Photocurable composition and method for manufacturing film

Patent metadata

Field	Value
Publication number	US-10472445-B2
Application number	US-201314433850-A
Country	US
Kind code	B2
Filing date	Sep 20, 2013
Priority date	Oct 9, 2012
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A photocurable composition which decreases a mold releasing force is provided. The photocurable composition is a photocurable composition which is cured using light while being in contact with a mold having a surface in which a concavo-convex pattern is formed so as to manufacture a film having a concavo-convex pattern and which includes a polymerizable compound, a photopolymerization initiator, and a photosensitive gas generating agent having a photostimulation responsive portion. The photosensitive gas generating agent has a repeating structure containing at least one alkylene oxide chain and generates a gas from the photostimulation responsive portion by light irradiation.

First claim

The invention claimed is:

1. A photocurable composition which can be cured using light while being in contact with a mold to manufacture a film, the photocurable composition comprising:
a polymerizable compound;
a photopolymerization initiator;
a fluorinated surfactant, and
a photosensitive gas generating agent having a photostimulation responsive portion,
wherein the photosensitive gas generating agent has a repeating structure including at least one alkylene oxide chain and generates a gas from the photostimulation responsive portion by light irradiation.

2. The photocurable composition according to claim 1 , wherein the photosensitive gas generating agent includes a compound represented by the following general formula (3):
Y A (—R A —O) n —X A —RG 2 -X B —(O—R B —) m Y B   (3)

where in the formula (3), RG 2 represents a divalent functional group functioning as the photostimulation responsive portion; R A and R B each represent a divalent alkylene group and are optionally identical to or different from each other; m and n are each an integer of 1 or more; X A and X B each represent a divalent linking group and are optionally identical to or different from each other;

and Y A and Y B each represent a monovalent substituent and are optionally identical to or different from each other.

3. The photocurable composition according to claim 1 ,
wherein the alkylene oxide chain is an ethylene oxide chain.

4. The photocurable composition according to claim 1 , wherein the photostimulation responsive portion includes a 2-diazo-1,2-naphthoquinone group.

5. The photocurable composition according to claim 1 , wherein the photosensitive gas generating agent includes a compound represented by the following general formula (4):

where in the formula (4), R 1 and R 2 each represent an alkyl group or a hydrogen atom and are optionally identical to or different from each other, and n is an integer of 1 or more.

6. The photocurable composition according to claim 1 , wherein the photosensitive gas generating agent includes a compound represented by the following general formula (5):

where in the formula (5), R 1 and R 2 each represent an alkyl group or a hydrogen atom and are optionally identical to or different from each other, and n is an integer of 1 or more.

7. The photocurable composition according to claim 1 , wherein a blending rate of the photosensitive gas generating agent to the total amount of the polymerizable compound is 10 percent by weight or more, and
a blending rate of the fluorinated surfactant to the total amount of the polymerizable compound is 0.005 to 3 percent by weight.

8. An optical component comprising:
a substrate; and
a film having a predetermined pattern shape disposed on the substrate,
wherein the film is a film obtained by curing the photocurable composition according to claim 1 .

9. A photocurable composition which can be cured using light while being in contact with a mold to manufacture a film, the photocurable composition comprising:
a polymerizable compound;
a photopolymerization initiator; and
a photosensitive gas generating agent having a photostimulation responsive portion,
wherein the photosensitive gas generating agent has a repeating structure including at least one alkylene oxide chain and generates a gas from the photostimulation responsive portion by light irradiation,
wherein the photosensitive gas generating agent includes a compound represented by the following general formula (2):
RG 1 -X A —(O—R A —) n —X B —RG 1 ′  (2)

where in the formula (2), RG 1 and RG 1 ′ each represent a monovalent functional group functioning as the photostimulation responsive portion and are optionally identical to or different from each other; X A and X B each represent a divalent linking group and are optionally identical to or different from each other;

R A represents a divalent alkylene group; and n is an integer of 1 or more.

10. The photocurable composition according to claim 9 , wherein the alkylene oxide chain is an ethylene oxide chain.

11. The photocurable composition according to claim 9 , wherein the photostimulation responsive portion includes a 2-diazo-1,2-naphthoquinone group.

12. The photocurable composition according to claim 9 , wherein a blending rate of the photosensitive gas generating agent to the total amount of the polymerizable compound is 10 percent by weight or more, and a blending rate of a fluorinated surfactant to the total amount of the polymerizable compound is 0.005 to 3 percent by weight.

13. An optical component comprising:
a substrate; and
a film having a predetermined pattern shape disposed on the substrate,
wherein the film is a film obtained by curing the photocurable composition according to claim 9 .

14. The photocurable composition according to claim 9 , wherein the photocurable composition further comprises a fluorinated surfactant.

15. A method for manufacturing a film, the method comprising:
an arrangement step of arranging the photocurable composition according to claim 1 on a processing substrate;
a mold contact step of bringing the photocurable composition into contact with a mold;
a light irradiation step of irradiating the photocurable composition with light; and
a mold releasing step of releasing the mold from the photocurable composition after the light irradiation step so as to obtain a film having a predetermined pattern shape on the processing substrate.

16. The method for manufacturing a film according to claim 15 , wherein the film has a thickness of 10 μm or less.

17. The method for manufacturing a film according to claim 15 , wherein the mold in contact with the photocurable composition has a surface including quartz.

18. The method for manufacturing a film according to claim 15 , wherein the light irradiation step is a step of irradiating the photocurable composition with light through the mold.

19. A method for manufacturing a circuited substrate, the method comprising:
performing etching or ion implantation based on the pattern shape of the film obtained by the method for manufacturing a film according to claim 15 ; and
forming a circuit structure in the processing substrate based on the pattern shape of the film.

Assignees

• Canon Kk

Inventors

• Ito Toshiki
• Mihara Chieko
• Matsufuji Naoko
• Kitagawa Kenji

Classifications

• H10P76/20

  of masks comprising organic materials · CPC title

• H10P50/28

  of insulating materials · CPC title

• C08K5/235

  Diazo and polyazo compounds · CPC title

• G03F7/022

  Quinonediazides (G03F7/075 takes precedence) · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title