Corrosion Protection System and Method for Use with Electrical Contacts

Patent metadata

Field	Value
Publication number	US-2018097325-A1
Application number	US-201615284112-A
Country	US
Kind code	A1
Filing date	Oct 3, 2016
Priority date	Oct 3, 2016
Publication date	Apr 5, 2018
Grant date	—

Abstract

A method for inhibiting corrosion in metal components such as electrical contacts, comprising providing a component, wherein the component includes a first metal layer; a second metal layer deposited on the first metal layer; at least one additional metal layer deposited on the second metal layer; and an electrically active contact region on the uppermost layer of the at least one additional metal layer; and forming a defect in the component in at least one predetermined location around the electrically active contact region, wherein the defect passes through the at least one additional metal layer to expose the second metal layer, through the at least one additional metal layer and second metal layer to expose the first metal layer, or a combination thereof.

First claim

What is claimed is:

1 . A method for inhibiting corrosion in metal components, comprising:
(a) providing a component, wherein the component includes:
(i) a first metal layer;
(ii) a second metal layer deposited on the first metal layer;
(iii) at least one additional metal layer deposited on the second metal layer; and
(iv) an electrically active contact region on the uppermost layer of the at least one additional metal layer; and
(b) forming a defect in the component in at least one predetermined location around the electrically active contact region, wherein the defect passes through the at least one additional metal layer to expose the second metal layer, through the at least one additional metal layer and second metal layer to expose the first metal layer, or a combination thereof.

2 . The method of claim 1 , wherein the first metal layer comprises copper or a copper alloy

3 . The method of claim 1 , wherein the second metal layer comprises nickel.

4 . The method of claim 1 , wherein the at least one additional metal layer comprises a precious metal.

5 . The method of claim 1 , wherein the defect is formed using a focused ion beam.

6 . The method of claim 1 , further comprising a plurality of defects, wherein the plurality of defects includes (a) a single line of individual defects formed partially or completely around the electrically active contact region, or (b) an array of individual defects formed partially or completely around the electrically active contact region.

7 . The method of claim 1 , wherein the defect includes a single continuous defect formed partially or completely around the electrically active contact region.

8 . A method for inhibiting corrosion in electrical components, comprising:
(a) providing an electrical component, wherein the electrical component includes:
(i) a first metal layer;
(ii) a second metal layer deposited on the first metal layer;
(iii) at least one additional metal layer deposited on the second metal layer;
(iv) an electrically active contact region on the uppermost layer of the at least one additional metal layer; and
(v) a lead-in region on the uppermost metal layer in proximity to the electrically active contact region;
(b) forming at least one channel at a predetermined location around the electrically active contact region and lead-in region, wherein the at least one channel passes through the at least one additional metal layer to expose the second metal layer; and (c) forming a defect in the component in at least one predetermined location around the at least one channel, wherein the defect passes through the at least one additional metal layer to expose the second metal layer, through the at least one additional metal layer and second metal layer to expose the first metal layer, or a combination thereof.

9 . The method of claim 8 , wherein the first metal layer comprises copper or a copper alloy.

10 . The method of claim 8 , wherein the second metal layer comprises nickel.

11 . The method of claim 8 , wherein the at least one metal layer comprises a precious metal.

12 . The method of claim 8 , wherein the defect is formed using a focused ion beam.

13 . The method of claim 8 , further comprising a plurality of defects, wherein the plurality of defects includes (a) a single line of individual defects formed partially or completely around the electrically active contact region and lead-in region, or (b) an array of individual defects formed partially or completely around the electrically active contact region and lead-in region.

14 . The method of claim 8 , wherein the defect includes a single continuous defect formed partially or completely around the electrically active contact region.

15 . A method for inhibiting corrosion in metal components, comprising:
(a) providing a component, wherein the component includes an electrically active contact region; and (b) forming at least one defect on the component in at least one predetermined location around the electrically active contact region, wherein the defect includes at least one sacrificial material deposited on the component.

16 . The method of claim 15 , wherein the electrically active contact region further includes a precious metal.

17 . The method of claim 15 , wherein the sacrificial material is copper, silver, zinc, or a combination thereof.

18 . The method of claim 15 , further comprising a plurality of defects, wherein the plurality of defects includes (a) a single line of individual defects formed partially or completely around the electrically active contact region, or (b) an array of individual defects formed partially or completely around the electrically active contact region.

19 . The method of claim 15 , wherein the defect includes a single continuous defect formed partially or completely around the electrically active contact region.

20 . The method of claim 15 , wherein the defect is formed using predetermined plating techniques, e-beam deposition, ink-jetting, or a combination thereof.

21 . The method of claim 18 , further comprising depositing at least one strip of sacrificial material between the electrically active contact region and the plurality of defects.

22 . The method of claim 21 , wherein the at least one strip of sacrificial material is formed using predetermined plating techniques, e-beam deposition, ink-jetting, or a combination thereof.

Assignees

• Tyco Electronics Corp

Inventors

• Martens Rodney Ivan
• Bayes Martin William
• Pascucci Vincent Corona
• Shreffler Daniel Briner
• Leibold Kevin Ray

Classifications

• C23C18/42

  Coating with noble metals · CPC title

• H01R13/03

  characterised by the material, e.g. plating, or coating materials · CPC title

• C25D3/22

  of zinc · CPC title

• C25D3/46

  of silver · CPC title

• H01R43/002 Primary

  Maintenance of line connectors, e.g. cleaning · CPC title