Encapsulation of thermal energy storage media

Patent metadata

Field	Value
Publication number	US-10501668-B2
Application number	US-201715683146-A
Country	US
Kind code	B2
Filing date	Aug 22, 2017
Priority date	Dec 18, 2012
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

In one embodiment, a method for depositing metal on a polymer surface, the method includes coating the polymer surface with a binding metal to render the polymer surface solvophillic and/or hydrophilic and depositing a further metal on the binding metal-coated polymer surface.

First claim

The invention claimed is:

1. A method for depositing metal on a polymer surface, the method comprising:
obtaining a hydrophobic polymer having a surface;
powder coating the surface of the hydrophobic polymer with small particles of a binding metal to render the polymer surface solvophillic and/or hydrophilic;
electrolessly depositing a first layer of plating metal on the binding metal-coated polymer surface to render the surface electrically conductive; and
directly depositing via electroplating a second layer of plating metal on the first layer of plating metal such that no other material is provided between the first and second layers of plating metal.

2. The method of claim 1 , wherein the hydrophobic polymer comprises polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), perfluoroalkoxy (PFA), polyimide, polyvinylidene fluoride (PVDF), or mixtures thereof.

3. The method of claim 1 , wherein powder coating comprises applying nickel, palladium, aluminum, copper, or alloys thereof to the surface of the hydrophobic polymer.

4. The method of claim 1 , wherein the particles are approximately 2 to 30 microns in diameter.

5. The method of claim 1 , wherein powder coating comprises one of rubbing, jar milling, or rolling the particles onto the surface of the hydrophobic polymer.

6. The method of claim 1 , wherein the first layer of plating metal comprises copper, nickel, tin, palladium, cobalt, silver, zinc or alloys thereof.

7. The method of claim 1 , wherein the second layer of plating metal comprises copper, nickel, tin, palladium, cobalt, silver, zinc or alloys thereof.

8. The method of claim 1 , wherein electrolessly depositing comprises first applying a catalyst to the binding metal-coated polymer surface.

9. The method of claim 8 , wherein applying a catalyst comprises applying a catalyst precursor using an organic solvent solution.

10. The method of claim 8 , wherein electrolessly depositing comprises electrolessly depositing the first layer of plating metal using a water-based process.

11. The method of claim 8 , wherein electrolessly depositing comprises electrolessly depositing the first layer of plating metal using an organic solvent-based process.

12. The method of claim 11 , wherein the organic solvent-based process comprises decomposing a metal precursor either thermally or by application of a reducing agent.

Assignees

• Dhau Jaspreet
• Goswami D Yogi
• Jotshi Chand K
• Stefanakos Elias K
• Univ South Florida

Inventors

• Dhau Jaspreet
• Goswami D Yogi
• Jotshi Chand K
• Stefanakos Elias K

Classifications

• F28F21/06

  of plastics material · CPC title

• F28F2225/00

  Reinforcing means · CPC title

• F28F2255/06

  composite, e.g. polymers with fillers or fibres · CPC title

• C23C18/1641

  Organic substrates, e.g. resin, plastic · CPC title

• F28D20/023

  the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure · CPC title