Solid-state imaging device and solid-state imaging apparatus

Patent metadata

Field	Value
Publication number	US-10506186-B2
Application number	US-201615772584-A
Country	US
Kind code	B2
Filing date	Oct 14, 2016
Priority date	Nov 12, 2015
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

[Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.

First claim

The invention claimed is:

1. A solid-state imaging device, comprising:
a package including wiring and a recess;
a seal glass attached to the package, wherein the seal glass closes the recess;
a solid-state image sensor in a space formed by the recess and the seal glass; and
a shield in the space and on the package, wherein
the shield comprises a die bonding film that includes a magnetic material,
the die bonding film bonds the solid-state image sensor to the package, and
the shield is configured to prevent an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.

2. The solid-state imaging device according to claim 1 , wherein the shield is between the solid-state image sensor and the package.

3. The solid-state imaging device according to claim 1 , wherein the shield is around the solid-state image sensor.

4. The solid-state imaging device according to claim 1 , wherein
the shield includes a first shield and a second shield, and
the first shield and the second shield are at a distance between the solid-state image sensor and the package.

5. The solid-state imaging device according to claim 1 , wherein the shield comprises the magnetic material.

6. A solid-state imaging apparatus, comprising:
a solid-state imaging device including:
a package including wiring and a recess;
a seal glass attached to the package, wherein the seal glass closes the recess;
a solid-state image sensor in a space formed by the recess and the seal glass; and
a shield in the space and on the package, wherein
the shield comprises a die bonding film that includes a magnetic material,
the die bonding films bonds the solid-state image sensor to the package, and
the shield is configured to prevent an arrival of magnetic force lines generated from the wiring at the solid-state image sensor; and

an optical system configured to collect incident light on the solid-state image sensor.

7. A solid-state imaging device, comprising:
a package including wiring and a recess;
a seal glass attached to the package, wherein the seal glass closes the recess;
a solid-state image sensor in a space formed by the recess and the seal glass; and
a shield in the space and arranged on the package, wherein
the shield comprises a die bonding film that includes a conductor made of one of copper or iron,
the die bonding film bonds the solid-state image sensor to the package, and
the shield is configured to prevent an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.

Assignees

• Sony Corp

Inventors

• Tsukada Atsushi
• KISHIDA Eiichirou
• Nakatsuru Daisuke
• Kaji Hiroyuki

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title