Temperature sensor and thermal, flow measuring device

Patent metadata

Field	Value
Publication number	US-9810586-B2
Application number	US-201314436933-A
Country	US
Kind code	B2
Filing date	Sep 23, 2013
Priority date	Oct 19, 2012
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A temperature sensor comprising a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers, one of the temperature sensor elements is heatable, and from each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The circuit board is arranged in the housing chamber. The circuit board is positioned in the housing chamber by a snap-in connection. A connection wire of a first temperature sensor element is led with strain relief in a first direction through the circuit board and connected with such. The housing chamber contains at least a first elastic body. The circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of the circuit board. Also presented is a thermal, flow measuring device.

First claim

The invention claimed is:

1. A temperature sensor, comprising:
a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers; and
a circuit board, wherein:
one of said temperature sensor elements is heatable;
from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board;
said circuit board is arranged in said housing chamber;
said circuit board is positioned in said housing chamber by a snap-in connection; and
a terminally located part of said housing is embodied as a deep draw cap with a wall thickness of less than 2 mm, preferably less than 1.5 mm, especially less than 0.8 mm.

2. The temperature sensor as claimed in claim 1 , wherein:
said housing chamber has a reinforcing layer, which reinforcing layer has or forms a recess or protrusion for snap-in of said circuit board.

3. A temperature sensor, of a thermal, flow measuring device, comprising:
a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are embodied as thin-film resistance thermometers; and
a circuit board, wherein:
one of said temperature sensor elements is heatable;
from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board; and
a connection wire of a first temperature sensor element is led with strain relief in a first direction through said circuit board and connected with such.

4. The temperature sensor as claimed in claim 3 , wherein:
a connection wire of a second temperature sensor element is led with strain relief in a second direction opposite the first direction through said circuit board and connected with such.

5. The temperature sensor as claimed in claim 3 , wherein:
said connection wire of said first temperature sensor element is surrounded in the region of said circuit board with a potting compound.

6. A temperature sensor, of a thermal, flow measuring device, comprising:
a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are embodied as thin-film resistance thermometers; and
a circuit board, wherein:
one of said temperature sensor elements is heatable;
from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board; and
said housing chamber contains at least a first elastic body for guiding said connection wire.

7. The temperature sensor as claimed in claim 6 , wherein:
there is arranged in said housing chamber a second elastic body, which is supported on said first elastic body and/or on a wall of said housing and exerts a return force on said snapped-in circuit board.

8. The temperature sensor as a claimed in claim 6 , wherein:
said first elastic body is provided for lessening thermal and mechanical stresses on said connection wire in the case of tension loading.

9. The temperature sensor as claimed in claim 1 , wherein:
said housing chamber contains a potting compound; and
said temperature sensor elements are arranged free of potting compound in said housing chamber.

10. The temperature sensor as claimed in claim 6 , wherein:
said first and said second elastic bodies are silicone bodies.

11. A temperature sensor, of a thermal, flow measuring device, comprising:
a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are embodied as thin-film resistance thermometers; and
a circuit board, wherein:
one of said temperature sensor elements is heatable;
from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board;
said circuit board is arranged in said housing chamber;
said circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of said circuit board.

12. The temperature sensor as claimed in claim 11 , wherein:
said cavities, as holes, are arranged in conductive traces arranged on said circuit board.

13. The temperature sensor as a claimed in claim 11 , wherein:
the temperature sensor is embodied as a four conductor measuring device.

14. The thermal, flow measuring device, comprising a temperature sensor as claimed in claim 11 and an evaluation unit.

15. A temperature sensor, comprising:
a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers; and
a circuit board, wherein:
one of said temperature sensor elements is heatable;
from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board;
said circuit board is arranged in said housing chamber;
said circuit board is positioned in said housing chamber by a snap-in connection;
said housing chamber has a reinforcing layer, which reinforcing layer has or forms a recess or protrusion for snap-in of said circuit board; and
said reinforcing layer is mounted by material bonding to said housing body.

Assignees

• Endress & Hauser Flowtec Ag
• Endres + Hauser Flowtec Ag

Inventors

• Grun Alexander
• Schultheis Hanno
• Baur Tobias

Classifications

• G01F1/692

  Thin-film arrangements · CPC title

• G01F15/14

  Casings, e.g. of special material · CPC title

• G01K7/18

  the element being a linear resistance, e.g. platinum resistance thermometer (G01K7/26 takes precedence) · CPC title

• G01F1/696

  Circuits therefor, e.g. constant-current flow meters · CPC title

• G01F1/684 Primary

  Structural arrangements; Mounting of elements, e.g. in relation to fluid flow · CPC title