Semiconductor substrate measuring apparatus and plasma treatment apparatus using the same

Patent metadata

Field	Value
Publication number	US-10481005-B2
Application number	US-201816157682-A
Country	US
Kind code	B2
Filing date	Oct 11, 2018
Priority date	Apr 20, 2018
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.

First claim

What is claimed is:

1. A semiconductor substrate measuring apparatus, comprising:
a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band, having a longer wavelength than the first wavelength band;
an optical unit irradiating the irradiation light on a measurement object and condensing reflected light, reflected from a surface of the measurement object;
a light splitting unit splitting the reflected light, condensed in the optical unit, into a first optical path and a second optical path;
a first detecting unit disposed on the first optical path and detecting first interference light in the first wavelength band in the reflected light;
a second detecting unit disposed on the second optical path and detecting second interference light in the second wavelength band in the reflected light; and
a controlling unit calculating at least one of a surface shape or a thickness of the measurement object, based on the first interference light and calculating a temperature of the measurement object, based on the second interference light.

2. The semiconductor substrate measuring apparatus according to claim 1 , wherein at least one of the first and second detecting units further comprises an optical amplifier selectively amplifying the reflected light along the second optical path.

3. The semiconductor substrate measuring apparatus according to claim 2 , wherein the optical amplifier is a semiconductor optical amplifier.

4. The semiconductor substrate measuring apparatus according to claim 1 , wherein the first detecting unit comprises a Si photodiode charge coupled device (CCD), and the second detecting unit comprises an InGaAs photodiode charge coupled device (CCD).

5. The semiconductor substrate measuring apparatus according to claim 1 , wherein the light in the first wavelength band is light in a wavelength band of ultraviolet light to visible light and the light in the second wavelength band is light in a near-infrared band.

6. The semiconductor substrate measuring apparatus according to claim 5 , wherein the light source unit comprises a xenon lamp emitting light in the first and second wavelength bands.

7. A plasma treatment apparatus, comprising:
a process chamber having an internal space to process a semiconductor substrate by generating plasma, the process chamber having an observation window through which plasma emission light emitted by the plasma is transmitted externally;
a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band, having a longer wavelength than the first wavelength band;
an optical unit positioned above the observation window to irradiate the irradiation light to the semiconductor substrate through the observation window, and condensing reflected light, reflected from a surface of the semiconductor substrate and measurement light having the plasma emission light;
a light splitting unit splitting the measurement light into a first optical path and a second optical path;
a first detecting unit disposed on the first optical path and detecting first interference light in the first wavelength band in the measurement light;
a second detecting unit disposed on the second optical path and detecting second interference light in the second wavelength band in the measurement light; and
a controlling unit calculating at least one of a thickness or a surface shape of a membrane formed on the surface of the semiconductor substrate, based on the first interference light and calculating a temperature of the semiconductor substrate based on the second interference light.

8. The plasma treatment apparatus according to claim 7 , wherein at least one of the first and second detecting units further comprises an optical amplifier selectively amplifying the reflected light at an input terminal depending on a wavelength of the reflected light.

9. The plasma treatment apparatus according to claim 8 , wherein the controlling unit measures the plasma emission light condensed in the optical unit in a state in which the light source unit is turned off, and the plasma is generated in the process chamber.

10. The plasma treatment apparatus according to claim 9 , wherein the controlling unit measures standard reflected light condensed in the optical unit in a state in which the light source unit is turned on, and the plasma is removed from the process chamber, subtracts a spectrum of the measurement light from the spectrum of the standard reflected light, and adds the spectrum of the plasma emission light to generate light having a corrected spectrum.

11. The plasma treatment apparatus according to claim 8 , wherein the optical amplifier is a semiconductor optical amplifier.

12. The plasma treatment apparatus according to claim 7 , wherein the light source unit and the optical unit are a single integrated unit.

13. The plasma treatment apparatus according to claim 7 , wherein the first detecting unit comprises a Si charge coupled device (CCD), and the second detecting unit comprises an InGaAs photodiode charge coupled device (CCD).

14. The plasma treatment apparatus according to claim 7 , wherein the light in the first wavelength band is light in a wavelength band of ultraviolet light to visible light and the light in the second wavelength band is light in a near-infrared band.

15. The plasma treatment apparatus according to claim 7 , wherein the light source unit comprises a xenon lamp emitting light in the first and second wavelength bands, and the controlling unit turns the xenon lamp on or off.

16. A plasma treatment apparatus, comprising:
a process chamber having an internal space to process a semiconductor substrate by generating plasma, the process chamber having an observation window;
a light source unit disposed outside of the process chamber, generating irradiation light including light in a first wavelength band and a second wavelength band, having a longer wavelength than the first wavelength band;
an optical unit positioned above the observation window to irradiate the irradiation light to the semiconductor substrate through the observation window;
a light splitting unit splitting the reflected light to a first optical path and a second optical path;
a first detecting unit disposed on the first optical path and detecting first interference light in the first wavelength band in the reflected light;
a second detecting unit disposed on the second optical path and detecting second interference light in the second wavelength band in the reflected light; and
a controlling unit calculating at least one of a thickness or a surface shape of a membrane formed on a surface of the semiconductor substrate, based on the first interference light and calculating a temperature of the semiconductor substrate based on the second interference light.

17. The plasma treatment apparatus according to claim 16 , wherein at least one of the first or second detecting units further comprises an optical amplifier selectively amplifying the reflected light depending on a wavelength of the reflected light.

18. The plasma treatment apparatus according to claim 16 , wherein the light in the first wavelength band is light in a wavelength band of ultraviolet to visible light and the light in the second wavelength band is light in a near-infrared wavelength band.

19. The plasma treatment apparatus according to claim 16 , wherein the light source unit comprises a xenon lamp emitting light in the first and second wavel

Assignees

• Samsung Electronics Co Ltd

Inventors

• Oh Se Jin
• Kang Tae Kyun
• Kim Yu Sin
• Kim Jae Ik
• Mo Chan Bin
• Sung Doug Yong
• Ahn Seung Bin
• INN Kul
• Jeon Yun Kwang

Classifications

• H10P72/0602 Primary

  Temperature monitoring · CPC title

• G01J5/0846

  having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels · CPC title

• G01J5/0806

  Focusing or collimating elements, e.g. lenses or concave mirrors · CPC title

• G01J5/06

  Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity (for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801) · CPC title

• G01J5/04

  Casings · CPC title