Chip electronic component and board having the same
US-2016086719-A1 · Mar 24, 2016 · US
US10490338B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10490338-B2 |
| Application number | US-201816228737-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2018 |
| Priority date | Sep 23, 2016 |
| Publication date | Nov 26, 2019 |
| Grant date | Nov 26, 2019 |
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An inductor component having an element body includes two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and wound helically. Two external electrodes are provided in the element body and electrically connected to the coil. One of the external electrodes is formed over one of the end surfaces and the bottom surface while the other external electrode is formed over the other of the end surfaces and the bottom surface. The coil is formed such that an axial direction thereof is along the two end surfaces and the bottom surface. The coil includes a coil wiring wound along a plane orthogonal to the axial direction, and the aspect ratio of the coil wiring is 1.0 or more and less than 8.0.
Opening claim text (preview).
The invention claimed is: 1. An inductor component comprising: an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces; a coil provided in the element body and wound helically; and two external electrodes provided in/on the element body and electrically connected to the coil, wherein one of the external electrodes is formed over one of the end surfaces and the bottom surface while the other external electrode is formed over the other of the end surfaces and the bottom surface, wherein the coil is formed such that an axial direction thereof is along the two end surfaces, wherein the coil includes a coil wiring wound along a plane orthogonal to the axial direction, and wherein an aspect ratio of the coil wiring is 1.0 or more and less than 8.0. 2. The inductor component according to claim 1 , wherein the aspect ratio of the coil wiring is 1.5 or more and less than 6.0. 3. The inductor component according to claim 1 , wherein the coil wiring is made up of a plurality of coil conductor layers laminated in surface contact with each other. 4. The inductor component according to claim 3 , wherein the multiple coil conductor layers constituting the coil wiring are equal to each other in wiring length and are in surface contact with each other over the wiring length. 5. The inductor component according to claim 1 , wherein the wiring width of the coil wiring is 60 μm or less. 6. The inductor component according to claim 1 , wherein the coil wiring varies in wiring width along the axial direction, wherein the coil wiring has an inner surface partially projecting to the inside of the coil wiring, and wherein a ratio (e/c) of a projection amount e of the inner surface to a maximum wiring width c of the coil wiring is 20% or less. 7. The inductor component according to claim 6 , wherein the ratio (e/c) is 5% or less. 8. The inductor component according to claim 1 , wherein the coil wiring varies in wiring width along the axial direction, and wherein a ratio (a/c) of a difference (a) between a maximum wiring width (c) and a minimum wiring width of the coil wiring to the maximum width (c) is 40% or less. 9. The inductor component according to claim 3 , wherein the aspect ratio of the coil conductor layer is 2.0 or less. 10. The inductor component according to claim 3 , wherein no intervening layer exists between the coil conductor layers in surface contact and between the coil conductor layers and the element body. 11. The inductor component according to claim 3 , wherein an intervening layer exists in at least a portion between the coil conductor layers in surface contact and between the coil conductor layers and the element body. 12. The inductor component according to claim 10 , wherein a transverse cross section of the coil wiring has a T shape, an I shape, or a stacked shape of T. 13. The inductor component according to claim 3 , wherein the plurality of coil conductor layers constituting the coil wiring includes a first coil conductor layer and a second coil conductor layer having the same width in a coil radial direction, and wherein a ratio (d/c) of a deviation amount d between the center of the wiring width of the first coil conductor layer and the center of the wiring width of the second coil conductor layer to the wiring width c of the first coil conductor layer and the second coil conductor layer is 20% or less. 14. The inductor component according to claim 1 , wherein the length of the coil in the axial direction is equal to or greater than 50% of the width of the element body in the axial direction. 15. A method of manufacturing the inductor component according to claim 11 , wherein a portion of the plurality of coil conductor layers is formed by a semi-additive method. 16. A method of manufacturing the inductor component according to claim 11 , wherein the plurality of coil conductor layers is all formed by a semi-additive method. 17. A method of manufacturing the inductor component according to claim 11 , wherein a portion of the plurality of coil conductor layers is formed by plating growth. 18. The method of manufacturing the inductor component according to claim 15 , wherein a portion of the plurality of coil conductor layers is further formed by plating growth. 19. The method of manufacturing the inductor component according to claim 16 , wherein the plurality of coil conductor layers is all further formed by plating growth. 20. A method of manufacturing the inductor component according to claim 10 , comprising the steps of: forming a first groove in a first insulating layer constituting the element body; applying a photosensitive conductive paste into the first groove to form a first coil conductor layer in the first groove by a photolithographic method; forming a second insulating layer constituting the element body on the first insulating layer and forming a second groove in the second insulating layer; and applying a photosensitive conductive paste into the second groove to form a second coil conductor layer coming into surface contact with the first coil conductor layer in the second groove by a photolithographic method.
on stacked layers · CPC title
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