Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
US-10497637-B2 · Dec 3, 2019 · US
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Patent family 57490421
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57490421 |
| Family type | — |
| Earliest priority | Apr 16, 2015 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10497637B2 — Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink |
Representative publication
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US10497637B2 — Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink (published Dec 3, 2019)
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