Semiconductor device manufacturing method and semiconductor device manufactured using the same
US-2024395745-A1 · Nov 28, 2024 · US
US10475838B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10475838-B2 |
| Application number | US-201715714502-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 25, 2017 |
| Priority date | Sep 25, 2017 |
| Publication date | Nov 12, 2019 |
| Grant date | Nov 12, 2019 |
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An image sensor includes a multi-pixel detector. The multi-pixel detector includes a first pixel formed in a substrate and having a first photodiode region, a second pixel formed in the substrate adjacent to the first pixel and having a second photodiode region, and a microlens above both the first pixel and the second pixel. The microlens includes (a) in a first cross-sectional plane perpendicular to a top surface of the substrate and including both the first and the second photodiode regions, a first height profile having N1 local maxima, and (b) in a second cross-sectional plane perpendicular to the first cross-sectional plane and the top surface and including only one of the first and the second photodiode regions, a second height profile having N2>N1 local maxima.
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What is claimed is: 1. An image sensor with a multi-pixel detector, comprising: a first pixel formed in a substrate and having a first photodiode region; a second pixel formed in the substrate adjacent to the first pixel and having a second photodiode region; and a microlens above both the first pixel and the second pixel and having (a) in a first cross-sectional plane perpendicular to a top surface of the substrate and including both the first and the second photodiode regions, a first height profile having N 1 local maxima, N 1 ≥1, and (b) in a second cross-sectional plane perpendicular to the first cross-sectional plane and the top surface and including only one of the first and the second photodiode regions, a second height profile having N 2 >N 1 local maxima. 2. The image sensor of claim 1 , the first height profile having N 1 =1 local maxima and being characterized by first radius of curvature R 1 ; and the second height profile including a first local maxima and a second local maxima corresponding to respective radii of curvature R 21 <R 1 and R 22 <R 1 . 3. The image sensor of claim 2 , the radius of curvature R 1 =730±70 nanometers. 4. The image sensor of claim 2 , the radii of curvature R 21 and R 22 being equal to within ten percent of (R 21 +R 22 )/2. 5. The image sensor of claim 2 , the radii of curvature R 21 and R 22 being equal to 580±60 nm. 6. The image sensor of claim 1 , the microlens having a maximum thickness of 730±70 nanometers.
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