Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition

Patent metadata

Field	Value
Publication number	US-10479889-B2
Application number	US-201514848057-A
Country	US
Kind code	B2
Filing date	Sep 8, 2015
Priority date	Dec 30, 2014
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A thermoplastic resin composition including a polylactic acid, a thermoplastic polymer having a lower glass transition temperature than the polylactic acid, a nucleating agent, and a reactive plasticizer, a molded article made therefrom, and a method of preparing the thermoplastic resin composition.

First claim

What is claimed is:

1. A thermoplastic resin composition comprising:
a polylactic acid;
a thermoplastic polymer having a lower glass transition temperature than the polylactic acid;
an inorganic nucleating agent; and
at least two reactive plasticizers comprising a modified vegetable oil,
wherein the thermoplastic resin composition comprises about 70% or more of the polylactic acid based on the total weight of the thermoplastic resin composition,
wherein the thermoplastic polymer comprises an ethylene vinyl acetate copolymer, which comprises about 60 wt % to about 75 wt % of an ethylene-based structural unit and about 25 wt % to about 40 wt % of a vinyl-acetate based structural unit.

2. The thermoplastic resin composition of claim 1 , wherein the thermoplastic polymer comprises an olefin-based thermoplastic polymer.

3. The thermoplastic resin composition of claim 1 , wherein the thermoplastic polymer is an ethylene vinyl acetate copolymer; an ethylene (meth)acrylate ester copolymer; or an olefin-based polymer which includes at least one functional group selected from the group consisting of an acid anhydride group, a carboxyl group, an amino group, an imino group, an alkoxysilyl group, a silanol group, a silyl ether group, a hydroxyl group, and an epoxy group; or a combination thereof.

4. The thermoplastic resin composition of claim 1 , wherein the thermoplastic polymer is about 3 wt % to about 20 wt % of the total weight of the thermoplastic resin composition.

5. The thermoplastic resin composition of claim 1 , wherein the resin composition further comprises an organic nucleating agent.

6. The thermoplastic resin composition of claim 1 , wherein the inorganic nucleating agent comprises talc, kaolinite, montmorillonite, mica, clay, zeolite, silica, graphite, carbon black, barium sulfate, calcium silicate, calcium carbonate, calcium sulfide, calcium titanate, zinc oxide, aluminum oxide, magnesium oxide, titanium oxide, neodymium oxide, boron nitride, or a combination thereof.

7. The thermoplastic resin composition of claim 5 , wherein the organic nucleating agent comprises poly-D-lactic acid, low-density polyethylene, high-density polyethylene, polypropylene, polyisopropylene, polybutene, poly-4-methylpentene, poly-3-methylbutene-1, polyvinylcycloalkane, polyvinyltrialkylsilane, polybutylene terephthalate, stearic acid amide, ethylene bislauric acid amide, palmitic acid amide, hydroxystearic acid amide, erucic acid amide, tris(t-butylamide) trimesate, hexamethylene-bis-9,10-dihydroxy stearic acid amide, p-xylene-bis-9,10-dihydroxy stearic acid amide, 1,4-cyclohexane dicarboxylic acid dicyclohexylamide, 2,6-naphthalene dicarboxylic acid dianilide, N,N′,N″-tricyclohexyl trimesic acid amide, trimesic acid tris(t-butylamide), 1,4-cyclohexane dicarboxylic acid dianilide, 2,6-naphthalene dicarboxylic acid dicyclohexylamide, N,N′-dibenzoyl-1,4-diaminocyclohexane, N,N′-dicyclohexane carbonyl-1,5-diaminonaphthalene, ethylene-bisstearic acid amide, N,N′-ethylene-bis(12-hydroxy stearic acid)amide, decane dicarboxylic acid dibenzoylhydrazide, hexane dicarboxylic acid dibenzoylhydrazide, octane dicarboxylic acid dibenzoylhydrazide, sodium benzoate, potassium benzoate, lithium benzoate, calcium benzoate, magnesium benzoate, barium benzoate, lithium terephthalate, sodium terephthalate, potassium terephthalate, calcium oxalate, sodium laurate, potassium laurate, sodium myristate, potassium myristate, calcium myristate, sodium octacosanoate, calcium octacosanoate, sodium stearate, potassium stearate, lithium stearate, calcium stearate, magnesium stearate, barium stearate, sodium montanate, calcium montanate, sodium toluate, sodium salicylate, potassium salicylate, zinc salicylate, aluminum dibenzoate, potassium dibenzoate, lithium dibenzoate, sodium β-naphthalate, sodium cyclohexane carboxylate, sodium p-toluene sulfonate, sodium sulfoisophthalate, dimethyl-5-sodium sulfoisophthalate, sodium-2,2′-methylenebis(4,6-di-t-butylphenyl)phosphate, aluminum bis(2,2-methylenebis-4,6-di-t-butylphenyl phosphate)hydroxide, benzylidene sorbitol, copper phthalocyanine, zinc phenylphosphonate, or a combination thereof.

