Modular layered heater system
US-10159116-B2 · Dec 18, 2018 · US
US10494107B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10494107-B2 |
| Application number | US-201715397552-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 3, 2017 |
| Priority date | Jan 3, 2017 |
| Publication date | Dec 3, 2019 |
| Grant date | Dec 3, 2019 |
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A multilayer structure for deicing an aircraft airfoil component includes an electrically and thermally insulating bottom layer formed in a defined pattern directly on the aircraft airfoil component, an electrothermal middle layer of electrically resistant heater element arrays formed in the defined pattern on the electrically and thermally insulating bottom layer, and a thermally conductive and electrically insulating top layer encapsulating the electrically and thermally insulating bottom layer and the electrothermal middle layer of electrically resistant heater element arrays. The multilayer structure may be directly applied to the airfoil component by direct writing/additive manufacturing, and may be done with the assistance of a multi-axis robot.
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The invention claimed is: 1. A multilayer structure for deicing an aircraft airfoil component, comprising: an electrically and thermally insulating bottom layer formed in a defined pattern directly on the aircraft airfoil component; an electro-thermal middle layer of electrically resistant heater element arrays formed in the defined pattern on the electrically and thermally insulating bottom layer; and a thermally conductive and electrically insulating top layer encapsulating the electrically and thermally insulating bottom layer and the electro-thermal middle layer of electrically resistant heater element arrays. 2. The structure of claim 1 , wherein the bottom layer is composed of a polymer, ceramic, or mixture thereof. 3. The structure of claim 2 , wherein the bottom layer comprises polyimide, silicone, fluoropolymer, glass, UV curable resin, polymers with additives or insulating oxides. 4. The structure of claim 2 , wherein the bottom layer comprises a ceramic or composite including aluminum oxide, polymer matrix composites, glass, or nitride based coatings. 5. The structure of claim 1 , wherein the heater element arrays comprise silver, iron, chromium, copper, nickel, cobalt, aluminum and alloys thereof, graphene, graphite, carbon black, carbon nanotubes, carbon nanofibers and/or mixtures thereof. 6. The structure of claim 1 wherein the top layer comprises aluminum nitride, vanadium oxide, boron nitride, silicon nitride, silicon oxycarbide, silicon carbide, silicate based glass mixtures and additives with high thermal conductivity including silicon carbide, boron carbide, carbon nanotubes, graphene, diamond, and/or mixtures thereof. 7. The multilayer structure of claim 1 , wherein the electrically and thermally insulating bottom layer and the electrothermal middle layer of electrically resistant heater element arrays are formed by additive manufacturing. 8. The multilayer structure of claim 7 , wherein additive manufacturing comprises aerosol jet deposition, extrusion, ink jet, micro-cold spray deposition, miniaturized thermal spray deposition, ultrasonic spray deposition and/or combinations thereof. 9. The multilayer structure of claim 1 , wherein trace widths of the heater element arrays are from 15 microns to 3 millimeters and trace thicknesses of the heater element arrays are from 100 nanometers to 1 millimeter. 10. A method of forming a multilayer structure for deicing an aircraft airfoil component, the method comprising: forming a bottom layer of electrically and thermally insulating material in a defined pattern directly on the airfoil component by additive manufacturing; forming an electrothermal middle layer of electrically resistant heater element arrays in the defined pattern on the electrically and thermally insulating bottom layer by additive manufacturing; and forming a thermally conductive and electrically insulative top layer encapsulating the electrically and thermally insulating bottom layer and the electro-thermal middle layer of electrically resistant heater element arrays by additive manufacturing or thermal spraying. 11. The method of claim 10 , wherein additive manufacturing comprises aerosol jet deposition, extrusion, ink jet, micro-cold spray deposition, miniaturized thermal spray deposition, ultrasonic spray deposition and/or combinations thereof. 12. The method of claim 10 , wherein the heater element arrays comprise silver, iron, chromium, copper, nickel, cobalt, aluminum and alloys thereof, graphene, graphite, carbon black, carbon nanotubes, carbon nanofibers and/or mixtures thereof. 13. The method of claim 12 , wherein trace widths of the heater element arrays are from 15 microns to 3 millimeters and trace thicknesses of the heater element arrays are from 100 nanometers to 1 millimeter. 14. The method of claim 10 , wherein the top layer comprises aluminum nitride, vanadium oxide, boron nitride, silicon nitride, silicon oxycarbide, silicon carbide, silicate based glass, boron nitride, and additives with high thermal conductivity including silicon carbide, boron carbide, carbon nanotubes, graphene, diamond, and/or mixtures thereof. 15. The method of claim 10 , wherein each layer of the additively manufactured multilayer structure is formed using a multi-axis robot. 16. The method of claim 15 , wherein the multi-axis robot is a 5 axis robot. 17. The method of claim 10 , wherein forming the bottom layer of electrically and thermally insulating material in a defined pattern directly on the airfoil component by additive manufacturing comprises curing the material with ultraviolet radiation, a laser, microwave irradiation, thermal exposure, and/or combinations thereof. 18. The method of claim 10 , wherein the electrical and thermally insulating material is composed of a polymer, ceramic, and/or mixtures thereof. 19. The method of claim 18 , wherein the bottom layer comprises polyimide, silicone, fluoropolymer, glass, UV curable resin, polymers with additives, insulating oxides and/or mixtures thereof. 20. The structure of claim 18 , wherein the bottom layer comprises ceramic or composite including aluminum oxide, polymer matrix composites, glass, nitride based coatings, and/or mixtures thereof.
the insulating base being an inorganic material, e.g. ceramic (H05B3/262 takes precedence) · CPC title
the insulating base being an insulated metal plate · CPC title
Heaters using resistive films or coatings · CPC title
the insulating base being an organic material, e.g. plastic (H05B3/262 takes precedence) · CPC title
Heaters specially designed for de-icing or protection against icing · CPC title
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