Direct-bonded native interconnects and active base die

Patent metadata

Field	Value
Publication number	US-10522352-B2
Application number	US-201715725030-A
Country	US
Kind code	B2
Filing date	Oct 4, 2017
Priority date	Oct 7, 2016
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

Direct-bonded native interconnects and active base dies are provided. In a microelectronic architecture, active dies or chiplets connect to an active base die via their core-level conductors. These native interconnects provide short data paths, which forgo the overhead of standard interfaces. The system saves redistribution routing as the native interconnects couple in place. The base die may contain custom logic, allowing the attached dies to provide stock functions. The architecture can connect diverse interconnect types and chiplets from various process nodes, operating at different voltages. The base die may have state elements for drive. Functional blocks aboard the base die receive native signals from diverse chiplets, and communicate with all attached chiplets. The chiplets may share processing and memory resources of the base die. Routing blockages are minimal, improving signal quality and timing. The system can operate at dual or quad data rates. The architecture facilitates ASIC, ASSP, and FPGA ICs and neural networks, reducing footprint and power requirements.

First claim

The invention claimed is:

1. A method, comprising:
direct-bonding, a native core-side conductor of a first die with a conductor of a second die to make a native interconnect between the first die and the second die, the native interconnect extending a circuit of the first die across a die boundary between the first die and the second. die, the circuit spanning across the native interconnect; and
passing a native signal between a core of the first die and at least a functional block of the second die through the circuit spanning across the native interconnect.

2. The method of claim 1 , wherein instances of the native interconnect provide an only interface between the first die and the second die; and
wherein the native interconnects forgo standard interface geometries and is protocols.

3. The method of claim 1 , wherein both the first die and the second die connect to each other through their respective native conductors comprising the native interconnect.

4. The method of claim. 1 , wherein the first die is fabricated by a first manufacturing process node and the second die is fabricated by a different second manufacturing process node.

5. The method of claim 1 , wherein the circuit spanning across the native interconnect forgoes interface protocols and input/output protocols between the first die and the second die when passing the native signal across the native interconnect.

6. The method of claim 1 , further comprising implementing a single functional block across at least the first die and the second die, wherein the first die and the second die are adjacent and in communication with each other through an interface.

7. The method of claim 6 , wherein the interface comprises a native interconnect.

8. The method of claim 6 , wherein the interface spans across the first die and the second die.

9. The method of claim 6 , wherein the interface resides on a separate die with respect to a remainder of the single functional block.

10. The method of claim 1 , wherein the native interconnect provides an interface between the first die and the second die when the first die and the second die are face-to-face, face-to-back, or back-to-back.

11. The method of claim 1 , further comprising:
direct-bonding native core-side conductors of multiple dies across multiple die boundaries of the multiple dies to make multiple native interconnects among the multiple dies; and
spanning the circuit across the multiple die boundaries through the multiple native interconnects, the multiple native interconnects providing interfaces between the multiple dies, the interfaces forgoing interface protocols and input/output protocols between the multiple dies.

12. The method of claim 11 , further comprising passing the native signal between a functional block of the first die of the multiple dies and one or more functional blocks of one or more other dies of the multiple dies through one or more of the native interconnects while forgoing interface protocols and input/output protocols between the multiple dies.

13. The method of claim 1 , further comprising passing the native signal unmodified between the core of the first die and the at least one functional block of the second die through the circuit spanning across the native interconnect.

14. The method of claim 1 , further comprising level shifting the native signal between the core of the first die and the at least one functional block of the second die through the circuit spanning across the native interconnect, the level shifting to accommodate a difference in operating voltages between the first die and the second die.

15. The method of claim 1 , further comprising performing a wafer-to-wafer (W2W) bonding process, herein the first die is on a first wafer and the second die is on a second wafer; and
wherein the W2W bonding process comprises direct-bonding native core-side conductors of the first die with conductors of the second die to make native interconnects between the first die and the second die, the native interconnects extending one or more circuits across a die boundary between the first die and the second die, the one or more circuits spanning across the one or more native interconnects, the native interconnects providing an interface between respective dies, the interface forgoing interface protocols and input/output protocols between the respective dies.

16. The method of claim 15 , wherein the first wafer and the second wafer are fabricated from heterogeneous foundry nodes or the first die and the second die are fabricated from incompatible manufacturing processes.

17. The method of claim 15 , further comprising direct bonding the native core-side conductors between some parts of the first wafer and the second wafer to make the native interconnects for passing the native signals; and
creating other interfaces or standard interfaces on other parts of the wafer for passing amplified signals in a microelectronic device resulting from the W2W process.

18. The method of claim 1 , wherein the first die or the second die comprises an active base die.

19. The method of claim 18 , further comprising incorporating at least one through semiconductor via (TSV), at least one through oxide via (TOV), or at least one through glass via (TGV) into the active base die to extend a conductive path from a first side of the active base die to a second side of the active base die.

20. The method of claim 1 , wherein the first die comprises a chiplet including an IP logic core and the second die comprises an active base die.

21. The method of claim 20 , wherein the chiplet has a size in a range from 0.25×0.25 microns up to a size of the active base die.

22. The method of claim 20 , further comprising direct-bonding multiple chiplets to the active base die to make respective native interconnects; and
channeling two-way communication between at least one functional block in the active base die and the multiple chiplets.

23. The method of claim 20 , further comprising stacking the active base die and the multiple chiplets in a stack or a 3D stack IC structure having muitiple layers, wherein each layer in the stack or the 3D stack IC structure is direct-bonded to make the native interconnects between the dies of the different layers.

Assignees

• Xcelsis Corp

Inventors

• Delacruz Javier A
• Teig Steven L
• Huang Shaowu
• Plants William C
• Fisch David Edward

Classifications

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W70/023

  Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title