Laser machining systems and methods with vision correction and/or tracking

Patent metadata

Field	Value
Publication number	US-10500677-B2
Application number	US-201715439262-A
Country	US
Kind code	B2
Filing date	Feb 22, 2017
Priority date	Oct 10, 2008
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

First claim

What is claimed is:

1. A laser machining system comprising:
a part handling system including a workpiece support surface for supporting a workpiece to be machined;
at least one stationary laser source for generating at least one laser beam;
at least one laser scanning stage positioned relative to the part handling system for linear movement along a scanning axis, wherein the stationary laser source is not located on the laser scanning stage;
a movable optical head located on the laser scanning stage and movable relative to the laser source and without moving the laser source, the optical head including a beam delivery system for receiving the beam and modifying the beam while moving;
a beamsplitter between the stationary laser source and the movable optical head for splitting the at least one beam emitted from the laser source to provide a portion of the at least one beam for tracking;
a beam position tracking system comprising a position detector for receiving the portion of the at least one laser beam, wherein the position detector is located such that a beam path from the laser source to the position detector is at least as long as a working distance of the laser beam from the laser source to the workpiece; and
a base supporting at least the position tracking system, wherein the portion of the at least one beam from the beamsplitter is wrapped around the base to provide long working distance detection.

2. The laser machining system of claim 1 wherein the position detector is located such that a beam path from the laser source to the position detector is at least twice as long as a working distance of the laser beam from the laser source to the workpiece.

3. The laser machining system of claim 1 wherein the position detector is located in the optical head.

4. The laser machining system of claim 1 wherein the beam path passes through the optical head.

5. The laser machining system of claim 1 further comprising at least one fast steering mirror for changing a direction of the laser beam generated by the laser source in response to changes in position detected by the position detector.

6. The laser machining system of claim 1 further comprising at least one fast steering mirror between the laser source and the beamsplitter for changing a direction of the laser beam generated by the laser source in response to changes in position detected by the position detector.

7. The laser machining system of claim 6 further comprising at least one scribe sensor for sensing a position of a previous scribe line on the workpiece as the optical head moves, wherein the fast steering mirrors are configured to change a direction of the laser beam in response to feedback from the scribe sensor.

8. The laser machining system of claim 1 wherein the position detector is coupled to the optical head.

9. The laser machining system of claim 1 wherein the position detector is a quad detector.

10. The laser machining system of claim 1 further comprising a sensor for measuring a height of the process plane of the workpiece on the workpiece support surface as the optical head moves.

11. The laser machining system of claim 1 wherein the beam delivery system in the movable optical head is configured to modify the laser beam by forming multiple beamlets and delivering the multiple beamlets to the workpiece.

12. The laser machining system of claim 1 wherein the beam delivery system includes a mask and at least one lens.

13. A laser machining system comprising:
a part handling system including a workpiece support surface for supporting a workpiece to be machined;
at least one stationary laser source for generating at least one laser beam;
at least one laser scanning stage positioned relative to the part handling system for linear movement along a scanning axis, wherein the stationary laser source is not located on the laser scanning stage;
a movable optical head located on the laser scanning stage and movable relative to the laser source and without moving the laser source, the optical head including a beam delivery system for receiving the beam and modifying the beam while moving; and
a beam position tracking system comprising a position detector for receiving a portion of the at least one laser beam, wherein the position detector is located such that a beam path from the laser source to the position detector is at least as long as a working distance of the laser beam from the laser source to the workpiece, and wherein the position detector is located in the optical head.

Assignees

• Ipg Photonics Corp

Inventors

• Sercel Jeffrey P
• Lemmo Donald J
• Murphy Jr Terrence A
• Roberts Lawrence
• Loomis Tom
• Sokol Miroslaw

Classifications

• B23K26/0892

  Controlling the laser beam travel length · CPC title

• B23K9/1087

  Arc welding using remote control · CPC title

• B23K26/066

  by using masks · CPC title

• B23K9/1006

  Power supply · CPC title

• B23K26/067

  Dividing the beam into multiple beams, e.g. multi-focusing · CPC title