Printed active device with a 3D thermionic electronic component

US10483074B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10483074-B2
Application numberUS-201514658797-A
CountryUS
Kind codeB2
Filing dateMar 16, 2015
Priority dateMar 21, 2014
Publication dateNov 19, 2019
Grant dateNov 19, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of manufacturing an article with integral active electronic component uses an additive manufacturing process to: a) form a non-electrically conductive substrate; b) form a non-electrically conductive perforated layer having an aperture; c) form electrically conductive anode and cathode elements spaced in the aperture; d) deposit a conductive electrical connection to each of the elements suitable for imparting an electrical potential difference between the elements; e) form a non-electrically conductive sealing layer atop the perforated layer so as to retain and seal the aperture in the perforated layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A 3D printed apparatus comprising a 3D printed thermionic electronic component integral with a fabric of the apparatus. 2. The apparatus of claim 1 wherein the thermionic electronic component is a diode comprising a cathode and an anode. 3. The apparatus of claim 2 wherein the diode, which is the thermionic electronic component, further comprises a filament provided separately from but in thermal proximity with the cathode, the filament being configured to heat the cathode to induce thermionic emission by the cathode. 4. The apparatus of claim 2 wherein the diode, which is the thermionic electronic component, is formed in an aperture of the fabric of the apparatus. 5. The apparatus of claim 1 wherein the thermionic electronic component is a triode comprising a cathode, an anode and a grid to regulate the passage of electrons from the cathode to the anode. 6. The apparatus of claim 5 wherein the triode, which is the thermionic electronic component, further comprises a filament provided separately from but in thermal proximity with the cathode, the filament being configured to heat the cathode to induce thermionic emission by the cathode. 7. The apparatus of claim 5 wherein the triode, which is the thermionic electronic component, is formed in an aperture of the fabric of the apparatus. 8. The apparatus of claim 1 wherein the apparatus further comprises a 3D printed circuit.

Assignees

Inventors

Classifications

  • B29C64/188Primary

    involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control (surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00) · CPC title

  • without control means, i.e. diodes · CPC title

  • Extrusion coatings · CPC title

  • with one or more immovable internal control electrodes, e.g. triode, pentode, octode · CPC title

  • Products made by additive manufacturing · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10483074B2 cover?
A method of manufacturing an article with integral active electronic component uses an additive manufacturing process to: a) form a non-electrically conductive substrate; b) form a non-electrically conductive perforated layer having an aperture; c) form electrically conductive anode and cathode elements spaced in the aperture; d) deposit a conductive electrical connection to each of the element…
Who is the assignee on this patent?
British Telecomm
What technology area does this patent fall under?
Primary CPC classification B29C64/188. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 19 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).