Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same
US-12404361-B2 · Sep 2, 2025 · US
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Lee Mooho patents
Lee Mooho is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Mooho |
| Total patents | 15 |
| First publication | Sep 17, 2015 |
| Latest publication | Sep 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same
US-11926695-B2 · Mar 12, 2024 · US
Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same
US-2023104237-A1 · Apr 6, 2023 · US
Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same
US-11421073-B2 · Aug 23, 2022 · US
Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same
US-2021147613-A1 · May 20, 2021 · US
High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same
US-2021147612-A1 · May 20, 2021 · US
Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition
US-10479889-B2 · Nov 19, 2019 · US
Polyurethane elastomer, thermoplastic resin composition comprising the polyurethane elastomer, molded article made of the thermoplastic resin composition, and method of preparing the polyurethane elastomer
US-10160825-B2 · Dec 25, 2018 · US
Thermoplastic resin composition and molded article made therefrom
US-10160857-B2 · Dec 25, 2018 · US
Method for preparing hydrogenation catalyst and method for preparing diols from lactones using the hydrogenation catalyst
US-9381498-B2 · Jul 5, 2016 · US
Recent patents
Latest publications not already listed above.
Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition
US-2016185954-A1 · Jun 30, 2016 · US
Thermoplastic resin composition and molded article made therefrom
US-2016122531-A1 · May 5, 2016 · US
Polyurethane elastomer, thermoplastic resin composition comprising the polyurethane elastomer, molded article made of the thermoplastic resin composition, and method of preparing the polyurethane elastomer
US-2016108167-A1 · Apr 21, 2016 · US
Method for preparing hydrogenation catalyst and method for preparing diols from lactones using the hydrogenation catalyst
US-2016030928-A1 · Feb 4, 2016 · US
Method of producing lactone from hydroxycarboxylic acid or dicarboxylic acid in aqueous solution
US-2015259311-A1 · Sep 17, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 15 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08L67/04 | 6 |
| H10W74/473 | 6 |
| H10W74/47 | 6 |
| C08L63/00 | 6 |
| C08G59/245 | 6 |