Thermal interface material having defined thermal, mechanical and electric properties
US-2017117208-A1 · Apr 27, 2017 · US
Power conversion apparatus
US10483189B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10483189-B2 |
| Application number | US-201816151365-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 4, 2018 |
| Priority date | Oct 10, 2017 |
| Publication date | Nov 19, 2019 |
| Grant date | Nov 19, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached.
First claim
Opening claim text (preview).
What is claimed is: 1. A power conversion apparatus mounted in a vehicle, comprising: a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolant bodies are disposed by being alternately stacked, wherein the plurality of coolant bodies includes coolant passages; and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack, wherein the plurality of semiconductor modules and the plurality of coolant bodies are attached to each other by a resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of an outer surface of the plurality of coolant bodies to which the resin adhesive member is attached, and wherein the roughened area is formed on an entire outer surface of the plurality of coolant bodies. 2. The power conversion apparatus according to claim 1 , wherein a surface roughness of the roughened area is less than a thickness of the resin adhesive member. 3. The power conversion apparatus according to claim 1 , wherein a first metal plate is disposed at a first end of the plurality of semiconductor modules and a second metal plate is disposed at a second end of the plurality of semiconductor modules in the stacking direction, and the resin adhesive member covers a first surface of the first metal plate and a second surface of the second metal plate. 4. The power conversion apparatus according to claim 3 , wherein the roughened area and a non-roughened area on which the roughening treatment has not been performed are formed on a surface facing the plurality of semiconductor modules in the outer surface of the plurality of coolant bodies, and the roughened area extends to an outer side of the first metal plate and the second metal plate in the plurality of semiconductor modules in a sectional view in the stacking direction. 5. The power conversion apparatus according to claim 1 , wherein the resin adhesive member is formed by adding a filler having a higher thermal conductivity than that of a base material resin to the base material resin. 6. The power conversion apparatus according to claim 1 , wherein the resin adhesive member is a plate-shaped insulating resin adhesive member. 7. A power conversion apparatus mounted in a vehicle, comprising: a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolant bodies are disposed by being alternately stacked, wherein the plurality of coolant bodies includes coolant passages; and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack, wherein the plurality of semiconductor modules and the plurality of coolant bodies are attached to each other by a resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of an outer surface of the plurality of coolant bodies to which the resin adhesive member is attached, and wherein the roughened area and a non-roughened area on which the roughening treatment has not been performed are formed on a surface facing the plurality of semiconductor modules in the outer surface of the plurality of coolant bodies, and the roughened area extends to an outer side of a first metal plate and a second metal plate in the plurality of semiconductor modules in a sectional view in the stacking direction. 8. The power conversion apparatus according to claim 7 , wherein a surface roughness of the roughened area is less than a thickness of the resin adhesive member. 9. The power conversion apparatus according to claim 7 , wherein the first metal plate is disposed at a first end of the plurality of semiconductor modules and the second metal plate is disposed at a second end of the plurality of semiconductor modules in the stacking direction, and the resin adhesive member covers a first surface of the first metal plate and a second surface of the second metal plate. 10. The power conversion apparatus according to claim 7 , wherein the roughened area is formed on an entire outer surface of the plurality of coolant bodies. 11. The power conversion apparatus according to claim 7 , wherein the resin adhesive member is formed by adding a filler having a higher thermal conductivity than that of a base material resin to the base material resin. 12. The power conversion apparatus according to claim 7 , wherein the resin adhesive member is a plate-shaped insulating resin adhesive member.
Assignees
Inventors
Classifications
in encapsulations · CPC title
by flowing liquids, e.g. forced water cooling · CPC title
- H10W40/613Primary
for stacked arrangements of a plurality of semiconductor devices · CPC title
- H10W40/22Primary
characterised by their shape, e.g. having conical or cylindrical projections · CPC title
characterised by converters located in the vehicle · CPC title
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Frequently asked questions
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- What does patent US10483189B2 cover?
- A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attache…
- Who is the assignee on this patent?
- Honda Motor Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W40/613. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).