Detector unit for detector array of radiation imaging modality

Patent metadata

Field	Value
Publication number	US-10488532-B2
Application number	US-201415520439-A
Country	US
Kind code	B2
Filing date	Oct 20, 2014
Priority date	Oct 20, 2014
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

First claim

What is claimed is:

1. A detector unit for a detector array of a radiation imaging modality, comprising:
an electronics sub-assembly comprising:
an analog-to-digital (A/D) converter enclosed within a molding compound;
a photodetector array;
a first substrate disposed at a first surface of the electronics sub-assembly and between the molding compound and the photodetector array, wherein the first substrate electrically couples the electronics sub-assembly to the photodetector array;
a first coupling element that electrically couples the A/D converter to the first substrate, the first coupling element defining:
an analog signal route through the first coupling element in a first direction, from the first substrate to the A/D converter; and
a digital signal route back through the first coupling element in a second direction opposite the first direction, from the A/D converter to the first substrate;

a first interconnection layer disposed between a first surface of the first substrate and the photodetector array to electrically couple the first substrate to the photodetector array; and
a via formed within the molding compound and configured to electrically couple the first substrate to a second substrate.

2. The detector unit of claim 1 , wherein the first substrate comprises a printed circuit board.

3. The detector unit of claim 1 , wherein a second surface of the first substrate diametrically opposes the first surface of the first substrate.

4. The detector unit of claim 1 , wherein the via extends from the first substrate to a second surface of the electronics sub-assembly, the second surface diametrically opposing the first surface.

5. The detector unit of claim 1 , wherein the electronics sub-assembly further comprises:
a shielding element disposed, within the molding compound, between the A/D converter and the first substrate, the shielding element configured to shield the A/D converter from radiation.

6. The detector unit of claim 1 , wherein the first coupling element comprises a wirebond.

7. The detector unit of claim 1 , wherein the electronics sub-assembly further comprises:
a thermal conduction element configured to dissipate heat generated by the A/D converter.

8. The detector unit of claim 1 , wherein:
the first surface of the first substrate faces the A/D converter,
a first portion of the first surface of the first substrate is concealed by the molding compound and the A/D converter,
a second portion of the first surface of the first substrate, between a sidewall of the molding compound and a sidewall of the first substrate, is exposed, and
the electronics sub-assembly comprises a second coupling element in contact with the second portion of the first surface of the first substrate.

9. The detector unit of claim 1 :
further comprising a scintillator; and
wherein the photodetector array comprises:
a first photodetector;
a second photodetector adjacent the first photodetector; and
a channel configured to receive the analog signal from the first photodetector, the channel disposed below the first photodetector and the second photodetector.

10. The detector unit of claim 1 , wherein the electronics sub-assembly further comprises a photodetector support coupled to a portion of the photodetector array not overlapping the first substrate.

11. A radiation imaging modality, comprising:
an ionizing radiation source; and
a detector array configured to detect radiation generated by the ionizing radiation source, the detector array comprising:
a radiation detection sub-assembly, comprising:
a scintillator configured to generate luminescent photons based upon radiation impinging thereon; and
a photodetector array comprising at least one photodetector configured to detect at least some of the luminescent photons and to generate an analog signal based upon the at least some of the luminescent photons;

an electronics sub-assembly, comprising:
an analog-to-digital (A/D) converter enclosed within a molding compound and configured to convert the analog signal to a digital signal;
a first substrate disposed at a first surface of the electronics sub-assembly and between the molding compound and the photodetector array, wherein the first substrate electrically couples the electronics sub-assembly to the photodetector array; and
a first coupling element that electrically couples the A/D converter to the first substrate, the first coupling element defining:
a first signal route for the analog signal, the first signal route passing through the first coupling element in a first direction, from the first substrate to the A/D converter; and
a second signal route for the digital signal, the second signal route passing through the first coupling element in a second direction opposite the first direction, from the A/D converter to the first substrate;

a second substrate; and
a threaded mechanical fastener that threadingly couples the electronics sub-assembly to the second substrate, wherein at least a portion of the threaded mechanical fastener is enclosed within the molding compound.

12. The radiation imaging modality of claim 11 , wherein the electronics sub-assembly comprises:
a photodetector support coupled to a portion of the photodetector array not overlapping the first substrate.

13. A radiation imaging modality, comprising:
an ionizing radiation source; and
a detector array configured to detect radiation generated by the ionizing radiation source, the detector array comprising:
a radiation detection sub-assembly, comprising:
a scintillator configured to generate luminescent photons based upon radiation impinging thereon; and
a photodetector array comprising at least one photodetector configured to detect at least some of the luminescent photons and to generate an analog signal based upon the at least some of the luminescent photons;

an electronics sub-assembly, comprising:
an analog-to-digital (A/D) converter enclosed within a molding compound and configured to convert the analog signal to a digital signal; and
a first substrate disposed at a first surface of the electronics sub-assembly and between the molding compound and the photodetector array, wherein the first substrate electrically couples the electronics sub-assembly to the photodetector array, wherein:
a first surface of the first substrate faces the A/D converter,
a first portion of the first surface of the first substrate is concealed by the molding compound and the A/D converter, and
a second portion of the first surface of the first substrate, between a sidewall of the molding compound and a sidewall of the first substrate, is exposed;

a first coupling element configured to electrically couple the A/D converter to the first substrate, the first coupling element defining:
a first route for the analog signal, the first route passing from the first substrate, through the first coupling element in a first direction, to the A/D converter; and
a second route for the digital signal, the second route passing from the A/D converter, through the first coupling element in a second direction opposite the first direction, to the first substrate;

a second coupling element in contact with the second portion of the first surface of the first substrate;
a second substrate; and
a mechanical fastener coupling the electronics sub-assembly to the second substrate, wherein at least a portion of the mechanical fastener is enclosed within the molding compound.

Assignees

• Analogic Corp

Inventors

• Abenaim Daniel
• Luhta Randy
• Choquette Martin

Classifications

• G01T1/244

  Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like · CPC title

• G01T1/241

  Electrode arrangements, e.g. continuous or parallel strips or the like · CPC title

• G01T1/2018 Primary

  Scintillation-photodiode combinations · CPC title

• G01T1/20188

  Auxiliary details, e.g. casings or cooling · CPC title

• G01T1/20184 Primary

  Detector read-out circuitry, e.g. for clearing of traps, compensating for traps or compensating for direct hits · CPC title