Components with micro cooled patterned coating layer and methods of manufacture
US-2015369053-A1 · Dec 24, 2015 · US
US9623439B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9623439-B2 |
| Application number | US-201214349941-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 19, 2012 |
| Priority date | Oct 24, 2011 |
| Publication date | Apr 18, 2017 |
| Grant date | Apr 18, 2017 |
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Provided is a method of manufacturing a film, including: applying, onto a substrate, a photocurable composition containing a polymerizable monomer, a photopolymerization initiator, and a photosensitive gas generator that generates a gas through light stimulation to form an applied film; bringing a mold into contact with the applied film; irradiating the applied film with light through the mold to cure the applied film and to generate the gas in the applied film; and releasing the mold from the applied film after the irradiation of the applied film with the light to form a film (cured film) having a predetermined pattern shape on the substrate, in which in the irradiation of the applied film with the light, a reaction rate of a polymerization reaction of the polymerizable monomer in the applied film is higher than a reaction rate of a gas-generating reaction of the photosensitive gas generator in the applied film.
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The invention claimed is: 1. A method of manufacturing a film, comprising: applying, onto a substrate, a photocurable composition containing a polymerizable monomer, a photopolymerization initiator, and a photosensitive gas generator that generates a gas through light stimulation to form an applied film; bringing a mold into contact with the applied film; irradiating the applied film with light through the mold to cure the applied film and to generate the gas in the applied film; and releasing the mold from the applied film after the irradiation of the applied film with the light to form a film having a predetermined pattern shape on the substrate, wherein in the irradiation of the applied film with the light, a reaction rate of a polymerization reaction of the polymerizable monomer in the applied film is higher than a reaction rate of a gas-generating reaction of the photosensitive gas generator in the applied film, and wherein the photosensitive gas generator comprises a molecule with a repeating unit of an ethylene oxide group at a non-terminal location. 2. The method according to claim 1 , wherein: the photopolymerization initiator in the photocurable composition comprises 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone; the photosensitive gas generator in the photocurable composition comprises a 1,2-naphthoquinonediazide-5-sulfonic acid amide-based compound; and the light with which the applied film is irradiated has a wavelength of 313±5 nm. 3. The method according to claim 1 , wherein: the photopolymerization initiator in the photocurable composition comprises 2-hydroxy-2-methyl-1-phenyl-propan-1-one; the photosensitive gas generator in the photocurable composition comprises a 1,2-naphthoquinonediazide-5-sulfonic acid amide-based compound; and the light with which the applied film is irradiated has a wavelength of 254±5 nm. 4. The method according to claim 1 , wherein: the photopolymerization initiator in the photocurable composition comprises 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone; the photosensitive gas generator in the photocurable composition comprises a 1,2-naphthoquinonediazide-5-sulfonic acid amide-based compound; and the light with which the applied film is irradiated has a wavelength of 313±5 nm or 254±5 nm. 5. A method of manufacturing a substrate with a circuit, comprising processing a substrate with a film obtained by the manufacturing method according to claim 1 as a mask to form a circuit on the substrate. 6. A method of manufacturing an optical component including: a substrate; and a member provided on the substrate and having a predetermined pattern shape, the method comprising manufacturing the member by the manufacturing method according to claim 1 . 7. The method according to claim 1 , wherein a viscosity of the photocurable composition is 6 cP to 20 cP. 8. The method according to claim 1 , wherein a weight ratio of the photosensitive gas generator to the photocurable composition is 5/102 or more.
Manufacture or treatment of nanostructures · CPC title
by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141}) · CPC title
Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title
Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title
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