Composition for forming laser direct structuring layer, kit, and method for manufacturing resin molded article with plated layer

Patent metadata

Field	Value
Publication number	US-10472536-B2
Application number	US-201515321895-A
Country	US
Kind code	B2
Filing date	Jun 26, 2015
Priority date	Jun 30, 2014
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.

First claim

The invention claimed is:

1. A kit, comprising:
a composition for forming a laser direct structuring layer comprising a water-compatible organic substance, water, and a laser direct structuring additive, and
a thermoplastic resin composition containing a thermoplastic resin and a glass filler;
wherein the laser direct structuring additive includes at least one selected from the group consisting of (i) a compound containing copper and chromium, (ii) an oxide containing tin and at least one of antimony and phosphorus, and (iii) an electrically conductive oxide containing at least two species of metals and having a resistivity of 5×10 3 Ω cm or smaller.

2. The kit of claim 1 , wherein the thermoplastic resin composition contains substantially no laser direct structuring additive.

3. The kit of claim 1 , wherein the thermoplastic resin is a crystalline resin.

4. The kit of claim 3 , wherein the crystalline resin is a polyamide resin.

5. The kit of claim 3 , wherein the crystalline resin is a thermoplastic polyester resin.

6. The kit of claim 1 , wherein the thermoplastic resin is an amorphous resin.

7. The kit of claim 6 , wherein the amorphous resin is a polycarbonate resin.

8. The kit of claim 1 , wherein the thermoplastic resin composition contains at least one of a dye-pigment and a fire retardant composition.

9. The kit of claim 1 , wherein the thermoplastic resin composition contains at least one of a pigment and a fire retardant composition.

10. The kit of claim 1 , wherein the thermoplastic resin composition contains a black dye-pigment.

11. The kit of claim 1 , wherein the thermoplastic resin composition contains an antimony-containing fire retardant or fire retardant auxiliary.

12. The kit of claim 1 , wherein the thermoplastic resin composition contains a halogen-containing fire retardant.

13. A method for manufacturing a resin molded article with a plated layer, the method using the kit according to claim 1 ; and the method comprising:
applying the composition for forming a laser direct structuring layer to a surface of a thermoplastic resin molded article formed of the thermoplastic resin composition;
removing the water; and
then irradiating laser to form a plated layer.

14. The method for manufacturing a resin molded article with a plated layer of claim 13 , the method further comprising washing the plated layer after the plated layer was formed.

15. The method for manufacturing a resin molded article with a plated layer of claim 13 ,
wherein the thermoplastic resin molded article comprises a crystalline resin.

16. The method for manufacturing a resin molded article with a plated layer of claim 13 , wherein the thermoplastic resin molded article comprises an amorphous resin.

17. The kit of claim 1 , wherein the glass filler is not continuous.

18. The kit of claim 1 , wherein the glass filler is at least one of chopped strand and milled fiber.

19. The kit of claim 1 , wherein the composition for forming a laser direct structuring layer is free from a glass filler.

20. The kit of claim 1 , wherein the composition for forming a laser direct structuring layer is free from a glass filler and the thermoplastic resin composition contains substantially no laser direct structuring additive.

21. The kit of claim 1 , wherein the thermoplastic resin contains a polyamide resin obtained by polycondensation of xylylene diamine with an α,ω-dibasic acid.

22. The kit of claim 1 , wherein the thermoplastic resin contains a polyamide resin obtained by polycondensation of paraxylylene diamine and/or metaxylylene diamine, with sebacic acid and/or adipic acid.

23. The kit of claim 1 , wherein the (iii) electrically conductive oxide containing at least two species of metals and having a resistivity of 5×10 3 Ω·cm or smaller includes an oxide containing zinc and aluminum.

24. The kit of claim 1 , wherein the (ii) oxide containing tin and at least one of antimony and phosphorus includes an oxide containing tin and antimony.

Assignees

• Mitsubishi Eng Plastics Corp

Inventors

• Sugiyama Masahide
• Yamada Ryusuke
• Kikuchi Tatsuya
• Yamanaka Yasushi

Classifications

• H05K3/0032

  of organic insulating material · CPC title

• C23C18/20

  of organic surfaces, e.g. resins · CPC title

• H05K3/105

  by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam · CPC title

• C09D177/00

  Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain (based on polyhydrazides C09D179/06; based on polyamide-imides C09D179/08); Coating compositions based on derivatives of such polymers · CPC title

• C09D7/61

  inorganic · CPC title