Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit

Patent metadata

Field	Value
Publication number	US-10470312-B2
Application number	US-201414769574-A
Country	US
Kind code	B2
Filing date	Mar 6, 2014
Priority date	Mar 12, 2013
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

First claim

The invention claimed is:

1. A method for forming an electrically conductive ultrafine pattern, the method comprising:
(1) a step of applying a resin composition (a) to form a receiving layer (A) on a substrate;
(2) a step of printing an ink (b) containing particles (b1), thereby forming a core pattern (B) made of the ink (b) on the receiving layer (A) by a reverse offset printing method,
(3) firing or drying the printed core pattern (B) made of the particles (b1) which has been obtained at the step (2) to be a target core pattern for electrolytic plating on the receiving layer (A); and
(4) a step of depositing a metal on the target core pattern formed in the step (3), thereby plating the target core pattern on the receiving layer (A) by an electrolytic plating method,
wherein the resin composition (a) includes a urethane resin (al) having a weight average molecular weight of 5,000 or more or a vinyl resin (a2), and a medium (a3),
wherein the urethane resin (a1) has a hydrophilic group and 2,000 to 5,500 mmol/kg of an aliphatic cyclic structure with respect to the total mass,
wherein the vinyl resin (a2) is a vinylic copolymer containing 10 to 70 percent by mass of methyl methacrylate and 10 to 50 percent by mass of an alkyl (meth)acrylate having an alkyl group with 2 to 12 carbon atoms, and
wherein the ink (b) contains metal nano particles as the particles (b1) and an organic compound containing a basic nitrogen atom, the metal nano particles being protected by the organic compound and dispersed in the ink (b), and the urethane resin (a1) or the vinyl resin (a2) in the resin composition (a) has a functional group capable of performing a cross-linking reaction with the organic compound which protects the metal nano particles,
wherein the resin composition (a) includes composite resin particles each composed of a shell layer formed of the urethane resin (a1) and a core layer formed of the vinyl resin (a2).

2. The method for forming an electrically conductive ultrafine pattern according to claim 1 , wherein the metal nano particles have a volume average particle diameter (Mv) of 2 to 100 nm.

3. The method for forming an electrically conductive ultrafine pattern according to claim 1 , wherein the ink (b) further contains a fluorine-based surface energy control agent and/or a silicone-based surface energy control agent.

4. The method for forming an electrically conductive ultrafine pattern according to claim 1 , wherein the reverse offset printing method is a printing method comprising:
(i) forming a uniform ink film of the ink (b) on a liquid-repellent surface of a blanket;
(ii) pressing a relief plate on a surface of the ink film to remove an ink at a portion in contact with the relief plate, wherein an ink remaining on the blanket forms the core pattern (B); and
(iii) then transferring the ink remaining on the blanket to the receiving layer (A) formed on the substrate.

5. A method for forming an electric circuit comprising an electrically conductive ultrafine pattern, wherein the electrically conductive ultrafine pattern of the electric circuit is formed by the method according to claim 1 .

Assignees

• Dainippon Ink & Chemicals
• Dic Corp Tokyo

Inventors

• Yoshihara Sunao
• Katsuta Haruhiko
• Katayama Yoshinori
• Shirakami Jun
• Murakawa Akira
• Fujikawa Wataru
• Saitou Yukie

Classifications

• H05K2203/097

  Corona discharge · CPC title

• H05K2203/0108

  Male die used for patterning, punching or transferring · CPC title

• H05K2201/0224

  Conductive particles having an insulating coating · CPC title

• H05K3/207

  using a prefabricated paste pattern, ink pattern or powder pattern · CPC title

• H05K2201/0257

  Nanoparticles · CPC title