Metal dot substrate and method of manufacturing metal dot substrate
US-2015293025-A1 · Oct 15, 2015 · US
US10526696B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10526696-B2 |
| Application number | US-201916250929-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 17, 2019 |
| Priority date | Jul 26, 2016 |
| Publication date | Jan 7, 2020 |
| Grant date | Jan 7, 2020 |
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A molecular sensor includes a substrate defining a substrate plane, and a plurality of pairs of electrode sheets above or below the substrate at an angle to the substrate plane. The molecular sensor further includes a plurality of inner dielectric sheets between each electrode sheet in each pair of electrode sheets of the plurality of pairs, and an outer dielectric sheet between each pair of electrode sheets of the plurality of pairs.
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What is claimed is: 1. A method of manufacturing a structure usable in a molecular sensor device, the method comprising the steps of: providing a substrate that defines a substrate plane and further comprises a protrusion protruding from the substrate at an angle to the substrate plane; placing a sacrificial layer on a surface of the protrusion that is opposite from the substrate; depositing a first electrode layer in an orientation along a side of the protrusion to form a first electrode sheet at the angle to the substrate plane; depositing an inner dielectric layer on the first electrode layer to form an inner dielectric sheet at the angle to the substrate plane; depositing a second electrode layer on the inner dielectric layer to form a second electrode sheet at the angle to the substrate plane, wherein the first electrode sheet and the second electrode sheet form a pair of electrode sheets with the inner dielectric sheet between the first electrode sheet and the second electrode sheet; depositing an outer dielectric layer on the second electrode layer to form an outer dielectric sheet at an angle to the substrate plane; removing the sacrificial layer; attaching a mechanically supportive block material adjacent to the outer dielectric layer; planarizing the first and second electrode sheets, inner dielectric sheet, and the outer dielectric sheet; and removing an exposed end portion of the inner dielectric sheet to form a groove located on an exposed end portion of the inner dielectric sheet. 2. The method of claim 1 , wherein the steps of depositing the first electrode layer, depositing the inner dielectric layer, depositing the second electrode layer, and depositing the outer dielectric layer are repeated at least once to provide at least two pairs of the first and second electrode sheets, wherein each pair is separated by an outer dielectric sheet. 3. The method of claim 1 , wherein the inner dielectric layer is deposited with a first thickness, and wherein the outer dielectric layer is deposited with a second thickness of at least one order of magnitude greater than the first thickness. 4. The method of claim 1 , wherein removing an exposed end portion of the inner dielectric sheet further comprises measuring an electrical, capacitance, or optical measurement between the pair of electrode sheets to indicate when to cease removal. 5. The method of claim 1 , further comprising depositing a dielectric cover layer at an angle or perpendicular to the first and second electrode sheets opposite the substrate to define a gap exposing a portion of the pair of electrode sheets. 6. The method of claim 1 , further comprising roughening an exposed edge of the first and second electrode sheets. 7. The method of claim 1 , further comprising connecting a first and a second lead conductor to the first and second electrode sheets with the first lead conductor connected to the first electrode sheet, and the second lead conductor connected to the second electrode sheet, wherein each lead conductor diverges in width as the lead conductor extends away from an edge of the electrode sheet. 8. The method of claim 1 , further comprising depositing a gate electrode parallel to the substrate plane and perpendicular to an electrode plane defined by an electrode sheet in the first and second electrode sheets. 9. The method of claim 1 , further comprising forming a channel arranged to introduce a fluid to exposed portions of the first and second electrode sheets. 10. The method of claim 1 , wherein the sacrificial layer comprises a physically removable plate or a dissolvable polymer.
Methods for sequencing · CPC title
involving nanosized elements, e.g. nanogaps or nanoparticles (nanopores G01N33/48721; magnetic beads G01N27/745) · CPC title
Static structures not provided for in groups B81C1/00031 - B81C1/00119 · CPC title
Electrodes · CPC title
Microfluidics not provided for in B81B2201/051 - B81B2201/054 · CPC title
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