Processing apparatus and processing method for workpiece

Patent metadata

Field	Value
Publication number	US-10532445-B2
Application number	US-201715730231-A
Country	US
Kind code	B2
Filing date	Oct 11, 2017
Priority date	Oct 12, 2016
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

A processing apparatus includes a chuck table that holds a workpiece by a holding face, a processing unit that processes the workpiece with a grinding whetstone or a polishing pad, a movement unit for moving the chuck table and the processing unit parallel to the holding face, a processing feeding unit for moving the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit to inspect a process mark of the workpiece during processing, a dressing unit to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit. When a process mark of a size exceeding a threshold value is detected on the process face of the workpiece, the control unit stops processing of the workpiece, and after the grinding whetstone or the polishing pad is dressed, restarts processing.

First claim

What is claimed is:

1. A processing apparatus, comprising:
a chuck table configured to hold a workpiece in the form of a plate by a holding face thereof;
a processing unit configured to process the workpiece held on the chuck table with a grinding whetstone or a polishing pad;
a movement unit configured to relatively move the chuck table and the processing unit in a direction parallel to the holding face;
a processing feeding unit configured to relatively move the chuck table and the processing unit in a direction orthogonal to the holding face;
an inspection unit configured to inspect a process mark caused by earlier processing of the workpiece during processing by the processing unit to determine whether the grinding whetstone or the polishing pads needs to be dressed;
a dressing unit configured to dress the grinding whetstone or the polishing pad of the processing unit; and
a control unit configured to control the processing unit, the movement unit, the processing feeding unit, the inspection unit and the dressing unit, wherein,
responsive to a determination that a process mark caused by earlier processing of the workpiece by the processing unit of a size exceeding a threshold value has been detected on the process face of the workpiece by the inspection unit, the control unit causes the processing of the workpiece to be temporarily stopped and then causes, after the grinding whetstone or the polishing pad is dressed by the dressing unit, the processing of the workpiece to be re-started.

2. The processing apparatus according to claim 1 , wherein the chuck table is movable between a mounting-dismounting position at which the workpiece is to be mounted or dismounted and a processing position at which the workpiece is processed by the processing unit, and
the dressing unit dresses the grinding whetstone or the polishing pad in a state in which the chuck table is positioned at the processing position.

3. The processing apparatus according to claim 1 , wherein the dressing unit includes a dressing member configured to contact with the grinding whetstone or the polishing pad, and an advancement-retraction unit configured to move the dressing member toward and away from the grinding whetstone or the polishing pad.

4. The processing apparatus according to claim 1 , wherein the inspection unit comprises:
a liquid-filled chamber;
a plurality of laser diodes configured and arranged to irradiate light through the liquid-filled chamber toward the workpiece;
an objective lens configured and arranged to receive light originating from the laser diodes and then reflected from the workpiece; and
a light reception element for turning light passed through the objective lens into current to be used for determining whether a process mark has exceeded the threshold value.

5. The processing apparatus according to claim 1 , wherein the process mark comprises a scratch.

6. The processing apparatus according to claim 1 , wherein the inspection unit comprises:
a plurality of laser diodes configured and arranged to irradiate light toward the workpiece;
an objective lens configured and arranged to receive light originating from the laser diodes and then reflected from the workpiece; and
a light reception element for turning light passed through the objective lens into current to be used for determining whether a process mark has exceeded the threshold value.

7. The processing apparatus according to claim 1 , wherein the threshold value is based on a size of a process mark at which the workpiece is considered to be an unacceptable product.

8. A processing method for a workpiece in which a processing apparatus is used, the processing apparatus including a chuck table configured to hold a workpiece in the form of a plate by a holding face thereof, a processing unit configured to process the workpiece held on the chuck table with a grinding whetstone or a polishing pad, a movement unit configured to relatively move the chuck table and the processing unit in a direction parallel to the holding face, a processing feeding unit configured to relatively move the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit configured to inspect a process mark caused by earlier processing of the workpiece during processing by the processing unit, a dressing unit configured to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit configured to control the processing unit, the movement unit, the processing feeding unit, the inspection unit, and the dressing unit, in which, when a process mark caused by earlier processing of a size exceeding a threshold value is detected on the process face of the workpiece by the inspection unit, the control unit causes the processing of the workpiece to be stopped and then causes, after the grinding whetstone or the polishing pad is dressed by the dressing unit, the processing of the workpiece to be re-started, the processing method comprising:
a protective member sticking step of sticking a protective member to a surface side of a workpiece; and
a processing step of detecting, while a rear face side of the workpiece held on the chuck table with the protective member interposed therebetween is processed by the grinding whetstone or the polishing pad, a process mark, which appears on the rear face of the workpiece, by the inspection unit,
at the processing step, responsive to a determination that the grinding whetstone or the polishing pad needs to be dressed because it has been determined that a size of a process mark exceeds the threshold value, the processing of the workpiece is stopped, and after the grinding whetstone or the polishing pad is dressed by the dressing unit, processing of the workpiece is re-started.

9. The processing method according to claim 8 , wherein the process mark comprises a scratch.

10. The processing method according to claim 8 , wherein the threshold value is based on a size of a process mark at which the workpiece is considered to be an unacceptable product.

11. A processing method for a workpiece in which a processing apparatus is used, the processing apparatus including a chuck table configured to hold a workpiece in the form of a plate by a holding face thereof, a processing unit configured to process the workpiece held on the chuck table with a grinding whetstone or a polishing pad, a movement unit configured to relatively move the chuck table and the processing unit in a direction parallel to the holding face, a processing feeding unit configured to relatively move the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit configured to inspect a process mark of the workpiece during processing by the processing unit, a dressing unit configured to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit configured to control the processing unit, the movement unit, the processing feeding unit, the inspection unit and the dressing unit, the processing method comprising:
a protective member sticking step of sticking a protective member to a surface side of a workpiece; and
a processing step of detecting, while a rear face side of the workpiece held on the chuck table with the protective member interposed therebetween is processed by the grinding whetstone or the polishing pad, a scratch caused during processed by the grinding whetstone or the polishing pad, which appears on the rear face of the workpiece, by the inspection unit,
responsive to a determination that the grinding whetstone or the polishing pad needs to be dressed, based on the processing step of detecting, that a scratch of a size exce

Assignees

• Disco Corp

Inventors

• Sekiya Kazuma

Classifications

• H10P90/123

  by grinding or lapping · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B53/02 Primary

  of plane surfaces on abrasive tools (B24B53/017 takes precedence) · CPC title

• B24D7/16

  Bushings; Mountings · CPC title