Method of forming a packaged semiconductor device having enhanced wettable flank and structure

Patent metadata

Field	Value
Publication number	US-10529655-B2
Application number	US-201816229077-A
Country	US
Kind code	B2
Filing date	Dec 21, 2018
Priority date	Sep 9, 2017
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.

First claim

What is claimed is:

1. A packaged electronic device comprising:
a substrate comprising:
a conductive pattern layer;
a conductive pillar layer disposed on a first portion of the conductive pattern layer, wherein:
the conductive pillar layer and the first portion of conductive pattern layer provide a first terminal portion and a second portion of the conductive pattern layer provides a second terminal portion;
the first terminal portion and the second terminal portion are configured as a lead;
the first terminal portion comprises a first thickness;
the second terminal portion comprises an inward facing side surface having a second thickness that is less than the first thickness; and
the first terminal portion comprises an outward facing side surface of the lead;

an electronic device electrically coupled to the lead;
a package body encapsulating the electronic device; and
a conductive layer disposed on the outward facing side surface of the lead.

2. The packaged electronic device of claim 1 , wherein:
the conductive pattern layer further comprises a pad; and
the electronic device is disposed adjacent to the pad.

3. The packaged electronic device of claim 2 , wherein:
the conductive layer is disposed on a surface of the pad; and
the conductive layer is disposed on a surface of the second terminal portion.

4. The packaged electronic device of claim 1 , wherein:
the second terminal portion is provided absent the conductive pillar layer;
the outward facing side surface of the lead comprises an outward facing recessed side surface; and
the conductive layer is disposed on a vertical portion of the outward facing recessed side surface.

5. The packaged electronic device of claim 4 , wherein:
the conductive layer is disposed on a horizontal portion of the outward facing recessed surface.

6. The packaged electronic device of claim 1 , wherein:
the substrate further comprises a molded layer covering portions of the conductive pillar layer and at least portions of the second portion of the conductive pattern layer;
a portion of the package body physically contacts at least a portion of an upper surface of the molded layer; and
the conductive pillar layer comprises a bottom surface exposed to the outside of the molded layer.

7. The packaged electronic device of claim 6 , wherein:
the conductive pattern layer is recessed below the upper surface of the molded layer.

8. The packaged electronic device of claim 1 , wherein:
the substrate further comprises a molded layer covering portions of the conductive pillar layer and at least portions of the second portion of the conductive pattern layer; and
the outward facing side surface of the lead is exposed in a side surface of the molded layer.

9. A packaged electronic device comprising:
a substrate comprising:
a conductive pattern layer;
a conductive pillar layer disposed on a first portion of the conductive pattern layer, wherein:
the conductive pillar layer and the first portion of the conductive pattern layer provide a first terminal portion and a second portion of the conductive pattern layer provides a second terminal portion;
the first terminal portion and the second terminal portion are configured as a lead;
the first terminal portion comprises an outward facing side surface of the lead; and
a molded layer covering portions of the conductive pillar layer and at least portions of the second portion of the conductive pattern layer;

an electronic device electrically coupled to the lead;
a package body encapsulating the electronic device; and
a conductive layer disposed on the outward facing side surface of the lead.

10. The packaged electronic device of claim 9 , wherein:
the first terminal portion comprises a first thickness; and
the second terminal portion comprises an inward facing side surface having a second thickness that is less than the first thickness.

11. The packaged electronic device of claim 9 , wherein:
the conductive pillar layer has a thickness that is greater than that of the conductive pattern layer.

12. The packaged electronic device of claim 9 , wherein:
the conductive pattern layer further comprises a pad;
the electronic device is disposed adjacent to the pad; and
the pad is provided absent the conductive layer.

13. The packaged electronic device of claim 9 , wherein:
the second terminal portion and the conductive pillar layer do not overlap in a cross-sectional view; and
the outward facing side surface of the lead comprises an outward facing recessed side surface exposed in a side surface of the molded layer.

14. The packaged electronic device of claim 9 , wherein:
the electronic device is attached to the conductive pattern layer with a conductive bump in a flip-chip configuration.

15. A method of forming a packaged electronic device, comprising:
providing a substrate comprising:
a lead comprising:
a first terminal portion having a first thickness; and
a second terminal portion having an inward facing side surface and having a second thickness that is less than the first thickness;

removing a first portion of the first terminal portion to provide the first terminal portion with a first outward facing side surface of the lead while leaving a second portion of the first terminal portion intact;
forming a conductive layer on the first outward facing side surface of the lead;
electrically coupling an electronic device to the lead;
providing a package body encapsulating the electronic device and portions of the lead; and
singulating the second portion of the first terminal portion and the package body to provide the first terminal portion with a second outward facing side surface that is offset from the first outward facing side surface, wherein the second terminal portion remains intact as part of the packaged electronic device.

16. The method of claim 15 , wherein:
both removing the first portion of the terminal portion and forming the conductive layer occur after electrically coupling the electronic device to the lead and after forming the package body;
forming the conductive layer comprises:
plating the conductive layer; and
using the second portion of the first terminal portion as an electrical path for the plating step.

17. The method of claim 15 , wherein:
providing the substrate comprises providing the inward facing side surface comprising a portion that is recessed inward.

18. The method of claim 15 , wherein:
removing the first portion of the first terminal portion comprises partially sawing into the first terminal portion; and
singulating comprises leaving part of the second portion of the first terminal portion intact as part of the packaged electronic device.

19. The method of claim 15 , wherein:
providing the substrate comprises providing the substrate having a pad;
the method further comprises attaching the electronic device to the pad;
electrically coupling the electronic device to the lead comprises using a conductive connective structure attached to the electronic device and attached the lead.

20. The method of claim 19 , wherein:
electrically coupling the electronic device comprises physically attaching the conductive connective structure directly to the first terminal portion.

21. The method of claim 15 , wherein providing the substrate comprises:
providing a conductive substrate having a first major surface and a second major surface opposite to the first major surface, wherein the conductive substrate ha

Assignees

• Amkor Technology Inc

Inventors

• Rivera-Marty Pedro Joel

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title