Heat transfer in magnetic assemblies

US10510485B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10510485-B2
Application numberUS-201615358867-A
CountryUS
Kind codeB2
Filing dateNov 22, 2016
Priority dateAug 8, 2014
Publication dateDec 17, 2019
Grant dateDec 17, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing. A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a magnetic assembly comprising: determining an outer contour of a winding by three-dimensionally scanning the outer contour of the winding; forming a contoured interior surface on a housing; and assembling the winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing. 2. A method as recited in claim 1 , further comprising: determining the outer contour of the winding, wherein forming a contoured interior surface includes forming the contoured interior surface to have a substantially constant gap width between the winding and the interior surface. 3. A method as recited in claim 2 , further comprising: further comprising disposing potting material between the winding and the interior surface of the housing for electrical insulation between the winding and the housing and for thermal conduction between the winding and the housing. 4. A method as recited in claim 1 , further comprising: determining the outer contour of the winding, wherein forming a contoured interior surface includes forming the contoured interior surface to match the contour determined for the winding. 5. A method as recited in claim 1 , wherein forming the contoured interior surface includes forming the contoured interior surface to conform to individual strands of the winding. 6. A method as recited in claim 1 , wherein forming the contoured interior surface includes using additive manufacturing to form the contoured interior surface based on the outer contour determined. 7. A method as recited in claim 1 , wherein forming the contoured interior surface includes using computer numerical control (CNC) machining to form the contoured interior surface based on the outer contour determined. 8. A method of manufacturing a magnetic assembly comprising: determining an outer contour of a winding by three-dimensionally scanning the outer contour of the winding; forming a contoured interior surface on a housing; assembling the winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing; and determining the outer contour of the winding, wherein forming a contoured interior surface includes forming the contoured interior surface to have a substantially constant gap width between the winding and the interior surface, wherein forming the contoured interior surface includes forming the contoured interior surface to conform to individual strands of the winding. 9. A method as recited in claim 8 , further comprising: further comprising disposing potting material between the winding and the interior surface of the housing for electrical insulation between the winding and the housing and for thermal conduction between the winding and the housing. 10. A method as recited in claim 8 , further comprising: determining the outer contour of the winding, wherein forming a contoured interior surface includes forming the contoured interior surface to match the contour determined for the winding. 11. A method as recited in claim 8 , wherein forming the contoured interior surface includes using additive manufacturing to form the contoured interior surface based on the outer contour determined. 12. A method as recited in claim 8 , wherein forming the contoured interior surface includes using computer numerical control (CNC) machining to form the contoured interior surface based on the outer contour determined.

Assignees

Inventors

Classifications

  • Windings disposed upon ring cores · CPC title

  • Fixed inductances not covered by group H01F17/00 · CPC title

  • H01F27/022Primary

    Encapsulation · CPC title

  • Constructional details relating to cooling · CPC title

  • Cooling by heat conduction through solid or powdered fillings · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10510485B2 cover?
A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing. A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surf…
Who is the assignee on this patent?
Hamilton Sundstrand Corp
What technology area does this patent fall under?
Primary CPC classification H01F27/022. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).