Sealed device housing with particle film-initiated low thickness laser weld and related methods

Patent metadata

Field	Value
Publication number	US-10497898-B2
Application number	US-201615778333-A
Country	US
Kind code	B2
Filing date	Nov 22, 2016
Priority date	Nov 24, 2015
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 μm, and the inorganic particle layer has an average thickness of less than or equal to 5 μm.

First claim

What is claimed is:

1. A laser weldable device housing substrate comprising:
a first surface;
a second surface opposite the first surface; and
a thin inorganic particle layer supported by the first surface, the inorganic particle layer comprising a plurality of particles arranged in a layer on the first surface, the particles having an average diameter of less than or equal to 1.0 μm, and the inorganic particle layer having an average thickness of less than or equal to 5 μm;
wherein the inorganic particle layer is formed from a mono-layer of the particles located on the first surface; and
wherein at least a portion of the particles of the inorganic particle layer are arranged in a hexagonal close-packed arrangement on the first surface.

2. The laser weldable device housing substrate of claim 1 , wherein the substrate comprises at least one of a glass material and a glass-ceramic material that has a first coefficient of thermal expansion, where the particles of the inorganic particle layer are at least one of glass particles and inorganic particles, wherein the inorganic particle layer has a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is greater than the first coefficient of thermal expansion.

3. The laser weldable device housing substrate of claim 2 , wherein the difference between the second coefficient of thermal expansion and the first coefficient of thermal expansion is greater than 1%, wherein the average diameter of the particles of the inorganic particle layer is greater than or equal to 1 nm.

4. The laser weldable device housing substrate of claim 3 , wherein the inorganic particle layer further comprises a surfactant material associated with the particles, the surfactant material supporting the particles in a dispersion prior to deposition on the first surface.

5. The laser weldable device housing substrate of claim 1 , wherein at least a portion of the particles of the inorganic particle layer have an aggregate morphology, wherein the particles form aggregates forming a layer having a thickness of less than 5 μm.

6. The laser weldable device housing substrate of claim 1 , wherein the particles of the inorganic particle layer absorb greater than 15% of incident laser energy in at least one of the ultraviolet, infrared or visible spectrums, such that the inorganic particle layer is capable of forming a laser weld between the first surface and a surface of a second substrate.

7. The laser weldable device housing substrate of claim 6 , wherein the particles of the inorganic particle layer are formed from at least one of a low melting glass (LMG) having a Tg less than 600 degrees C., a borosilicate glass material, an alumino-silicate glass material, ZnO, TiO 2 , SnO 2 , and a bi-borate material, wherein the substrate comprises a glass or glass-ceramic material that is at least one of a soda lime glass material, an alumino-silicate glass material, a borosilicate glass material, a phosphate glass material, and alumina, or aluminum nitride glass-ceramic material.

8. A sealed electronic device housing comprising:
a first substrate having a first surface;
a second substrate having a second surface facing the first surface; and
an inorganic particle-initiated laser weld joining the first surface to the second surface using a mono-layer of inorganic particles, wherein at least a portion of the inorganic particles are arranged in a hexagonal close-packed arrangement on the first surface, wherein the laser weld surrounds a chamber defined between the first substrate, the second substrate and the laser weld, wherein the laser weld has a maximum thickness of less than 5 um and is formed from materials of the first and second substrates joined together.

9. The sealed electronic device housing of claim 8 , wherein the first and second substrates are glass or glass-ceramic substrates, wherein the inorganic particle-initiated laser weld is formed from a laser absorbing inorganic particle layer including a glass or inorganic particulate material that is different from the material of at least one of the first substrate and the second substrate.

10. The sealed electronic device housing of claim 9 , wherein the material of the inorganic particle layer absorbs greater than 15% of incident light in at least one of the ultraviolet, infrared or visible spectrums, wherein the material of the first and second substrates absorbs less than 5% of incident light in at least one of the ultraviolet, infrared or visible spectrums.

11. The sealed electronic device housing of claim 10 , wherein the material of the inorganic particle layer is at least one of a low melting glass (LMG) having a Tg less than 600 degrees C., a borosilicate glass material, an alumino-silicate glass material, ZnO, TiO 2 , SnO 2 , and a bi-borate material, and the material of the inorganic particle layer is surrounded by the material of the first and second substrates within the laser weld.

12. The sealed electronic device housing of claim 11 , wherein the first and second substrates each comprise a glass or glass-ceramic material that is at least one of a soda lime glass material, an alumino-silicate glass material, a borosilicate glass material, and alumina, or aluminum nitride glass-ceramic material.

13. The sealed electronic device housing of claim 8 , wherein the composition of material within the laser weld is at least 90% the same as the material composition of at least one of the first substrate and the second substrate.

14. The sealed electronic device housing of claim 8 , wherein the inorganic particle-initiated laser weld forms a hermetic seal between the first and second substrates surrounding the chamber, wherein an active device is located within the chamber.

15. A method of forming a hermetically laser sealable device housing comprising:
providing a first substrate having a first surface; and
applying an inorganic particle layer to the first surface, the inorganic particle layer comprising a plurality of particles arranged in a layer on the first surface, the particles having an average diameter of less than 1.5 μm and the inorganic particle layer having an average thickness of less than 5 μm, wherein the particles are at least one of a glass material and an inorganic material;
wherein the inorganic particle layer is formed from a mono-layer of the particles located on the first surface; and
wherein at least a portion of the particles of the inorganic particle layer are arranged in a hexagonal close-packed arrangement on the first surface.

16. The method of claim 15 , wherein applying the inorganic particle layer on the first surface comprises applying an inorganic particle solution onto the first surface.

17. The method of claim 15 , wherein applying the inorganic particle layer comprises at least one of dip coating the first substrate in an aqueous inorganic particle solution and printing an aqueous inorganic particle solution onto the first surface.

18. The method of claim 17 , wherein the aqueous inorganic particle solution includes a surfactant material bonded to the particles such that the particles form a dispersion within the aqueous solution.

19. The method of claim 15 , further comprising:
providing a second substrate having a second surface;
positioning the second substrate such that the first surface of the first substrate faces the second surface, and the second surface contacts the inorganic particle layer; and
directing a laser at the inorganic particle layer, wherein the inorganic particle layer absorbs ener

Assignees

• Corning Inc

Inventors

• Boek Heather Debra
• Chang Theresa
• Dabich Ii Leonard Charles
• Lewis Mark Alan
• Logunov Stephan Lvovich
• Quesada Mark Alejandro
• Senaratne Wageesha
• Streltsov Alexander Mikhailovich

Classifications

• C03C2205/00

  Compositions applicable for the manufacture of vitreous enamels or glazes · CPC title

• B23K26/24

  Seam welding · CPC title

• C03C8/24

  Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders · CPC title

• C03C8/02

  Frit compositions, i.e. in a powdered or comminuted form · CPC title

• H01L51/56

  Electricity · mapped topic