Surface acoustic wave (SAW) resonator

Patent metadata

Field	Value
Publication number	US-10523178-B2
Application number	US-201514866394-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Aug 25, 2015
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A surface of the layer has a smoothness sufficient to foster atomic bonding between layer and the substrate. A plurality of features provided on a surface of the piezoelectric layer reflects acoustic waves and reduces the incidence of spurious modes in the piezoelectric layer.

First claim

The invention claimed is:

1. A surface acoustic wave (SAW) filter comprising a plurality of SAW resonator structures, one or more of the plurality of SAW resonator structures comprising:
a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;
a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein at least some of the plurality of features have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode;
a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and
an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between a second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein at least some of the plurality of features have a height in a range of approximately 0.1 μm to approximately 2.50 μm, and the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer.

2. A SAW filter as claimed in claim 1 , wherein at least some of the plurality of features in the second surface of the piezoelectric layer have substantially slanted sides.

3. A SAW filter as claimed in claim 1 , wherein the plurality of features are substantially not in a regular pattern.

4. A SAW filter as claimed in claim 1 , wherein the SAW filter is a ladder filter, comprising the plurality of SAW resonators structures.

5. A SAW filter as claimed in claim 1 , wherein the oxide layer comprises silicon dioxide (SiO 2 ).

6. A SAW filter as claimed in claim 1 , wherein two or more of the plurality of SAW resonator structures are configured in a series and shunt configuration.

7. A SAW filter as claimed in claim 1 , wherein the oxide layer comprises phosphosilicate glass (PSG).

8. A SAW filter as claimed in claim 1 , wherein the oxide layer comprises borosilicate glass (BSG).

9. A surface acoustic wave (SAW) resonator structure, comprising:
a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;
a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein the plurality of features in the second surface of the piezoelectric layer are substantially pyramidal in shape;
a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and
an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between the second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein the plurality of features each have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode, and the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer.

10. A SAW resonator structure as claimed in claim 9 , wherein the oxide layer comprises silicon dioxide (SiO 2 ).

11. A SAW resonator structure as claimed in claim 9 , wherein the acoustic waves reflected from the plurality of features destructively interfere with acoustic waves in the piezoelectric layer.

12. A SAW resonator structure as claimed in claim 9 , wherein each of the plurality of features have a height in a range of approximately 0.25 μm to approximately 1.5 μm.

13. A SAW resonator structure as claimed in claim 9 , wherein each of the plurality of features have a height in a range of approximately 0.1 μm to approximately 2.50 μm.

14. A surface acoustic wave (SAW) filter comprising a plurality of SAW resonator structures, one or more of the plurality of SAW resonator structures comprising:
a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;
a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein at least some of the plurality of features have a height of approximately one-fourth of a wavelength (¼ λ) of a spurious mode;
a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and
an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between a second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein the at least some of the plurality of features have a height in a range of approximately 0.25 μm to approximately 1.5 μm, and the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer.

15. A SAW filter as claimed in claim 14 , wherein at least some of the plurality of features in the second surface of the piezoelectric layer have substantially slanted sides.

16. A SAW filter as claimed in claim 14 , wherein the SAW filter is a ladder filter, comprising the plurality of SAW resonators structures.

17. A SAW filter as claimed in claim 14 , wherein the oxide layer comprises silicon dioxide (SiO 2 ).

18. A SAW filter as claimed in claim 14 , wherein two or more of the plurality of SAW resonator structures are configured in a series and shunt configuration.

19. A surface acoustic wave (SAW) resonator structure, comprising:
a polycrystalline or monocrystalline silicon substrate having a first surface and a second surface;
a piezoelectric layer disposed over the polycrystalline or monocrystalline silicon substrate, the piezoelectric layer having a first surface, and a second surface comprising a plurality of features, wherein the plurality of features in the second surface of the piezoelectric layer are substantially pyramidal in shape;
a plurality of electrodes disposed over the first surface of the piezoelectric layer, the plurality of electrodes configured to generate surface acoustic waves in the piezoelectric layer; and
an oxide layer disposed between the first surface of the polycrystalline or monocrystalline silicon substrate and the second surface of the piezoelectric layer, a second surface of the oxide layer being atomically smooth to foster atomic bonding between the second surface of the oxide layer and the first surface of the polycrystalline or monocrystalline silicon substrate, wherein: the plurality of features have a plurality of heights, the plurality of features reflect acoustic waves and reduce an incidence of a plurality of spurious modes in the piezoelectric layer, and each of the

Assignees

• Avago Tech Int Sales Pte Lid

Inventors

• Gilbert Stephen Roy
• Ruby Richard C

Classifications

• H03H9/02574 Primary

  of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title

• H03H9/02614

  Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves · CPC title

• H03H9/02866

  of bulk wave excitation and reflections · CPC title

• H03H9/6483

  Ladder SAW filters · CPC title

• H03H9/02622

  of the surface, including back surface · CPC title