Cathodic debonding prevention method and apparatus

Patent metadata

Field	Value
Publication number	US-10465298-B1
Application number	US-201816137698-A
Country	US
Kind code	B1
Filing date	Sep 21, 2018
Priority date	Sep 21, 2018
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

A method for improving service life in a connector for joining to a cathodically protected platform includes providing a metallic connector for joining to a cable. A non-conductive coating is provided on the connector proximate the cable. A hydroxide ion diffusion distance is determined that will insure dilution of hydroxide ions to a level that will prevent damage to an encapsulant and non-conductive coating bond on the connector. A polymer encapsulant is molded around the non-conductive coating and the cable to seal the assembled cable in the connector such that the encapsulant and non-conductive coating bond is formed at a greater path distance than the determined hydroxide ion diffusion distance from any hydroxide ion source.

First claim

What is claimed is:

1. A method for improving service life in a connector for joining to a cathodically protected platform comprising the steps of:
providing a cable;
providing a metallic connector having a non-conductive coating on a portion thereof wherein exposed cathodically protected portions of the metallic connector are hydroxide ion sources;
assembling the cable in the metallic connector;
determining a hydroxide ion diffusion distance away from the exposed cathodically protected portions of the metallic connector as the distance that will dilute hydroxide ions for reducing cathodic delamination; and
molding a polymer encapsulant around the cable and the non-conductive coating on the metallic connector forming a polymer encapsulant and non-conductive coating bond therebetween to seal the assembled cable in the metallic connector such that the polymer encapsulant and non-conductive coating bond is formed at a greater distance than the determined hydroxide ion diffusion distance from exposed cathodically protected portions of the metallic connector;
wherein the step of providing a metallic connector having a non-conductive coating further comprises providing a raised region around the metallic connector underneath the non-conductive coating proximate exposed cathodically protected portions of the metallic connector such that the raised region in combination with the non-conductive coating and the distance between the exposed cathodically protected portions of the metallic connector and the polymer encapsulant and non-conductive coating bond is at least the determined hydroxide ion diffusion distance.

2. A method for improving service life in a connector for joining to a cathodically protected platform comprising the steps of:
providing a cable;
providing a metallic connector having a non-conductive coating on a portion thereof wherein exposed cathodically protected portions of the metallic connector are hydroxide ion sources;
providing a non-conductive ring around the metallic connector and the non-conductive coating and sealed there against between exposed cathodically protected portions of the metallic connector and the encapsulant mounting portion;
assembling the cable in the metallic connector;
determining a hydroxide ion diffusion distance away from the exposed cathodically protected portions of the metallic connector as the distance that will dilute hydroxide ions for reducing cathodic delamination; and
molding a polymer encapsulant around the cable and the non-conductive coating on the metallic connector forming a polymer encapsulant and non-conductive coating bond therebetween to seal the assembled cable in the metallic connector such that the polymer encapsulant and non-conductive coating bond is formed at a greater distance than the determined hydroxide ion diffusion distance from exposed cathodically protected portions of the metallic connector.

3. The method of claim 2 wherein the non-conductive zing is provided on the non-conductive coating by heat shrink fitting.

4. The method of claim 2 wherein the non-conductive ring is made from an elastomeric material, and the non-conductive ring is provided on the non-conductive coating by elastically expanding the ring and allowing the ring to contract around the non-conductive coating.

5. The method of claim 2 wherein the determined hydroxide ion diffusion distance is at least about 0.5 inches.

6. A delamination resistant marine connector for joining an existing cable to a cathodically protected outlet comprising:
a metallic connector body having a terminal portion connecting to the cathodically protected outlet and a back shell portion capable of receiving the existing cable therein;
a non-conductive coating disposed on said metallic connector body back shell portion, other metallic portions of said metallic connector body remaining exposed; and
an encapsulant molded around said non-conductive coating and the existing cable and bonded thereto such that said encapsulant is molded a distance from the other metallic portions of said metallic connector body remaining exposed to prevent concentrated hydroxide ions from eroding the bonded region between said encapsulant and said non-conductive coating;
wherein said metallic connector body back shell portion has a flange formed there around and coated by said non-conductive coating, the flange being provided to increase the distance between said encapsulant and the other metallic portions of said metallic connector body remaining exposed.

7. The apparatus of claim 6 wherein said encapsulant is molded around said non-conductive coating and said metallic connector body back shell portion at least 0.5 inches from the other metallic portions of staid metallic connector body remaining exposed.

8. A delamination resistant marine connector for joining an existing cable to a cathodically protected outlet comprising:
a metallic connector body having a terminal portion connecting to the cathodically protected outlet and a back shell portion capable of receiving the existing cable therein;
a non-conductive coating disposed on said metallic connector body back shell portion, other metallic portions of said metallic connector body remaining exposed;
an anti-diffusion collar made from a non-conductive material and sealed against said non-conductive coating on said metallic connector body back shell portion between said encapsulant and the other metallic portions of said metallic connector body remaining exposed; and
an encapsulant molded around said non-conductive coating and the existing cable and bonded thereto such that said encapsulant is molded a distance from the other metallic portions of said metallic connector body remaining exposed to prevent concentrated hydroxide ions from eroding the bonded region between said encapsulant and said non-conductive coating.

9. The apparatus of claim 8 wherein said encapsulant is molded around said non-conductive coating and said metallic connector body back shell portion at least 0.5 inches from the other metallic portions of said metallic connector body remaining exposed.

Assignees

• Us Navy

Inventors

• Ramotowski Thomas S

Classifications

• C23F2213/31

  Immersed structures, e.g. submarine structures · CPC title

• H01R13/523

  for use under water · CPC title

• H01R13/5205

  Sealing means between cable and housing, e.g. grommet (H01R13/5221 takes precedence) · CPC title

• C23F13/16 Primary

  Electrodes characterised by the combination of the structure and the material · CPC title

• C23F13/20 Primary

  Conducting electric current to electrodes · CPC title