T-die and method of manufacturing the same

US10493565B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10493565-B2
Application numberUS-201615264189-A
CountryUS
Kind codeB2
Filing dateSep 13, 2016
Priority dateSep 4, 2012
Publication dateDec 3, 2019
Grant dateDec 3, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

On at least the edge portion (9e) of the lip portion (9) of a T-die (1), a cladding layer (10) is provided. The cladding layer is formed by laser build-up welding to a base material with a powder of a corrosion resistant and wear resistant alloy comprising a nickel-based alloy or a cobalt-based alloy. The cladding layer has a metallographic structure in which metal borides are dispersed in a binder phase. The lip portion has high quality and has high durability. The manufacturing costs of the T-die can also be kept relatively low.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a T-die, the T-die including a die main body, the die main body being provided therein with a fluid material flow channel, and the die main body having a lip portion that forms a slit-shaped discharge portion at a tip end of the fluid material flow channel, the method including: providing a base material forming the die main body and having a first surface that is a lip mating face, a second surface that is a lip end face, and a third surface that connects the first surface and the second surface and is inclined thereto; thereafter forming a cladding layer by laser build-up welding over the third surface with a powder of a corrosion resistant and wear resistant alloy; forming, after forming the cladding layer, a plating layer over the surface of the cladding layer and over the first and second surfaces of the base material; and thereafter grinding the plating layer and the cladding layer to remove the plating layer formed on the cladding layer such that the cladding layer is exposed and the cladding layer has first and second ground surfaces flush with first and second ground surfaces of the plating layer lying over the first and second surfaces of the base material, respectively. 2. The method according to claim 1 , wherein the width of the third surface is not smaller than 0.28 mm but not larger than 3 mm. 3. A method of manufacturing a T-die, the T-die including a die main body, the die main body being provided therein with a fluid material flow channel, and the die main body having a lip portion that forms a slit-shaped discharge portion at a tip end of the fluid material flow channel, the method including: providing a base material forming the die main body and having a first surface that is a lip mating face, a second surface that is a lip end face, and a third surface that connects the first surface and the second surface and is inclined thereto; thereafter forming a cladding layer by laser build-up welding over the third surface with a powder of a corrosion resistant and wear resistant alloy; grinding the cladding layer to cause the cladding layer to have a first ground surface, a second ground surface and an edge at an intersection of the first and second ground surfaces; grinding the first and second surfaces of the base material after the grinding of the cladding layer such that the first surface of the base material thus ground has a level lower than that of the first ground surface of the cladding layer and that the second surface of the base material thus ground has a level lower than that of the second ground surface of the cladding layer. 4. The method according to claim 3 , further comprising forming, after the grinding of the cladding layer and after the grinding of the first and second surfaces of the base material, a plating layer over the surface of the cladding layer and over the first and second surfaces of the base material; and thereafter grinding the plating layer and the cladding layer to remove the plating layer formed on the cladding layer such that the cladding layer is exposed and the cladding layer has first and second ground surfaces flush with first and second ground surfaces of the plating layer lying over the first and second surfaces of the base material, respectively. 5. The method according to claim 1 , wherein the method manufactures the T-die having the cladding layer extending at a first width within a range of 0.2 to 1.7 mm from the edge of the lip portion along a lip mating face, and extending at a second width within a range of 0.2 to 2.4 mm from the edge of the lip portion along a lip end face. 6. The method according to claim 1 , wherein the cladding layer has a metallographic structure in which metal borides or metal carbides are dispersed in a nickel-based or cobalt-based binder phase. 7. The method according to claim 6 , wherein the laser build-up welding uses a laser whose incident energy applied to the surface of the base material is within a range of 30 to 150 J/mm 2 .

Assignees

Inventors

Classifications

  • Non-ferrous metals or alloys · CPC title

  • Ceramics · CPC title

  • Materials, coating or lining therefor · CPC title

  • Coated articles {; Surface treated articles} · CPC title

  • having a wide opening, e.g. for forming sheets · CPC title

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Frequently asked questions

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What does patent US10493565B2 cover?
On at least the edge portion (9e) of the lip portion (9) of a T-die (1), a cladding layer (10) is provided. The cladding layer is formed by laser build-up welding to a base material with a powder of a corrosion resistant and wear resistant alloy comprising a nickel-based alloy or a cobalt-based alloy. The cladding layer has a metallographic structure in which metal borides are dispersed in a bi…
Who is the assignee on this patent?
Toshiba Machine Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C48/3003. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 03 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).