherein the curved surface of the first conductive member comprises a concave face section and a convex face section, and the concave face section is closer to the first surface of the resin member than is the convex face section.

14. The semiconductor device according to claim 13 , wherein the concave face section and the convex face section are connected to each other via a boundary that is nonlinear as a whole as viewed in the first direction.

15. The semiconductor device according to claim 14 , wherein the semiconductor element comprises a surface facing to the first surface of the resin member, said surface of the semiconductor element being closer to the first surface of the resin member than is the boundary.

16. The semiconductor device according to claim 13 , further comprising at least one connection wire, wherein the connection wire comprises a first end bonded to the first conductive member and a second end bonded to the semiconductor element, the second end of the connection wire being closer to the first surface of the resin member than is the first end of the connection wire.

17. The semiconductor device according to claim 16 , wherein at least a part of the first end of the connection wire is bonded to the concave face section of the curved surface.

18. The semiconductor device according to claim 17 , wherein the first end of the connection wire is bonded to the concave face section and the convex face section of the curved surface.

19. The semiconductor device according to claim 12 , further comprising a single insulation film that covers the second surface of the resin member, the second end portion of the first conductive member and the second end portion of the second conductive member.

20. The semiconductor device according to claim 19 , further comprising a heat dissipation layer disposed between the semiconductor element and the insulation film.

Assignees

• Rohm Co Ltd

Inventors

• Mizuta Shinsei
• Kigoshi Satohiro
• Masaki Takaaki

Classifications

• H10P72/7436

  used to support a device or a wafer when forming electrical connections thereto · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W76/167

  the container walls comprising an aperture, e.g. for pressure control · CPC title

• H10W76/10

  Containers or parts thereof · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title