Resist composition and resist pattern forming method

Patent metadata

Field	Value
Publication number	US-10534264-B2
Application number	US-201815879206-A
Country	US
Kind code	B2
Filing date	Jan 24, 2018
Priority date	Feb 3, 2017
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

A resist composition which generates an acid through exposure and whose solubility in a developer changes by the action of an acid. The resist composition contains a polymer compound having at least two kinds of specific constituent units. A resist pattern forming method, including forming a resist film on a support using the resist composition, subjecting the resist film to exposure, and forming a resist pattern through patterning by developing the resist film having undergone exposure by using a developer.

First claim

What is claimed is:

1. A resist composition comprising:
a component (A) whose solubility in a developer changes by the action of an acid; and
an acid generator component (B) generating an acid through exposure,
wherein the component (A) contains a polymer compound having a constituent unit (a1) represented by Formula (1) and a constituent unit (a2) represented by Formula (2),

wherein R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Z represents a single bond or an alkylene group; and C p represents a group represented by Formula (Cp-1),

wherein R 2 represents a tertiary alkyl group, n p represents a positive integer, and * represents a binding position in which (Cp-1) is bonded to Z,

wherein R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; Y represents a divalent linking group; and X represents a group represented by a formula selected from the group consisting of Formulae (a2-r-1) to (a2-r-7), (a5-r-1), and (a5-r-2),

wherein Ra′ 21 and Ra′ 51 each independently represent a hydrogen atom, a cyano group, or a halogen atom; A′ represents an alkylene group having 1 to 5 carbon atoms that may contain an oxygen atom or a sulfur atom, an oxygen atom, or a sulfur atom; n′ represents an integer of 0 to 2; and m′ represents an integer of 0 or 1.

2. The resist composition according to claim 1 , wherein in Formula (1), n p represents an integer of 1 to 3, and R 2 represents an a tertiary alkyl group having 4 to 10 carbon atoms.

3. The resist composition according to claim 1 , wherein the constituent unit (a2) is a constituent unit represented by Formula (2-1) or Formula (2-2),

wherein R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms; X represents a group represented by a formula selected from the group consisting of Formulae (a2-r-1) to (a2-r-7), (a5-r-1), and (a5-r-2), V and W each represent a divalent linking group; and n represents an integer of 1 to 5.

4. The resist composition according to claim 1 , wherein in Formulae (2), X represents a group represented by the formula selected from the group consisting of Formulae (a2-r-1), (a2-r-2), (a2-r-6), (a2-r-7), and (a5-r-1).

5. The resist composition according to claim 3 , wherein in Formula (2-1) or (2-2), X represents a group represented by the formula selected from the group consisting of Formulae (a2-r-1), (a2-r-2), (a2-r-6), (a2-r-7), and (a5-r-1).

6. A resist pattern forming method, comprising:
forming a resist film on a support using the resist composition according to claim 1 ;
subjecting the resist film to exposure; and
forming a resist pattern by developing the resist film.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Nakamura Tsuyoshi
• Tanno Kazuishi
• Lee Junyeob

Classifications

• C08F220/282

  and containing two or more oxygen atoms · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• C08F232/08

  having condensed rings (coumarone-indene polymers C08F244/00) · CPC title

• C08F224/00

  Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen (cyclic esters of polyfunctional acids C08F218/00; cyclic anhydrides of unsaturated acids C08F220/00, C08F222/00) · CPC title

• G03F7/38

  Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title