Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article

Patent metadata

Field	Value
Publication number	US-10501620-B2
Application number	US-201414780758-A
Country	US
Kind code	B2
Filing date	Mar 27, 2014
Priority date	Mar 29, 2013
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polyvalent structure in a ratio of content of 30 wt % or more is provided.

First claim

The invention claimed is:

1. A curable epoxy composition comprising an epoxy compound (A), active ester compound (B), and triazine structure-containing phenol resin (C), wherein the epoxy compound (A) includes a polyvalent epoxy compound (A-1) which has an alicyclic condensed polycyclic structure in a ratio of content of 30 wt % or more and wherein a ratio of content of the triazine structure-containing phenol resin (C) with respect to the active ester compound (B) is less than 0.2 as a weight ratio [triazine structure-containing phenol resin (C)/active ester compound (B)].

2. The curable epoxy composition according to claim 1 , wherein the epoxy compound (A) further includes an alicyclic epoxy compound (A-2).

3. The curable epoxy composition according to claim 1 , wherein the epoxy compound (A) is such that the content ratio of a bisphenol type epoxy compound is less than 30 wt %.

4. The curable epoxy composition according to claim 1 , wherein the polyvalent epoxy compound (A-1) which has an alicyclic condensed polycyclic structure is a phenol novolac type epoxy compound which has an alicyclic condensed polycyclic structure.

5. The curable epoxy composition according to claim 1 , further comprising an alicyclic olefin polymer which contains an aromatic ring and/or hetero atom and does not have reactivity with an epoxy group.

6. A film comprising the curable epoxy composition according to claim 1 .

7. A laminated film having a binder layer which comprises the curable epoxy composition according to claim 1 and a plateable layer which comprises a platable layer-use resin composition.

8. The laminated film according to claim 7 , wherein the plateable layer includes an alicyclic olefin polymer in 50 wt % or more.

9. A prepreg comprising the film according to claim 6 and a fiber base material.

10. A laminate obtained by laminating a substrate with the film according to claim 6 .

11. A cured article obtained by curing the curable epoxy composition according to claim 1 .

12. A cured article obtained by curing the film according to claim 6 .

13. A cured article obtained by curing the laminated film according to claim 7 .

14. A cured article obtained by curing the prepreg according to claim 9 .

15. A cured article obtained by curing the laminate according to claim 10 .

16. A composite article obtained by forming a conductor layer on a surface of the cured product according to claim 11 .

17. A composite article obtained by forming a conductor layer on a surface of the cured product according to claim 12 .

18. A composite article obtained by forming a conductor layer on a surface of the cured product according to claim 13 .

19. A composite article obtained by forming a conductor layer on a surface of the cured product according to claim 14 .

20. A composite article obtained by forming a conductor layer on a surface of the cured product according to claim 15 .

21. A board for an electronic material comprising the cured article according to claim 11 .

Assignees

• Intel Corp

Inventors

• Fujimura Makoto
• Tateishi Yohei
• Sakano Takeshi

Classifications

• B32B27/12

  next to a fibrous or filamentary layer · CPC title

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• C08L63/08 Primary

  Epoxidised polymerised polyenes · CPC title

• D06M2101/00

  Chemical constitution of the fibres, threads, yarns, fabrics or fibrous goods made from such materials, to be treated · CPC title

• B32B2260/046

  Synthetic resin · CPC title