Three-dimensional stacked memory optimizations for latency and power

US10534545B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10534545-B2
Application numberUS-201715847954-A
CountryUS
Kind codeB2
Filing dateDec 20, 2017
Priority dateDec 20, 2017
Publication dateJan 14, 2020
Grant dateJan 14, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An aspect includes receiving a request to write data to a memory that includes a stack of memory devices, each of the memory devices communicatively coupled to at least one other of the memory devices in the stack via a through silicon via (TSV). The write request is received by a hypervisor from an application executing on a virtual machine managed by the hypervisor. In response to receiving the request a latency requirement of accesses to the write data is determined. A physical location on a memory device in the stack of memory devices is assigned to the write data based at least in part on the latency requirement and a position of the memory device in the stack of memory devices. A write command that includes the physical location and the write data is sent to a memory controller.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: receiving a request to write data to a memory, the memory comprising a stack of memory devices, each of the memory devices communicatively coupled to at least one other of the memory devices in the stack via a through silicon via (TSV), the request to write data received by a hypervisor from an application executing on a virtual machine managed by the hypervisor; and in response to receiving the request: determining a latency requirement of accesses to the write data; determining one or more positions in the stack of memory devices for the write data based at least in part on the latency requirement and a predicted power consumption of the write data; assigning a physical location for the write data on a memory device located at one of the one or more positions in the stack of memory devices; and sending a write command to a memory controller, the write command including the physical location and the write data. 2. The method of claim 1 , wherein the request includes a tag that specifies the latency requirement. 3. The method of claim 1 , further comprising determining a predicted access frequency of the write data, wherein the determining one or more positions in the stack of memory devices for the write data is further based at least in part on the predicted access frequency of the write data. 4. The method of claim 1 , further comprising determining a predicted length of time that the write data will be stored in the memory, wherein the determining one or more positions in the stack of memory devices for the write data is further based at least in part on the predicted length of time that the write data will be stored in the memory. 5. The method of claim 1 , wherein the memory devices are homogenous. 6. The method of claim 1 , wherein the memory devices are heterogeneous. 7. The method of claim 6 , wherein the assigning is based at least in part on a type of the memory device. 8. The method of claim 6 , wherein the memory devices are placed in the stack in an order that is based on a thermal characteristic of at least one of the memory devices in the stack. 9. The method of claim 6 , wherein the memory devices are placed in the stack in an order that is based on an access speed of at least one of the memory devices in the stack. 10. A system comprising: a first memory having computer readable instructions; and one or more processors for executing the computer readable instructions, the computer readable instructions controlling the one or more processors to perform operations comprising: receiving a request to write data to a second memory, the second memory comprising a stack of memory devices, each of the memory devices communicatively coupled to at least one other of the memory devices in the stack via a through silicon via (TSV), the request to write data received by a hypervisor from an application executing on a virtual machine managed by the hypervisor; and in response to receiving the request: determining a latency requirement of accesses to the write data; determining one or more positions in the stack of memory devices for the write data based at least in part on the latency requirement and a predicted power consumption of the write data; assigning a physical location for the write data on a memory device located at one of the one or more positions in the stack of memory devices; and sending a write command to a memory controller, the write command including the physical location and the write data. 11. The system of claim 10 , wherein the request includes a tag that specifies the latency requirement. 12. The system of claim 10 , wherein the operations further comprise determining a predicted access frequency of the write data, wherein the determining one or more positions in the stack of memory devices for the write data is further based at least in part on the predicted access frequency of the write data. 13. The system of claim 10 , wherein the operations further comprise determining a predicted length of time that the write data will be stored in the second memory, wherein the determining one or more positions in the stack of memory devices for the write data is further based at least in part on the predicted length of time that the write data will be stored in the second memory. 14. The system of claim 10 , wherein the memory devices are homogenous. 15. The system of claim 10 , wherein the memory devices are heterogeneous. 16. The system of claim 15 , wherein the assigning is based at least in part on a type of the memory device. 17. The system of claim 15 , wherein the memory devices are placed in the stack in an order that is based on a thermal characteristic of at least one of the memory devices in the stack. 18. The system of claim 15 , wherein the memory devices are placed in the stack in an order that is based on an access speed of at least one of the memory devices in the stack. 19. A computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a processor to cause the processor to perform operations comprising: receiving a request to write data to a memory, the memory comprising a stack of memory devices, each of the memory devices communicatively coupled to at least one other of the memory devices in the stack via a through silicon via (TSV), the request to write data received by a hypervisor from an application executing on a virtual machine managed by the hypervisor; and in response to receiving the request: determining a latency requirement of accesses to the write data; determining one or more positions in the stack of memory devices for the write data based at least in part on the latency requirement and a predicted power consumption of the write data; assigning a physical location for the write data on a memory device located at one of the one or more positions in the stack of memory devices; and sending a write command to a memory controller, the write command including the physical location and the write data. 20. The computer program product of claim 19 , wherein the request includes a tag that specifies the latency requirement.

Assignees

Inventors

Classifications

  • of timing · CPC title

  • with adaption or trimming of parameters · CPC title

  • in signal lines · CPC title

  • in clock generator or timing circuitry · CPC title

  • Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management · CPC title

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What does patent US10534545B2 cover?
An aspect includes receiving a request to write data to a memory that includes a stack of memory devices, each of the memory devices communicatively coupled to at least one other of the memory devices in the stack via a through silicon via (TSV). The write request is received by a hypervisor from an application executing on a virtual machine managed by the hypervisor. In response to receiving t…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification G06F9/45558. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).