Sensor mounting in an implantable blood pump

Patent metadata

Field	Value
Publication number	US-10485911-B2
Application number	US-201715408136-A
Country	US
Kind code	B2
Filing date	Jan 17, 2017
Priority date	Aug 31, 2012
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

First claim

What is claimed is:

1. A method comprising:
mounting sensors to a circuit board to form a sensor assembly;
installing a mechanical carrier in a motor assembly, the mechanical carrier defining a predetermined alignment of the sensors with respect to the motor assembly;
after installing the mechanical carrier in the motor assembly, placing the circuit board of the sensor assembly in the mechanical carrier; and
positioning the sensors in the mechanical carrier such that the sensors are arranged in the predetermined alignment.

2. The method of claim 1 , wherein mounting the sensors to the circuit board comprises mounting the sensors to extensions of the circuit board, wherein the extensions extend to end regions having electrical interconnects disposed at the end regions, the extensions being more flexible than the end regions electrically connecting the sensors to the electrical interconnects.

3. The method of claim 2 , wherein positioning the sensors in the mechanical carrier in the predetermined alignment comprises flexing the extensions of the circuit board such that the sensors are positioned in the predetermined alignment within a predetermined tolerance.

4. The method of claim 3 , wherein flexing the extensions comprises flexing the extensions to a greater degree than the end regions having the electrical interconnects.

5. The method of claim 1 , wherein positioning the sensors in the mechanical carrier in the predetermined alignment comprises positioning the sensors axi-symmetrically.

6. The method of claim 1 , wherein positioning the sensors in the mechanical carrier in the predetermined alignment comprises positioning the sensors in the mechanical carrier such that the sensors are located to detect one or more motor parameters of an implantable blood pump.

7. The method of claim 1 , wherein positioning the sensors in the mechanical carrier in the predetermined alignment comprises placing the sensors in the mechanical carrier such that a guide member affixed to each sensor is received in a corresponding slot defined by the mechanical carrier.

8. The method of claim 1 , further comprising affixing a guide member to each of the sensors.

9. The method of claim 1 , further comprising, after positioning the sensors in the mechanical carrier in the predetermined alignment, removing a portion of the circuit board that extends inward beyond the sensors.

10. The method of claim 9 , wherein removing a portion of the circuit board comprises breaking off a portion of an end region along a perforated or scored line across the end region.

11. The method of claim 2 , wherein the extensions extend radially inward from an outer region of the circuit board, wherein the outer region is generally circular.

12. The method of claim 2 , wherein the circuit board comprises an opening with an outer region of the circuit board defining a closed boundary around the opening, and wherein the extensions extend radially inward from the outer region.

13. The method of claim 1 , further comprising detecting magnetic fields indicative of parameters of a motor of an implantable blood pump.

14. The method of claim 13 , wherein the parameters are indicative of a position of a rotor of the implantable blood pump.

15. The method of claim 13 , wherein the parameters are indicative of an angular position or angular velocity of a rotor of the implantable blood pump.

16. The method of claim 1 , further comprising detecting a voltage outputted by the sensors, when the voltage is directly proportional to a strength of a magnetic field that is located in proximity to pole pieces of a motor stator and a rotor of an implantable blood pump.

17. A method comprising:
mounting sensors to a circuit board to form a sensor assembly;
installing a mechanical carrier in a motor assembly, the mechanical carrier defining a predetermined alignment of the sensors with respect to the motor assembly;
placing the circuit board of the sensor assembly in the mechanical carrier;
positioning the sensors in the mechanical carrier such that the sensors are arranged in the predetermined alignment; and
after positioning the sensors in the mechanical carrier in the predetermined alignment, removing a portion of the circuit board that extends inward beyond the sensors.

18. The method of claim 17 , wherein removing a portion of the circuit board comprises breaking off a portion of an end region along a perforated or scored line across the end region.

19. The method of claim 17 , wherein mounting the sensors to the circuit board comprises mounting the sensors to extensions of the circuit board, wherein the extensions extend to end regions having electrical interconnects disposed at the end regions, the extensions being more flexible than the end regions electrically connecting the sensors to the electrical interconnects.

20. The method of claim 17 , wherein positioning the sensors in the mechanical carrier in the predetermined alignment comprises positioning the sensors axi-symmetrically.

Assignees

• Tc1 Llc

Inventors

• Mcchrystal Mark
• Stark Iii Joseph C

Classifications

• A61M2205/3365

  Rotational speed · CPC title

• G01B7/30

  for measuring angles or tapers; for testing the alignment of axes · CPC title

• Y10T29/49128

  Assembling formed circuit to base · CPC title

• Y10T29/49009

  Dynamoelectric machine · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title