LED lighting device

Patent metadata

Field	Value
Publication number	US-10487989-B2
Application number	US-201815900340-A
Country	US
Kind code	B2
Filing date	Feb 20, 2018
Priority date	Mar 2, 2017
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

The present disclosure discloses an LED lighting device, which includes a head portion, a heat sink, a mounting portion, a lighting circuit and an optical element. The head portion is configured for mounting the LED lighting device to an outer installation device and electrically connecting the LED lighting device with an outer power source. The lighting circuit includes a circuit board and at least one LED light source arranged on one surface of the circuit board. The lighting circuit is held between the mounting portion and the optical element, and light emitted from the at least one LED light source is output after distributed by the optical element. The heat sink is held between the head portion and the mounting portion.

First claim

What is claimed is:

1. An LED lighting device, comprising a head portion, a heat sink, a mounting portion, a lighting circuit and an optical element; wherein:
the head portion is configured for mounting the LED lighting device to an outer installation device and electrically connecting the LED lighting device with an outer power source;
the lighting circuit comprises a circuit board and at least one LED light source arranged on one surface of the circuit board; the lighting circuit is held between the mounting portion and the optical element, and light emitted from the at least one LED light source is output after being distributed by the optical element; and
the heat sink is held between the head portion and the mounting portion and includes a flat main portion and an extension formed outwards from an outer periphery of the flat main portion where the extension extends beyond the outermost peripheries of the mounting portion, the lighting circuit, and the optical element, in both a radial direction and a light emission direction and at least a portion of the circuit board of the lighting circuit or the heat sink penetrates the mounting portion to make a direct thermal contact between the heat sink and the lighting circuit.

2. The LED lighting device according to claim 1 , wherein a location of a thermal contact portion of the heat sink in the direct thermal contact with the circuit board of the lighting circuit is aligned with the LED light sources arranged on another surface of the circuit board along a mounting direction.

3. The LED lighting device according to claim 1 , wherein at least one thermal contact portion is embossed from the heat sink to the lighting circuit, and at least one slot having a size slightly larger than that of at least one thermal contact portion is arranged in the mounting portion, wherein the at least one thermal contact portion penetrates the at least one slot and is configured to attach to and in thermal contact with the circuit board of the lighting circuit, and the location of the thermal contact portions in contact with the circuit board are aligned with the LED light sources arranged on another surface of the circuit board.

4. The LED lighting device according to claim 3 , wherein an opening is arranged in a middle of the heat sink, the heat sink is provided with a plurality of thermal contact portions arranged along an outer periphery of the opening of the heat sink, at least one slot is arranged in the mounting portion correspondingly, wherein each of the thermal contact portions are attached to the circuit board of the lighting circuit.

5. The LED lighting device according to claim 1 , wherein an opening is arranged in a middle of the heat sink, and a corresponding opening is arranged in the mounting portion, a driving element is arranged on at least one surface of the lighting circuit which is not provided with the LED light sources, wherein the driving element penetrates the openings of the mounting portion and the heat sink, and is accommodated in the head portion.

6. The LED lighting device according to claim 1 , wherein the LED lighting device is of straight-down type, and the respective elements of the LED lighting device are arranged along an up and down direction; light emitted from the LED light sources are output downwardly.

7. The LED lighting device according to claim 1 , wherein the mounting portion and the optical element are connected with each other to assemble the lighting circuit, the mounting portion and the optical element together.

8. The LED lighting device according to claim 1 , wherein the heat sink, the mounting portion and the circuit board of the lighting circuit each comprises at least a portion in flat form, and are arranged face to face with each other.

9. The LED lighting device according to claim 8 , wherein the heat sink has a flat main portion and an opening arranged in a middle of the main portion; a lower end of the head portion is arranged on an outer periphery of the opening.

10. The LED lighting device according to claim 9 , wherein the head portion comprises a head section and an intermediate section which are connected with each other, and a maximum outer diameter of the intermediate section is larger than a diameter of the opening of the heat sink.

11. The LED lighting device according to claim 1 , further comprising: a plurality of screws, a plurality of studs are arranged on the head portion, and the screws penetrate through the studs of the head portion, the heat sink, the mounting portion, and the lighting circuit, to latch with the optical element.

12. The LED lighting device according to claim 1 , wherein the LED light sources of the lighting circuit are arranged along an outer periphery of the circuit board, and the optical element is arranged with a recessed annular optical portion which is configured to receive the light emitted from the LED light sources and output the light after the light is distributed.

13. The LED lighting device according to claim 12 , wherein the optical element comprises a connecting portion disposed in a middle of the optical portion, wherein one end of the connecting portion extends from a center of the optical element and the other end is connected with an inner periphery side of the optical portion.

14. The LED lighting device according to claim 1 , wherein the optical element is an optical lens or a diffusion element.

15. A method of making an LED lighting device, comprising:
providing a head portion that is configured for mounting the LED lighting device to an outer installation device and electrically connecting the LED lighting device with an outer power source;
providing a lighting circuit that comprises a circuit board and at least one LED light source arranged on one surface of the circuit board, wherein the lighting circuit is held between a mounting portion and an optical element, and light emitted from the at least one LED light source is output after being distributed by the optical element; and
providing a heat sink that is held between the head portion and the mounting portion and includes a flat main portion and an extension formed outwards from an outer periphery of the flat main portion where the extension extends beyond the outermost peripheries of the mounting portion, the lighting circuit, and the optical element, in both a radial direction and a light emission direction wherein at least a portion of the circuit board of the lighting circuit or the heat sink penetrates the mounting portion to make a direct thermal contact between the heat sink and the lighting circuit.

16. The method according to claim 15 , wherein a location of a thermal contact portion of the heat sink in the direct thermal contact with the circuit board of the lighting circuit is aligned with the LED light sources arranged on another surface of the circuit board along a mounting direction.

17. The method according to claim 15 , wherein at least one thermal contact portion is embossed from the heat sink to the lighting circuit, and at least one slot having a size slightly larger than that of at least one thermal contact portion is arranged in the mounting portion, wherein the at least one thermal contact portion penetrates the at least one slot and is configured to attach to and in thermal contact with the circuit board of the lighting circuit, and the location of the thermal contact portions in contact with the circuit board are aligned with the LED light sources arranged on another surface of the circuit board.

18. The method according to claim 17 , wherein an openin

Assignees

• Opple Lighting Co Ltd

Inventors

• Cao Liang
• Chen Youfeng

Classifications

• F21V23/005

  the substrate is supporting also the light source · CPC title

• F21K9/235

  Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps (F21K9/238 takes precedence) · CPC title

• F21K9/232

  specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb · CPC title

• F21V17/12

  by screwing · CPC title

• F21K9/237 Primary

  Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases (F21K9/238 takes precedence) · CPC title