Semiconductor module unit and semiconductor module

Patent metadata

Field	Value
Publication number	US-2016190033-A1
Application number	US-201615066458-A
Country	US
Kind code	A1
Filing date	Mar 10, 2016
Priority date	Mar 19, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.

First claim

What is claimed is:

1 . A semiconductor module comprising:
a semiconductor element; an insulating circuit board having an insulating substrate, a circuit member electrically connected to the semiconductor element and disposed on one principal surface of the insulating substrate, and a first metal member disposed on another principal surface of the insulating substrate; a second metal member disposed on a side of an outer edge of the first metal member and at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion sealing the semiconductor element, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member bonding the cooler and the first metal member; and a second bonding member bonding the cooler and the second metal member.

2 . The semiconductor module according to claim 1 , wherein the first metal member and the second metal member are separated from each other.

3 . The semiconductor module according to claim 1 , wherein a boundary of the first bonding member and a boundary of the second bonding member are connected on a principal surface of the cooler.

4 . The semiconductor module according to claim 1 , wherein the second metal member covers at least a portion of a side surface of the molding resin portion.

5 . The semiconductor module according to claim 1 , wherein the second metal member has a frame shape that reinforces an outer shape of the molding resin portion.

6 . The semiconductor module according to claim 1 , wherein the second metal member has an uneven surface contacting the molding resin portion.

7 . The semiconductor module according to claim 1 , wherein the first bonding member and the second bonding member are metal bonding materials that do not contain lead.

8 . The semiconductor module according to claim 1 , wherein the first bonding member and the second bonding member are metal bonding materials that do not contain lead and have different compositions.

9 . The semiconductor module according to claim 1 , wherein the second metal member has unevenness on a surface contacting the second bonding member.

10 . The semiconductor module according to claim 9 , wherein the first bonding member is a metal bonding material that does not contain lead, and the second bonding member is a thermoplastic resin or a thermosetting resin.

11 . The semiconductor module according to claim 7 , wherein the first bonding member is a member in which silver particles are sintered.

12 . The semiconductor module according to claim 7 , wherein at least one metal layer selected from the group consisting of a nickel-plating layer, a gold-plating layer, a silver-plating layer, a tin-plating layer, and a copper-plating layer is provided on a surface of the second metal member contacting the second bonding member.

13 . The semiconductor module according to claim 7 , wherein at least one metal layer selected from the group consisting of a nickel-plating layer, a gold-plating layer, a silver-plating layer, a tin-plating layer, and a copper-plating layer is provided on a surface of the cooler contacting the second bonding member.

14 . The semiconductor module according to claim 7 , wherein at least one metal layer selected from the group consisting of a gold-plating layer and a silver-plating layer is provided in a portion of the cooler contacting the first bonding member and a portion of the first metal member contacting the first bonding member.

15 . The semiconductor module according to claim 1 , wherein the insulating substrate is a ceramic board mainly formed of at least one ceramic material selected from the group consisting of aluminum oxides, silicon nitrides, and aluminum nitrides.

16 . The semiconductor module according to claim 1 , wherein the second metal member is mainly formed of at least one material selected from the group consisting of copper, copper alloys, aluminum, and aluminum alloys.

17 . A semiconductor module unit adapted to be connected to a cooler, comprising:
a semiconductor element; an insulating circuit board having an insulating substrate, a circuit member electrically connected to the semiconductor element and disposed on one principal surface of the insulating substrate, and a first metal member disposed on another principal surface of the insulating substrate; a second metal member disposed on a side of an outer edge of the first metal member and at least partially disposed further toward an outer side than the insulating substrate; and a molding resin portion sealing the semiconductor element, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed, wherein the first metal member and the second metal member are adapted to be connected to the cooler.

Assignees

• Fuji Electric Co Ltd

Inventors

• Morozumi Akira
• Gohara Hiromichi
• Yamada Takafumi

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07636

  Soldering or alloying · CPC title

• H10W72/07336

  Soldering or alloying · CPC title