LED module and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10468392-B2
Application number	US-201816059017-A
Country	US
Kind code	B2
Filing date	Aug 8, 2018
Priority date	Aug 11, 2016
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

First claim

What is claimed is:

1. A micro LED module comprising:
a substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad; and
a plurality of LED chip groups, each of which includes LED chips, the LED chips including a first LED chip flip bonded to the first individual electrode pad and the common electrode pad, the second LED chip flip bonded to the second individual electrode pad and the common electrode pad, and the third LED chip flip bonded to the third individual electrode pad and the common electrode pad,
wherein the LED chip groups are arranged in a matrix on the substrate with the same the widthwise direction intervals and the same lengthwise directions intervals, a distance between the first LED chip and the second LED chip is identical to a distance between the second LED chip and the third LED chip.

2. A micro LED module to claim 1 , wherein distances of the LED chip groups in the widthwise direction are identical to those of the LED chip groups in the lengthwise direction.

3. A micro LED module to claim 1 , further comprising a barrier formed on the substrate, the barrier including first light reflective walls formed between the adjacent first and second LED chips and between the adjacent second and third LED chips and second light reflective walls formed between the LED chip groups adjacent to each other in the lengthwise direction and between the LED chip groups adjacent to each other in the widthwise direction.

4. A micro LED module to claim 3 , wherein the first light reflective walls prevent the interference of light from the adjacent LED chips in each LED chip group, and the second light reflective walls prevent the interference of light from the adjacent LED chips of the adjacent LED chip groups.

5. A micro LED module to claim 1 , wherein each of the first LED chip, the second LED chip and the third LED chip includes epilayer structure, the epilayer structure including a light transmission substrate, a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer.

6. A micro LED module to claim 1 , wherein the plurality of electrode patterns are disposed in a matrix on the substrate and have the same height as a whole.

7. A micro LED module to claim 1 , wherein the common electrode pad includes two recesses depressed inwardly and a first branch, a second branch and a third branch defined by the two recesses.

8. A micro LED module to claim 1 , wherein the substrate is of a flexible type or a rigid type with a flat surface.

9. A micro LED module to claim 1 , wherein the first LED chip has a 1st first electrode bonded to the first individual electrode pad and a 1st second electrode bonded to a first branch of the common electrode pad.

10. A micro LED module to claim 1 , wherein the second LED chip has a 2nd first electrode bonded to the second individual electrode pad and a 2nd second electrode bonded to a second branch of the common electrode pad.

11. A micro LED module to claim 1 , The third LED chip has a 3rd first electrode bonded to the third individual electrode pad and a 3rd second electrode bonded to a third branch of the common electrode pad.

12. A micro LED module comprising:
a substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad; and
a plurality of LED chip groups, each of which includes LED chips, the LED chips including a first LED chip flip bonded to the first individual electrode pad and the common electrode pad, the second LED chip flip bonded to the second individual electrode pad and the common electrode pad, and the third LED chip flip bonded to the third individual electrode pad and the common electrode pad,
wherein the first LED chip has a 1st first electrode bonded to the first individual electrode pad and a 1st second electrode bonded to the common electrode pad, the second LED chip has a 2nd first electrode bonded to the second individual electrode pad and a 2nd second electrode bonded to the common electrode pad, and the third LED chip has a 3rd first electrode bonded to the third individual electrode pad and a 3rd second electrode bonded to the common electrode pad, the height of the 1st first electrode is identical to that of 2nd first electrode and 3rd first electrode, the height of the 1st second electrode is identical to that of 2nd second electrode and 3rd second electrode.

13. A micro LED module to claim 12 , further comprising a 1st first bump formed on the first individual electrode pad, a 2nd first bump formed on the second individual electrode pad, a 3rd first bump formed on the third individual electrode pad, a 2nd first bump formed on a first branch of the common electrode pad, a 2nd second bump formed on a second branch of the common electrode pad, and a 3rd second bump formed on a third branch of the common electrode pad.

14. A micro LED module to claim 13 , wherein the 1st first bump, the 2nd first bump, and the 3rd first bump have bonding areas corresponding to 50-80% of the upper surface areas of the first individual electrode pad, the second individual electrode pad, and the third individual electrode pad, respectively.

15. A micro LED module to claim 13 , wherein the 1st second bump, the 2nd second bump, and the 3rd second bump have bonding areas corresponding to 50-80% of the upper surface areas of the first branch, the second branch, and the third branch, respectively.

16. A micro LED module comprising:
a substrate;
a plurality of electrode patterns formed on the substrate, each of which includes a first individual electrode pad, a second individual electrode pad, a third individual electrode pad, and a common electrode pad;
a plurality of LED chip groups, each of which includes LED chips, the LED chips including a first LED chip flip bonded to the first individual electrode pad and the common electrode pad, the second LED chip flip bonded to the second individual electrode pad and the common electrode pad, and the third LED chip flip bonded to the third individual electrode pad and the common electrode pad; and
a barrier formed on the substrate,
wherein the barrier includes first light reflective walls formed between the first LED chips and the second LED chips and between the second LED chips and third LED chip, and second light reflective walls formed between the LED chip groups adjacent to each other in the lengthwise direction and between the LED chip groups adjacent to each other in the widthwise direction.

17. A micro LED module to claim 16 , wherein the first light reflective walls prevent the interference of light from the adjacent LED chips in each LED chip group, and the second light reflective walls prevent the interference of light from the adjacent LED chips of the adjacent LED chip groups.

18. A micro LED module to claim 16 , the common electrode pad includes two recesses depressed inwardly and a first branch, a second branch and a third branch defined by the two recesses.

19. A micro LED module to claim 16 , wherein the substrate is of a flexible type or a rigid type with a flat surface.

Assignees

• Lumens Co Ltd

Inventors

• Yoo Taekyung
• Kim Daewon
• Kim Jinmo
• Choi Jinwon
• Her Jimin
• Shin Younghwan
• Han Sol
• Lee Kyujin

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/07234

  Using a reflow oven · CPC title