Micro-Hole Perforated Structure

Patent metadata

Field	Value
Publication number	US-2016349808-A1
Application number	US-201514725330-A
Country	US
Kind code	A1
Filing date	May 29, 2015
Priority date	May 29, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

Micro-hole structures are described herein that may be implemented for device ventilation, protection, and design. The micro-hole structures include multiple micro-holes that are imperceptible to users at ordinary viewing angles and distances, and are thus porous structures that appear to be solid. A micro-hole structure may be formed as a housing of a device or as a structure to be attached to the housing of the device. A device with a micro-hole structure housing enables thermal ventilation from heat-producing components located within the housing. Additionally, micro-holes of a micro-hole structure may be organized to operate as a design element for the device while simultaneously providing ventilation. The micro-holes are sufficiently small to allow for passage of air through the micro-hole structure while also prohibiting entrance of water and/or other contaminants into the housing of the device.

First claim

What is claimed is:

1 . A method for constructing a micro-hole structure, the method comprising:
stretching a material onto a base die that includes one or more pins extending away from the base die so that the one or more pins of the base die protrude through the material; saturating the material with an adhesive; positioning a top die proximal to the base die, the top die including one or more receiving holes that are configured to receive the one or more pins of the base die; compressing the material saturated with the adhesive between the base die and the top die; curing the material saturated with the adhesive to form a micro-hole structure having one or more micro-holes; cooling the base die and the top die to an ejection temperature and removing the micro-hole structure.

2 . A method as described in claim 1 , wherein individual ones of the one or more micro-holes of the micro-hole structure have a diameter of between about fifty microns and two-hundred microns.

3 . A method as described in claim 1 , wherein the material is carbon fiber.

4 . A method as described in claim 1 , wherein the adhesive is a heat-curable epoxy and wherein curing the material saturated with the adhesive comprises heating both the base die and the top die to a temperature that is sufficient to cure material saturated with the heat-curable epoxy.

5 . A method as described in claim 1 , wherein the one or more micro-holes of the micro-hole structure are arranged in a shape of a logo.

6 . A method as described in claim 1 , wherein the one or more micro-holes of the micro-hole structure are of a sufficient size to permit air flow and restrict permeation of one or more of dust or water.

7 . A method as described in claim 1 , wherein the micro-hole structure having one or more micro-holes is a handheld form factor for a computing device.

8 . A method as described in claim 1 , wherein a profile of individual ones of the one or more micro-holes of the micro-hole structure is one of:
a conical shaped tube; an elliptical pipe; a hexagonal shape structure; or a rectangular passage.

9 . A method as described in claim 1 , wherein the one or more micro-holes of the micro-hole structure cover more than fifty percent of a surface area of the micro-hole structure.

10 . A computing device comprising:
a ventilation system for thermal cooling of the computing device including a blower; a housing in which components of the computing device are mounted; and one or more micro-hole structures, the one or more micro-hole structures being a material saturated with an adhesive and cured, individual ones of the one or more micro-hole structures including a plurality of micro-holes that enable air to flow through the micro-hole structure and prevent contaminants from passing through the micro-hole structure.

11 . A computing device as described in claim 10 , wherein individual ones of the plurality of micro-holes of the one or more micro-hole structures are less than two-hundred and fifty microns wide.

12 . A computing device as described in claim 10 , wherein the housing includes the one or more micro-hole structures.

13 . A computing device as described in claim 10 , wherein the one or more micro-hole structures are attached to the housing.

14 . A computing device as described in claim 10 , the computing device further comprising one or more light sources, the one or more light sources disposed within the housing and configured to emit light to pass through one or more of the plurality of micro-holes of the one or more micro-hole structures, and wherein the plurality of micro-holes of the one or more micro-hole structures are arranged in the shape of a logo to be illuminated by the one or more light sources.

15 . A computing device as described in claim 10 , wherein the material is carbon-fiber and the adhesive saturating the carbon-fiber is a heat-curable epoxy.

16 . A computing device as described in claim 10 , the computing device further comprising one or more heat-generating devices disposed within the housing, wherein the one or more micro-hole structures are positioned at one or more locations on the housing corresponding to one or more locations of the one or more heat-generating devices disposed within the housing.

17 . A computing device as described in claim 10 , wherein the computing device is configured as a mobile computing device having a handheld form factor.

18 . A housing for a computing device, the housing for the computing device including a plurality of micro-holes configured to enable air to flow through the housing and prevent contaminants from passing through the housing, the housing including the plurality of micro-holes being cured carbon fiber saturated with epoxy, each of the plurality of micro-holes being less than two-hundred and fifty microns wide.

19 . A housing as described in claim 18 , wherein the plurality of micro-holes are arranged in a shape of a logo.

20 . A housing as described in claim 18 , wherein the plurality of micro-holes cover more than fifty percent of a surface area of the housing.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Daly Gregory M
• Aagaard Karsten
• Muzzey Brett A

Classifications

• B29K2307/04

  Carbon · CPC title

• B29K2063/00

  Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• B29C70/545

  Perforating, cutting or machining during or after moulding · CPC title