8. The thermoplastic resin composition of claim 1 , wherein the thermoplastic resin composition comprises about 0.1 wt % to about 10 wt % of the inorganic nucleating agent based on the total weight of the thermoplastic resin composition.

9. The thermoplastic resin composition of claim 1 , wherein the resin composition further comprises an unmodified polyglycerol fatty acid ester, a modified polyglycerol fatty acid ester, or a combination thereof.

10. The thermoplastic resin composition of claim 1 , wherein the reactive plasticizers comprise epoxidized soybean oil, acrylated soybean oil, maleated soybean oil, acrylated-epoxidized soybean oil, or a combination thereof.

11. The thermoplastic resin composition of claim 1 , wherein the thermoplastic resin composition comprises about 3 wt % to about 20 wt % of the reactive plasticizers based on the total weight of the thermoplastic resin composition.

12. The thermoplastic resin composition of claim 1 , wherein the thermoplastic resin composition comprises about 82 wt % to about 95 wt % of the polylactic acid, about 2 wt % to about 20 wt % of the thermoplastic polymer, about 0.1 wt % to about 10 wt % of the nucleating agent, and about 2 wt % to about 20 wt % of the reactive plasticizers.

13. The thermoplastic resin composition of claim 1 , wherein the thermoplastic resin composition has an Izod impact strength of about 90 J/m or more and a heat distortion temperature (HDT) of about 50° C. or more when molded under molding conditions including a molding temperature of about 50° C. or more and a cooling time of about 150 seconds or less.

14. The thermoplastic resin composition of claim 1 , wherein the thermoplastic resin composition has an Izod impact strength of about 100 J/m or more and a heat distortion temperature (HDT) of about 80° C. or more when molded under molding conditions including a molding temperature of about 100° C. and a cooling time of about 150 seconds or less.

15. The thermoplastic resin composition of claim 1 , wherein the thermoplastic resin composition has an Izod impact strength when molded under molding conditions including a molding temperature of about 100° C. and a cooling time of about 60 seconds that is about 65% or more of the Izod impact strength of the same thermoplastic resin composition molded under molding conditions including a molding temperature of about 100° C. and a cooling time of about 600 seconds.

16. The thermoplastic composition of claim 1 , wherein the thermoplastic resin composition comprises about 85% or more of the polylactic acid based on the total weight of the thermoplastic resin composition.

17. A molded article comprising the thermoplastic resin composition of claim 1 .

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Kyunghae
• Hwang Seungjoon
• Park Namsoo
• Lee Mooho
• Chwae Jun

Classifications

• C08L23/08

  Copolymers of ethene (C08L23/16 takes precedence) · CPC title

• C08L67/04 Primary

  Polyesters derived from hydroxycarboxylic acids, e.g. lactones (C08L67/06 takes precedence) · CPC title

• C08L23/0846

  with unsaturated hydrocarbons containing atoms other than carbon or hydrogen · CPC title

• C08K5/0083

  Nucleating agents promoting the crystallisation of the polymer matrix · CPC title

• C08K5/0016

  Plasticisers · CPC title