Chip on printed circuit unit and display apparatus comprising the same

Patent metadata

Field	Value
Publication number	US-10490504-B2
Application number	US-201715638729-A
Country	US
Kind code	B2
Filing date	Jun 30, 2017
Priority date	Jun 30, 2016
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

Disclosed is a printed circuit unit that includes a flexible member which has an upper surface and a lower surface and includes a first end and a second end. An output pad is disposed at the first end and is implemented to be connected to a bent display panel. A connecting unit is disposed at the second end and is implemented to be connected to a system board, and a drive chip is located between the output pad and the connecting unit.

First claim

What is claimed is:

1. A printed circuit unit comprising:
a flexible member having first and second surfaces and having a multi-layered wiring layer including at least two conductive layers disposed at vertically different heights;
an circuit driving unit, on the flexible member, which performs signal processing for a display panel and a system control board;
a contact pad unit disposed on the flexible member, which provides an electrical interface between the driving unit and the display panel; and
a connecting unit disposed on the flexible member, which provides an electrical interface between the driving unit and the system control board, which eliminates a need of a separate printed circuit board having a separate connector thereon,
wherein the at least two conductive layers include a first layer including a first electrode and a first protective layer covering the first electrode, and a second layer including a second electrode and a second protective layer covering the second electrode, and the first electrode and the second electrode are insulated from each other,
wherein the driving unit and the connecting unit directly contact the first protective layer, and the first electrode and the second electrode are distanced from first and second surfaces of the flexible member, and
wherein the driving unit and the contact pad unit directly contact one electrode of the first electrode and the second electrode via a contact hole and the driving unit and the connecting unit directly contact the other electrode via a contact hole.

2. The printed circuit unit of claim 1 , wherein the connecting unit disposed at one end of the flexible member, the contact pad unit disposed at another end of the flexible member, and the driving unit disposed between the connecting unit and the contact pad unit, wherein the connecting unit, the contact pad unit and the driving unit are spaced apart from each other.

3. The printed circuit unit of claim 1 , wherein the one electrode provides a conductive path between the driving unit and the contact pad and the other electrode provides a conductive path between the driving unit and the connecting unit.

4. The printed circuit unit of claim 1 , wherein the first electrode electrically connected to the driving unit and the contact pad via a contact hole through the first protective layer, wherein the other electrode electrically connected to the driving unit and the connecting unit via a contact hole through both the first protective layer and the second protective layer.

5. The printed circuit unit of claim 1 , wherein the display panel is flexible with at least one end that is capable of being folded over and operatively connected with the contact pad unit.

6. The printed circuit unit of claim 1 , wherein the driving unit and the connecting unit are disposed both on the same surface of one of the first and second surfaces of the flexible member.

7. The printed circuit unit of claim 5 , wherein the integrated circuit and the connecting unit are respectively disposed on different surfaces of the first and second surfaces of the thin film substrate.

8. The printed circuit unit of claim 1 , wherein the contact pad unit directly contacts the first electrode and protrudes from the first protective layer.

Assignees

• Lg Display Co Ltd

Inventors

• Jo Suhyeon
• CHUNG NogSu

Classifications

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W76/60

  Seals · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/611 Primary

  for connecting multiple chips together · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title