Compact sensor module

Patent metadata

Field	Value
Publication number	US-9466594-B2
Application number	US-201414478810-A
Country	US
Kind code	B2
Filing date	Sep 5, 2014
Priority date	Feb 27, 2012
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

A compact sensor module and methods for forming the same are disclosed herein. In some embodiments, a sensor die is mounted on a sensor substrate. A processor die can be mounted on a flexible processor substrate. In some arrangements, a thermally insulating stiffener can be disposed between the sensor substrate and the flexible processor substrate. At least one end portion of the flexible processor substrate can be bent around an edge of the stiffener to electrically couple to the sensor substrate

First claim

What is claimed is:

1. A sensor module comprising:
a first substrate and a second substrate;
a sensor die in electrical communication with the first substrate and the second substrate;
a processor die in electrical communication with the first substrate and the second substrate; and
a stiffener having a first side and a second side opposite the first side,
wherein the first and second sides of the stiffener include major surfaces of the stiffener, the stiffener disposed between the sensor die and the processor die such that the first side faces the sensor die and a first normal line passes perpendicularly through the major surface of the first side and intercepts the sensor die, and such that the second side faces the processor die and a second normal line passes perpendicularly through the major surface of the second side and intercepts the processor die,
wherein one of the first and second substrates includes a bent portion and a mounting portion extending from the bent portion, the bent portion folded around an edge of the stiffener to electrically couple the sensor die and the processor die, and wherein the processor die is directly mounted to one of the first and second substrates and the sensor die is mounted over the other of the first and second substrates, and
wherein the stiffener is further disposed between a first portion of the first substrate and a second portion of the second substrate, such that the first normal line intercepts one of the first portion and the second portion and the second normal line intercepts the other of the first portion and the second portion.

2. The sensor module of claim 1 , wherein the second substrate includes the bent portion and the mounting portion, wherein the processor die is mounted to the mounting portion of the second substrate, and wherein an end portion of the second substrate extends from the bent portion opposite the stiffener from the mounting portion to electrically connect to the first substrate.

3. The sensor module of claim 2 , wherein the mounting portion of the second substrate is coupled to the second side of the stiffener.

4. The sensor module of claim 3 , wherein the mounting portion of the second substrate has a first surface facing the stiffener and a second surface opposite the first surface, and wherein the processor die is mounted on the second surface of the mounting portion.

5. The sensor module of claim 4 , further comprising a plurality of passive electrical components electrically coupled to the first surface of the mounting portion of the second substrate and positioned within at least one recess formed in the second side of the stiffener.

6. The sensor module of claim 1 , wherein the second substrate includes the bent portion and the mounting portion, and wherein first and second opposite end portions of the second substrate bend around edges of the stiffener to electrically connect to the first substrate.

7. The sensor module of claim 1 , wherein the second substrate includes the bent portion and the mounting portion, and wherein a first end portion of the second substrate is bent through a first aperture formed in the stiffener to electrically communicate with the first substrate.

8. The sensor module of claim 7 , wherein the first end portion is folded over at least part of the first side of the stiffener.

9. The sensor module of claim 1 , further comprising a radiation shield coupled with the first side of the stiffener.

10. The sensor module of claim 9 , wherein the radiation shield is housed within a recess formed in the first side of the stiffener.

11. The sensor module of claim 1 , wherein the sensor die comprises an image sensor die.

12. The sensor module of claim 11 , wherein the sensor die comprises a photodiode array.

13. An imaging device comprising an array of multiple sensor modules, each sensor module in the array comprising the sensor module of claim 1 .

14. The imaging device of claim 13 , wherein the imaging device is a CT device.

15. A sensor module comprising:
a first substrate and a second substrate;
a sensor die in electrical communication with the first substrate and the second substrate;
a processor die in electrical communication with the first substrate and the second substrate; and
a stiffener having a first side and a second side opposite the first side, wherein one of the first and second substrates includes a bent portion and a mounting portion extending from the bent portion, the bent portion folded around an edge of the stiffener to electrically couple the sensor die and the processor die, wherein a first segment of one of the first and second substrates is disposed along the first side of the stiffener and a second segment of one of the first and second substrates is disposed along the second side of the stiffener, wherein the processor die is directly mounted to one of the first and second substrates and the sensor die is mounted over the other of the first and second substrates, and
wherein the stiffener is further disposed between a first portion of the first substrate and a second portion of the second substrate, such that the first portion includes one of the first segment and the second segment and the second portion includes the other of the first segment and the second segment.

16. The sensor module of claim 15 , wherein the second substrate includes the bent portion and the mounting portion, wherein the processor die is mounted to the mounting portion of the second substrate, and wherein an end portion of the second substrate that extends from the mounting portion is bent around the edge of the stiffener to electrically connect to the first substrate.

17. The sensor module of claim 16 , wherein the stiffener is disposed between the first substrate and the mounting portion of the second substrate.

18. The sensor module of claim 17 , wherein the first and second sides of the stiffener include major surfaces of the stiffener, the stiffener disposed between the first substrate and the mounting portion of the second substrate such that the first side faces the first substrate and a first normal line passes perpendicularly through the major surface of the first side and intercepts the first substrate, and such that the second side faces the mounting portion of the second substrate and a second normal line passes perpendicularly through the major surface of the second side and intercepts the mounting portion of the second substrate.

19. A sensor module comprising:
a first substrate and a second substrate;
a sensor die in electrical communication with the first and second substrates;
a processor die in electrical communication with the first and second substrates; and
a stiffener having a first side including a recess formed therein and a second side opposite the first side, wherein one of the first and second substrates is bent around an edge of the stiffener to electrically couple the sensor die and the processor die, wherein a first segment of one of the first and second substrates is disposed along the first side of the stiffener and a second segment of one of the first and second substrates is disposed along the second side of the stiffener, wherein the stiffener is further disposed between a first portion of the first substrate and a second portion of the second substrate; and
a radiation shield disposed in the recess of the first side of the stiffener.

Assignees

• Analog Devices Inc

Inventors

• Bolognia David Frank

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10F77/60 Primary

  Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations · CPC title

• H10F39/804

  Containers or encapsulations · CPC title

• H10F30/29

  the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation · CPC title

• G01T1/16

  Measuring radiation intensity (G01T1/29 takes precedence {; self-powered detectors G01T3/006; using an ionisation chamber filled with a liquid or solid, e.g. frozen liquid, dielectric G01T3/008}) · CPC title