Vacuum molding of thermoset sheet articles

US10471668B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10471668-B2
Application numberUS-201414764393-A
CountryUS
Kind codeB2
Filing dateJan 29, 2014
Priority dateJan 29, 2013
Publication dateNov 12, 2019
Grant dateNov 12, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A process of compression molding an article from a curable resin is provided that includes opening a mold to an open position by displacing an upper die having an upper mold surface from a lower die having a lower mold surface. Resin is placed a mold surface and the dies are closed to an intermediate start position at a rate of from 1 to 10 cm/sec. The dies are then closed to a start position at a rate of between 25 and 60% of the rate of closure to the intermediate position. A shroud volume is evacuated for at least 3 seconds to a reduced pressure of less than 0.16 atmospheres while continuing to press toward a mold cavity volume at a rate of between 12 and 30% of the rate of closure to the intermediate start. The reduced pressure is removed as the full compression is applied.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process of compression molding an automotive body part article from a sheet molding composition (SMC), comprising: opening a mold to an open position, said mold having an upper die having an upper mold surface and a lower die having a lower mold surface that upon full compression define a mold cavity complementary to the article; placing the SMC as a multiple ply charge on one of the lower mold surface or the upper mold surface; rapidly closing the upper die and the lower die from the open position to an intermediate start position of 5 to 10 cm at a rate of from 1 to 5 cm/sec; slowly closing the upper die and the lower die from the intermediate start position to a start position at a rate of between 25 and 50% of the rate of closure to the intermediate position and simultaneously initiating a vacuum to evacuate the mold cavity to a reduced pressure of less than 0.16 atmospheres (16.2 kPa); maintaining the vacuum on the mold cavity for at least a total of 3 seconds while continuing to press the upper die and the lower die toward a volume of the mold cavity at a rate of between 12 and 30% of the rate of closure to the intermediate start; removing the reduced pressure when the upper die and the lower die are within 1 centimeter of the volume of the mold cavity; allowing the curable resin to cure in the mold cavity; and opening the mold cavity and removing the article. 2. The process of claim 1 wherein the SMC has reinforcing fibers of glass, polyaramide, carbon, or a combination thereof. 3. The process of claim 1 wherein the mold cavity is evacuated for from 3 to 10 seconds. 4. The process of claim 1 further comprising returning the upper die to and the lower die to the open position with a cycle time of 50 to 80 seconds. 5. The process of claim 4 further comprising placing a new charge of the SMC on one of the lower mold surface or the upper mold surface. 6. The process of claim 1 wherein the open position is a separation of between 15 and 30 centimeters. 7. The process of claim 1 further comprising extending a pin from the lower mold surface to remove the article from contact with the lower mold surface.

Assignees

Inventors

Classifications

  • Thermosetting resins · CPC title

  • Compression moulding under special conditions, e.g. vacuum · CPC title

  • combined with mechanical pressure, i.e. mould plates, rams, stampers · CPC title

  • of short lengths, e.g. chopped filaments, staple fibres or bristles · CPC title

  • with sealing means or the like · CPC title

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What does patent US10471668B2 cover?
A process of compression molding an article from a curable resin is provided that includes opening a mold to an open position by displacing an upper die having an upper mold surface from a lower die having a lower mold surface. Resin is placed a mold surface and the dies are closed to an intermediate start position at a rate of from 1 to 10 cm/sec. The dies are then closed to a start position a…
Who is the assignee on this patent?
Continental Structural Plastics Inc
What technology area does this patent fall under?
Primary CPC classification B29C70/467. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).