Top port multi-part surface mount silicon condenser microphone

Patent metadata

Field	Value
Publication number	US-9693133-B2
Application number	US-201615135125-A
Country	US
Kind code	B2
Filing date	Apr 21, 2016
Priority date	Nov 28, 2000
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

First claim

What is claimed is:

1. A silicon condenser microphone comprising:
a rigid rectangle-shaped microphone base adapted for solder reflow surface mounting and having substantially planar top and bottom surfaces, the microphone base comprising:
a top portion comprising a first conductive layer with a first non-conductive layer disposed on a lower surface of the first conductive layer, and a second conductive layer disposed on a lower surface of the first non-conductive layer, wherein the first conductive layer is patterned to form a plurality of conductive pads;
a bottom portion comprising a third conductive layer with a second non-conductive layer disposed on a lower surface of the second conductive layer, and a fourth conductive layer disposed on a lower surface of the second non-conductive layer, wherein the second and third conductive layers are patterned into electrodes, wherein the fourth conductive layer is pattered to form a plurality of solder pads;
a passive electronic material layer disposed between the second and third conductive layers and in electrical contact with the second and third conductive layers; and
one or more electrical paths disposed completely within the microphone base, wherein the one or more electrical paths electrically couple one or more of the plurality of conductive pads in the first conductive layer to one or more of the solder pads in the fourth conductive layer;
a MEMS microphone die mounted to the top surface of the microphone base and electrically coupled to at least one of the conductive pads in the first conductive layer; and
a single-piece rectangular cover, the rectangular cover including an acoustic port, wherein the rectangular cover is formed from a solid material and has a predetermined shape with a top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle and that completely surrounds and supports the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface, the acoustic port disposed in the top portion of the rectangular cover and passing completely through the rectangular cover,
wherein the attachment surface of the sidewall portion of the rectangular cover is aligned with and attached to a peripheral region along each edge of the top surface of the microphone base, and wherein the predetermined height of the sidewall portion of the rectangular cover, the interior sidewall surface of the sidewall portion of the rectangular cover, and an interior surface of the top portion of the rectangular cover, in cooperation with the top surface of the microphone base, provide a protective enclosure for the MEMS microphone die to reduce electromagnetic interference.

2. The silicon condenser microphone of claim 1 , wherein the microphone base further comprises a recess disposed therein, and the MEMS microphone die is positioned over the recess.

3. The silicon condenser microphone of claim 1 , wherein the microphone base further comprises an internal cavity with an aperture in the top surface of the microphone base, the internal cavity extending longitudinally within the microphone base, and the MEMS microphone die is positioned over the aperture in the top surface of the base layer.

4. The silicon condenser microphone of claim 1 , wherein the passive electronic material layer is a resistive material, and is electrically coupled to one or more of the plurality of conductive pads in the first conductive layer or one or more of the solder pads in the fourth conductive layer through one or more of the electrodes formed in the second and third conductive layers.

5. The silicon condenser microphone of claim 1 , wherein the passive electronic material layer is a capacitive dielectric material, and is electrically coupled to one or more of the plurality of conductive pads in the first conductive layer or one or more of the solder pads in the fourth conductive layer through one or more of the electrodes formed in the second and third conductive layers.

6. The silicon condenser microphone of claim 1 , wherein a passive electrical element formed in the passive electronic material layer filters one or more of an input signal, an output signal, or input power.

7. The silicon condenser microphone of claim 1 , wherein the MEMS microphone die is a pressure-equalizing MEMS microphone die.

8. The silicon condenser microphone of claim 1 , wherein a diaphragm of the MEMS microphone die defines a front volume and a back volume within the protective enclosure, and the acoustic port disposed in the rectangular cover is acoustically coupled to the diaphragm.

9. The silicon condenser microphone of claim 8 , wherein the interface between the attachment surface of the sidewall portion of the rectangular cover and the top surface of the microphone base is sealed to maintain acoustic pressure within the front volume.

10. The silicon condenser microphone of claim 1 , wherein the first and second nonconductive layers comprise one or more layers of FR-4 printed circuit board material.

11. A micro-electro-mechanical system (MEMS) microphone, the microphone comprising:
a rigid rectangle-shaped microphone base adapted for solder reflow surface mounting and having substantially planar top and bottom surfaces, the microphone base comprising:
a top portion comprising a first conductive layer with a first non-conductive layer disposed on a lower surface of the first conductive layer, and a second conductive layer disposed on a lower surface of the first non-conductive layer, wherein the first conductive layer is patterned to form a plurality of conductive pads;
a bottom portion comprising a third conductive layer with a second non-conductive layer disposed on a lower surface of the second conductive layer, and a fourth conductive layer disposed on a lower surface of the second non-conductive layer, wherein the second and third conductive layers are patterned into electrodes, wherein the fourth conductive layer is pattered to form a plurality of solder pads;
a passive electronic material layer disposed between the second and third conductive layers and in electrical contact with the second and third conductive layers
one or more electrical paths disposed completely within the microphone base, wherein the one or more electrical paths electrically couple one or more of the plurality of conductive pads in the first conductive layer to one or more of the solder pads in the fourth conductive layer; and
an acoustic port disposed in an interior region of the microphone base layer and passing completely through the microphone base, wherein one of the plurality of flat solder pads in the fourth conductive layer is a metal ring that completely surrounds the acoustic port in the microphone base;
a MEMS microphone die mounted to the top surface of the microphone base and electrically coupled to at least one of the conductive pads in the first conductive layer, the MEMS microphone die being disposed directly over the acoustic port in the microphone base; and
a single-piece rectangular cover formed from a solid material and having a predetermined shape with a top portion and a substantially vertical and continuous sidewall portion that adjoins the top portion at an angle and that completely surrounds and supports the top portion, the sidewall portion having a predetermined height, an exterior sidewall surface, an interior sidewall surface, and an attachment surface,
wherein the attachment surface of the sidewall portion of the rectangular cover is aligned with and attached to a peripheral region along each edge of the top surface of the microphone base, and
wherein the p

Assignees

• Knowles Electronics Llc

Inventors

• Minervini Anthony D

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W76/60

  Seals · CPC title

• H10W70/692

  Ceramics or glasses · CPC title

• Y10T29/4908

  Acoustic transducer · CPC title

• H04R19/016

  for microphones · CPC title