Porous copper body, porous copper composite part, method for manufacturing porous copper body, and method for manufacturing porous copper composite part

US10493528B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10493528-B2
Application numberUS-201615579688-A
CountryUS
Kind codeB2
Filing dateMay 23, 2016
Priority dateJun 12, 2015
Publication dateDec 3, 2019
Grant dateDec 3, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. A porous copper body, comprising: a skeleton having a three-dimensional network structure, wherein an oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, an oxygen concentration of an entirety of the skeleton is set to be 0.025 mass % or less, and a relative electrical conductivity is in a range of 17.4% to 45.2%. 2. The porous copper body according to claim 1 , wherein a specific surface area of an entirety of the porous copper body is set to be 0.01 m 2 /g or greater, and a porosity of the entirety of the porous copper body is set to be in a range of 50% to 90%. 3. The porous copper body according to claim 1 , wherein the skeleton is constituted by a sintered body made of a plurality of copper fibers, and in each of the copper fibers, a diameter R is set to be in a range of 0.02 mm to 1.0 mm, and a ratio L/R of a length L to the diameter R is set to be in a range of 4 to 2500. 4. A porous copper composite part, comprising: a main body of the composite part; and the porous copper body according to claim 1 bonded to the main body of the composite part. 5. The porous copper composite part according to claim 4 , wherein a bonding surface of the main body of the composite part, to which the porous copper body is bonded, is made of copper or a copper alloy, and the porous copper body and the main body of the composite part are bonded to each other through sintering. 6. The porous copper body according to claim 2 , wherein the skeleton is constituted by a sintered body made of a plurality of copper fibers, and in each of the copper fibers, a diameter R is set to be in a range of 0.02 mm to 1.0 mm, and a ratio L/R of a length L to the diameter R is set to be in a range of 4 to 2500. 7. A porous copper composite part, comprising: a main body of the composite part; and the porous copper body according to claim 2 bonded to the main body of the composite part. 8. A porous copper composite part, comprising: a main body of the composite part; and the porous copper body according to claim 3 bonded to the main body of the composite part. 9. The porous copper body according to claim 3 , wherein the ratio L/R is in a range of 4 to 50.

Assignees

Inventors

Classifications

  • Fibrous particles · CPC title

  • Alloys with open or closed pores · CPC title

  • B22F3/1143Primary

    involving an oxidation, reduction or reaction step · CPC title

  • Alloys based on copper · CPC title

  • of porous nature · CPC title

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Frequently asked questions

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What does patent US10493528B2 cover?
A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.
Who is the assignee on this patent?
Mitsubishi Materials Corp
What technology area does this patent fall under?
Primary CPC classification B22F3/1143. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 03 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).