Platinum temperature sensor element

US10488270B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10488270-B2
Application numberUS-201715784695-A
CountryUS
Kind codeB2
Filing dateOct 16, 2017
Priority dateOct 17, 2016
Publication dateNov 26, 2019
Grant dateNov 26, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A temperature sensor element has such a structure as, when reinforcing lead wires on internal electrodes with a paste, one side surface of each of the lead wires is covered with a reinforcement paste and the other side surface is not covered with the reinforcement paste without covering the entire lead wires welded and connected to the internal electrodes. This allows elimination of cause of cracks generating, thereby securing sufficient joining strength and reinforcement of conductivity of the internal electrodes and the lead wires, and securing connection strength between the lead wires and the internal electrodes.

First claim

Opening claim text (preview).

What is claimed: 1. A platinum temperature sensor element comprising: an insulating substrate having a planar rectangular shape made of an insulating material with a predetermined thickness; a pattern made of a platinum resistance film formed on the insulating substrate; a pair of electrodes formed on either end along a length of the insulating substrate; lead wires that are joined to the respective paired electrodes and extend to an outside of the platinum temperature sensor element; and a protective film that is formed on a top side of the insulating substrate to cover the pattern, the paired electrodes, and top surfaces of joined regions of the lead wires to the paired electrodes; wherein: lower surfaces of ends of the lead wires are connected to a top surface of the electrodes, and one side surface of each of the lead wires and top surfaces of the pair of electrodes on the same side as the one side surfaces are only partially covered with a reinforcement paste on the joined regions; and each of multiple regions on the one side surface of each of the lead wires on the joined regions, or each of multiple regions on the one side surface and the other side surface of each of the lead wires on the joined regions are covered separately with the reinforcement paste. 2. The platinum temperature sensor element of claim 1 , wherein a concave part for housing the lead wires is formed on each of the pair of electrodes. 3. The platinum temperature sensor element of claim 1 , wherein the pair of electrodes, a surface protective material for the lead wires, and the reinforcement paste are made of a common precious metal material. 4. The platinum temperature sensor element of claim 3 , wherein the precious metal material includes at least platinum.

Assignees

Inventors

Classifications

  • Terminals or electrodes formed on resistive elements having positive temperature coefficient · CPC title

  • formed with two or more layers · CPC title

  • G01K7/18Primary

    the element being a linear resistance, e.g. platinum resistance thermometer (G01K7/26 takes precedence) · CPC title

  • G01K7/183Primary

    characterised by the use of the resistive element · CPC title

  • Elongated resistive element being bent or curved, e.g. sinusoidal, helical · CPC title

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What does patent US10488270B2 cover?
A temperature sensor element has such a structure as, when reinforcing lead wires on internal electrodes with a paste, one side surface of each of the lead wires is covered with a reinforcement paste and the other side surface is not covered with the reinforcement paste without covering the entire lead wires welded and connected to the internal electrodes. This allows elimination of cause of cr…
Who is the assignee on this patent?
Koa Corp
What technology area does this patent fall under?
Primary CPC classification G01K7/18. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).